JPH054478U - Semiconductor chip - Google Patents

Abstract

(57) [Summary] [Purpose] To reduce the complexity and complexity of the semiconductor chip determination process. [Structure] On a semiconductor chip 1, a discriminating aluminum forming portion 2 that can be blown by applying an electric current is provided. The forming portion 2 is composed of a pair of electrodes and a wiring connecting the electrodes,
The defective product can be identified by fusing the wiring.

Description

[Detailed description of the device]

[0001]

[Industrial applications]

 The present invention relates to a semiconductor chip, and more particularly to a semiconductor chip that can easily identify whether the semiconductor chip is good or bad.

[0002]

[Prior Art]

 At the wafer stage, the semiconductor chip is judged as good or bad by an IC tester, a prober, or a probe card, and if any defect is marked for some kind of discrimination, it is sent to the next step. Ink is generally used as a method for determining this defect, but other than this, for example, a method using a heat-sensitive resin as disclosed in JP-A 1-21936 or JP-A 1-218037 is disclosed. As described above, a discrimination method using a photo resist is also adopted.

[0003]

[Problems to be solved by the device]

 However, the conventional defective marking method as described above has the following problems. In the ink method, it is necessary to determine whether the product is good or bad and then apply the ink directly to the semiconductor chip as a mark for the defective product. Therefore, a step of marking ink on a specific position with a specific size is added to the semiconductor chip after the inspection step. In addition, it is necessary to change the ink diameter and make fine adjustments to the ink position depending on the chip size. Further, since the non-uniformity of the ink thickness is likely to occur, there is a problem that an ink drying step and an ink marking inspection step are required.

On the other hand, the thermosensitive resin method is a method of radiating infrared rays to discolor the thermosensitive resin. Therefore, this method has the drawback that semiconductor chips cannot be inspected at high temperatures. Further, the photoresist method has a problem that the inspection process is complicated because it requires processes such as exposure and development. Then, there is a drawback that it is necessary to incorporate these steps in consideration of selection of illumination in the exposure step and influence on adjacent semiconductor chips.

The present invention has been proposed in order to solve the above-mentioned drawbacks of the prior art, and an object thereof is a semiconductor that does not require a special process and can easily discriminate between good and defective. To provide a tip.

[0006]

[Means for Solving the Problems]

 In order to achieve the above object, the gist of the present invention is to provide a discrimination conductive pattern that can be blown by applying an electric current to a part of the surface of a semiconductor chip.

[0007]

[Action]

 With the above configuration, for a semiconductor chip which is determined to be defective by the inspection of an IC tester or the like, an overcurrent is supplied to the conductive pattern portion for determination, and the wiring is blown, so that the wiring between the electrodes is reduced. A defect can be identified by the resistance value.

[0008]

【Example】

 Hereinafter, an embodiment of the present invention will be specifically described with reference to FIGS. 1 and 2. In this embodiment, as shown in FIG. 1A, a discrimination aluminum forming portion 2 is provided on a semiconductor chip 1, and the forming portion is composed of a pair of electrodes and a wiring connecting the electrodes. As shown in FIG. 2, a normal semiconductor chip is normally judged by the IC tester 5, the prober 4, and the probe card 3. The same method was used also in this example. When it is determined to be defective by the above method, the power supply unit 5a of the IC tester 5 supplies a current to the determination aluminum forming unit 2 through the first probe 3a and the second probe 3b, so that the wiring of the aluminum forming unit 2 is changed. It was fused and the resistance value was made infinite. As a result, in the next step, the resistance value of the aluminum forming portion 2 was measured, and when the resistance value was infinite, it was judged to be unacceptable and when the resistance value was low, it was treated as a good product. Further, since the aluminum forming portion 2 does not directly affect the characteristics of the semiconductor chip 1, it can be re-measured.

Further, the aluminum forming portion 2 may be made of a material other than aluminum, as long as it can be discriminated in the next step.

[0010]

[Effect of the device]

 As described above, according to the present invention, the IC tester, the prober, and the probe card can be used for easy discrimination without using the complicated processes such as the conventional ink, heat-sensitive resin, and photoresist. In addition, since the wiring part is fused at the same time as the inspection, there is no false marking of good or bad. Since the defective product is electrically judged, it is possible to provide a semiconductor chip having higher reliability than the conventional method.

[Brief description of drawings]

FIG. 1 is a top view of a semiconductor chip according to the present invention, FIG.
Is a diagram showing a state before determination, and FIG. 1B is a diagram showing a state after defect determination.

FIG. 2 is a schematic diagram showing a good / defective determination method using a conventionally used IC tester, prober, and probe card.

[Explanation of symbols]

 1 semiconductor chip 2 aluminum forming part 3 probe card 3a first probe 3b second probe 3c third probe 4 prober 5 IC tester 5a power supply part

Claims (1)

[Claims for utility model registration] [Claim 1] A conductive pattern for discrimination is provided on a part of the surface of a semiconductor chip, which can be blown by applying an electric current, and a resistance value of the pattern portion can identify a good product or a defective product. And semiconductor chips.