JP2933044B2 - Semiconductor device and marking method thereof - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor device and a marking method thereof, and more particularly to a semiconductor device for performing ink marking on a semiconductor pellet and a marking method thereof.

[0002]

2. Description of the Related Art In recent years, with the rapid spread of facsimile machines and image scanners, a solid-state imaging device (Charge Coupled Device) used in an image input section of these facsimile machines and image scanners has been described.
Demand for CCD) is increasing. This C
In the CD, a photodiode is formed on a silicon wafer, and an output unit generates and outputs an analog image signal corresponding to an image input to the image input unit. In the case of a CCD, as shown in an example in FIG. 3, due to the fineness of the semiconductor pellet 1 of the CCD, a process slightly different from that of other silicon devices is adopted as a manufacturing process thereof. ing. That is, C
In a method of manufacturing a CD, in a pellet stage formed on a wafer at first, a probe is applied to a pad formed on each semiconductor pellet to evaluate an electric characteristic and an optical characteristic of the CCD. ing. And
For defective semiconductor pellets that do not satisfy the evaluation criteria, a method of applying ink marking on the surface is used. As shown in FIG. 3 (a), a position near the center of the semiconductor pellet 1 is selected as a position where the ink marking is applied, and an ink printing point 4 is applied to the position. FIG. 3 (a)
1 also shows a pellet recognition mark 2 on a semiconductor pellet 1 and an on-chip color filter 3. Then, in the next wafer dicing step, wafer dicing is performed to separate individual semiconductor pellets, and only good semiconductor pellets are selected. In the step of automatically mounting the non-defective semiconductor pallets on the package, the non-defective semiconductor pellets are determined to be non-defective according to the operation procedure shown in FIG.

As described above, in the CCD, it is necessary to provide the pellet recognition mark 2 on the semiconductor pellet 1 as shown in FIG. 3 because of the fineness of the semiconductor pellet. The shown pellet recognition marks 2 are arranged and formed at both ends of the semiconductor pellet 1. In the non-defective judgment in the process of automatically mounting the semiconductor pellet 1 on the package, as shown in the operation procedure of FIG.
A search is made for a pellet recognition mark 2 formed at both ends of the semiconductor pellet 1. If the pellet recognition mark 2 is present, in step 42, the semiconductor pellet 1 is recognized as a formed pellet. A search is performed to determine whether or not there is an ink dot at the center of the semiconductor pellet 1. If the pellet recognition mark 2 does not exist in step 41, it is determined that the pellet is an unformed pellet, and the operation proceeds to the next semiconductor pellet. If there is no ink spot 4 at the center of the semiconductor pellet 1 in step 42, the semiconductor pellet 1 is determined to be a good semiconductor pellet, and the semiconductor pellet 1 is automatically mounted on a package. If the ink spot 4 is present in the center of the semiconductor pellet 1 in step 42, the semiconductor pellet 1 is determined to be a defective semiconductor pellet, and in step 45, the operation is performed for the next semiconductor pellet. Migrate.

In another conventional semiconductor device,
As a means for preventing a defective chip from being mounted too much, as shown in FIG. 3B, the semiconductor pellet 1 is not overlapped with the on-chip color filter 3 in the scribe line direction at the upper central corner of the semiconductor pellet 1. A method of marking the ink spots 4 is used. In the case of this semiconductor device, it is intended to distinguish the marking from the base by using the uncovered portion of the on-chip color filter 3 and prevent the defective pellet from slipping through. As a conventional marking method for a semiconductor device, for example, as disclosed in Japanese Patent Application Laid-Open No. Hei 5-74881, a method is known in which ink is spotted in a prober. This method is different from the method of hitting.

[0005]

SUMMARY OF THE INVENTION In the above-described conventional semiconductor device and the marking method therefor, in the semiconductor chip, a color filter in which a color filter is on-chip on a semiconductor pellet is used.
In the case of a semiconductor device such as a CD, since ink spots are formed on the color filter, when determining whether the semiconductor pellet is good or defective in the automatic mounting process, the base color filter and the marking are used. Is difficult to distinguish. For example, as a method of detecting an ink mark, a method of changing the illumination direction, or a method of detecting the brightness of the semiconductor chip surface and the ink mark by a binarization method or a ternary method, etc., is used to perform ink marking on the color filter. The difference in luminance between the base and the marking in the case is inferior to the difference in luminance between the marking and the base when ink marking is performed on the silicon pellet, and by these methods, the base color filter and the marking are completely completed. It is difficult to identify, and in some cases, there is a disadvantage that an accident that a defective pellet is erroneously recognized as a good pellet and mounted is likely to occur.

As shown in FIG. 3B, as a means for preventing a semiconductor chip of a semiconductor device from being mounted on a defective chip, a scribe line direction at a central upper corner of the semiconductor pellet 1 is used. When marking on, it is necessary to increase the marking size in order to improve the identification of ink marks, but for that, it is necessary to separately secure a large space for ink marking, As a result, the size of the semiconductor chip is increased, which results in a regression to the high integration of the semiconductor device, and there is a drawback that the prevention means cannot be adapted to the current state.

An object of the present invention is to solve the drawbacks caused by the above-described ink marking method, and to provide a semiconductor device and a marking method thereof capable of accurately discriminating good and defective semiconductor pellets in an automatic mounting process. To provide.

[0008]

A first feature of the present invention is as follows.
In a semiconductor device which is the semiconductor pellet after a characteristic check including an electrical characteristic of the semiconductor pellet in a semiconductor wafer stage in which a plurality of semiconductor pellets are formed.
And formed at one end of the semiconductor pellet and
Ink spotting and coating determined to be defective by the characteristic check
This is a semiconductor device having a recognition mark to be crushed .

A second feature is that an on-chip filter is provided.
A semiconductor which is a semiconductor pellet after a characteristic check including an electrical characteristic of the semiconductor pellet in a semiconductor wafer stage in which a plurality of semiconductor pellets covered with the semiconductor pellet are formed;
The apparatus wherein the on-chip filter is covered
If the on-chip at one end of the semiconductor pellet is not
Formed in the dent and
A semiconductor device having a recognition mark to be filled with ink spots determined to be defective .

Furthermore, the third feature, the semiconductor pellet paired vertebral tank RBI semiconductor device in a semiconductor wafer stages
To the marking method of a semiconductor device, wherein the semiconductor characteristics checked first determining the quality of the semiconductor pellet including electrical properties of the pellets, the first
Semiconductor pellet determined to be defective in step
The recognition formed on one end of the semiconductor pellet
Recognize the recognition mark by filling the mark with ink dots
Semiconductor device including a second step of preventing
This is a marking method.

[0011]

Next, the present invention will be described with reference to the drawings.

FIG. 1A is a plan view showing a semiconductor pellet according to a first embodiment of the semiconductor device of the present invention. FIG.
3A shows the arrangement of the pellet recognition mark 2, the on-chip color filter 3, and the ink spot 4 on the semiconductor pellet 1. FIG. Color CCD
In the manufacturing process, in the step of evaluating the electrical characteristics and the optical characteristics of the semiconductor pellet formed on the wafer, a probe is applied to a pad portion formed on the semiconductor pellet in each evaluation step, and the characteristic is evaluated. A check is made,
Thereafter, an ink mark is formed on the surface of the defective pellet that does not satisfy the evaluation criteria. As shown in FIG. 1A, the position of the ink marking point at that time is set on the pellet recognition mark 2 arranged at the end of the pellet of the semiconductor pellet 1. And
In the wafer dicing process, a predetermined wafer is diced to separate individual semiconductor pellets. Then, only good semiconductor pellets are selected,
In the step of automatically mounting the package, non-defective products are determined by the operation procedure as shown in FIG.

Referring to FIG. 2, first, at step 21, an automatic discrimination sensor searches for the pellet recognition marks 2 disposed at both ends of the semiconductor pellet 1, and at step 21, the pellet recognition marks 2 are present. In this case, in step 22, the semiconductor pellet 1 is determined to be a good semiconductor pellet, and the semiconductor pellet 1 is automatically mounted on a package. Further, as shown in FIG. 1A, when the pellet recognition mark 2 is covered by the ink spots 4, the pellet recognition mark 2 cannot be confirmed. The pellet recognition mark 2 is not searched for by the discrimination sensor. In this case, in step 23, the semiconductor pellet 1 is determined to be a defective pellet, and the process proceeds to the next semiconductor pellet quality determination operation. By performing the determination operation in this manner, compared to the marking method of the conventional example shown in FIG. 4 described above, the procedure of determining whether or not there is an ink spot by moving to the center of the semiconductor pellet is omitted. Therefore, the number of steps in the marking process is reduced.

Next, a second embodiment of the present invention will be described. FIG. 1B is a plan view showing a semiconductor pellet according to the second embodiment. FIG. 1B shows the arrangement of the pellet recognition mark 2, the on-chip color filter 3, and the ink spot 4 on the semiconductor pellet 1. In the present embodiment, the arrangement of the pellet recognition mark 2 is shown. The peripheral portion is covered with the on-chip color filter 3. In such an arrangement,
The peripheral portion of the pellet recognition mark 2 is formed to have a concave step with the on-chip color filter 3. In a semiconductor device forming a one-dimensional CCD,
After performing a property check to evaluate the electrical and optical properties of the semiconductor pellets formed on the wafer, defective pellets that do not meet the evaluation criteria are ink-marked on the surface. In FIG. 3, the positions for ink marking are shown in FIG.
As shown in (a), while on the on-chip color filter 3 is selected, in the present invention,
For the defective pellet, ink marking is performed in the vicinity of the pellet recognition mark 2. At this time, as shown in FIG. 1C, the pellet recognition mark 2 is covered with the ink spots 4, so that the semiconductor pellet can be extremely easily and clearly defective. And the process proceeds to the pass / fail judgment procedure for the next semiconductor pellet. In this case, since the pellet recognition mark in the semiconductor device forming the conventional one-dimensional CCD is present near the scribe line with the miniaturization of the semiconductor pellet, the size of the marking in mass production is small. Although the ink mark tends to flow out on the scribe line due to variations in the size, the on-chip color filter 3 has a concave step with the peripheral portion of the pellet recognition mark 2 in the present embodiment. The situation in which the ink mark leaks onto the scribe line is prevented beforehand.

When an operator selects a position of an ink mark for a semiconductor device / pellet at a semiconductor wafer stage, the ink spot 4 on the pellet recognition mark 2 covers the pellet recognition mark 2. Therefore, it is possible to easily confirm the quality of the ink marking position setting, and it is also possible to realize an efficient marking position setting operation.

[0016]

As described above, the present invention is applicable to a semiconductor device formed as a solid-state image pickup device having a color filter on-chip, and is applicable to a defective semiconductor pellet in the semiconductor device. By applying the marking method of printing ink on the pellet recognition mark of the semiconductor pellet, it is possible to determine the defective pellet without misidentification when determining whether the semiconductor pellet is good or bad in the automatic mounting process. There is an effect that it becomes possible.

[0017] Further, by the on-chip filter,
By covering the portion other than the pellet recognition mark portion in a concave shape, the ink mark is prevented from flowing out onto the scribe line, and the quality of the ink marking setting position is checked when the operator performs the ink marking spot. Has an effect that confirmation of the information can be easily and reliably performed.

[Brief description of the drawings]

FIG. 1 is a plan view showing semiconductor pellets according to first and second embodiments of the present invention.

FIG. 2 is a diagram showing a procedure for determining the quality of a semiconductor pellet in the embodiment.

FIG. 3 is a plan view showing a conventional semiconductor pellet.

FIG. 4 is a view showing a procedure for determining the quality of a semiconductor pellet in the conventional example.

[Explanation of symbols]

 1 semiconductor pellet 2 pellet recognition mark 3 on-chip color filter 4 ink spot

Claims (3)

(57) [Claims] In a semiconductor device which is a semiconductor pellet after a characteristic check including an electric characteristic of the semiconductor pellet in a semiconductor wafer stage in which a plurality of semiconductor pellets are formed, a pellet formed at one end of the semiconductor pellet is recognized. Ink spots which are determined to be defective by the characteristic check are formed on the marks, and the pellet recognition mark is formed.
A semiconductor device characterized in that no peaks can be confirmed . 2. The semiconductor device, which is the semiconductor pellet after a characteristic check including an electrical characteristic of the semiconductor pellet at a semiconductor wafer stage in which a plurality of semiconductor pellets covered with an on-chip color filter are formed, wherein the on-chip color A pellet recognition mark formed in a recess formed by removing the on-chip color filter at one end of the semiconductor pellet in which the filter is covered;
Failure and determines the ink dotting by the characteristic checking on
And the pellet recognition mark cannot be confirmed . 3. A method for marking a semiconductor device in which a semiconductor pellet of a semiconductor device is ink-printed on a semiconductor wafer at a semiconductor wafer stage, wherein a first step of checking characteristics including the electrical characteristics of the semiconductor pellet to determine pass / fail of the semiconductor pellet. In the first step, the semiconductor pellet determined to be defective is placed on a pellet recognition mark formed at one end of the semiconductor pellet.
A method of marking a semiconductor device, the method further comprising: forming an ink strike on the substrate so that the pellet recognition mark cannot be recognized.