JPH0595034A - Semiconductor manufacturing equipment - Google Patents

Abstract

PURPOSE:To remove a semiconductor chip contour recognition mistake due to scattering of a wafer surface condition or a contour recognition mistake due to halation by patterns having partially a high light-reflectivity in a semiconductor manufacturing equipment of taking out the semiconductor chips one by one from the wafer which is pasted to an adhesive tape and which is fully cut an a basis of one semiconductor chip. CONSTITUTION:When a bad mark of a semiconductor chip 1 is detected, an illumination 2 is applied only from the upper surface of the semiconductor chip 1, and when an contour of the semiconductor chip 1 is recognized, the illumination 2 is applied only from the lower surface of the semiconductor chip 1, whereby the contour of the semiconductor chip can stably be recognized without being completely influenced by scattering of a wafer surface condition or partial patterns having a high light-reflectivity when the contour of the semiconductor chip 1 is recognized.

Description

Detailed Description of the Invention

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a semiconductor manufacturing apparatus for taking out the semiconductor chips one by one from a wafer attached to an adhesive tape cut into semiconductor chips.

[0002]

2. Description of the Related Art Conventionally, as shown in FIG. 3, an illumination 2 is applied from the upper surface of a wafer, and a camera 3 for image recognition receives reflected light.

[0003]

However, in the case of recognizing the outer shape of the semiconductor chip 1 by the reflected light and confirming cracks or cracks,
Halation may occur if the surface condition of the semiconductor chip 1 slightly changes depending on the wafer and the reflected light level changes, and if there is a pattern with high light reflectance around the recognized semiconductor chip even within the same wafer. However, there is a problem that the outer shape of the semiconductor chip 1 cannot be detected.

Therefore, in order to solve such a conventional problem, the present invention applies a light from the lower surface of the wafer to the transmitted light to the camera 3 for image recognition when detecting the outer shape of the semiconductor chip. The purpose is to reliably recognize the outer shape of the semiconductor chip 1 without affecting the variations in the chip surface state.

[0005]

In order to solve the above-mentioned problems, a semiconductor manufacturing apparatus of the present invention takes out the semiconductor chips one by one from a wafer attached to an adhesive tape cut into semiconductor chips. In semiconductor manufacturing equipment,
Illumination for image recognition of the semiconductor chip is applied not only from the upper surface of the wafer but also from the lower surface.

[0006]

Embodiments of the present invention will be described below with reference to the drawings.

In FIG. 1, the semiconductor chip 1 is attached to an adhesive tape 5 and cut into full cuts in units of one semiconductor chip. A camera 3 and an illumination 2 are installed to obtain information on the presence or absence of a bat mark for determining whether the electrical characteristic test result of the semiconductor chip 1 is a good product or a defective product, external shape information of the semiconductor chip 1, and the like. Illumination 2 is semiconductor chip 1
The semiconductor chip 1 so that it can be applied from above and below
It is installed both above and below. The push-up holder 7 is made of a material that transmits light.

When the semiconductor chip 1 is non-defective, the push-up pin 4 breaks through the adhesive tape 5 and lifts the semiconductor chip 1, and the collet 6 vacuum-sucks the semiconductor chip to make a die-attach to a lead frame or a mounting board, or the semiconductor chip. Transfer to storage tray.

Here, when identifying the presence or absence of a butt mark on the semiconductor chip 1, the illumination 2 from the lower surface of the semiconductor chip 1 is erased and only the upper surface is illuminated and reflected from the reflected light. When light is applied from the illumination 2 at the same time as the lower surface, the surface of the semiconductor chip 1 becomes dark and the bat mark cannot be recognized.

In the case of recognizing the outer shape of the semiconductor chip 1 to confirm that there is no chipping or cracking, the illumination 2 applied from the upper surface of the semiconductor chip 1 is turned off and the illumination 2 is applied only from the lower surface, contrary to the bat mark identification. Information is captured from transmitted light.

With illumination only from the upper surface of the semiconductor chip, the surface condition of the wafer varies depending on the wafer or manufacturing lot, and the level of reflected light changes, and the boundaries between the upper, lower, left, and right semiconductor chips become invisible, resulting in erroneous outline recognition. Or, if there is a pattern with high light reflectance in the peripheral chip of the semiconductor chip that is recognized even within the same wafer, halation will occur and the boundary between the upper, lower, left and right semiconductor chips will be invisible and the outer shape recognition error will occur. There are many cases.

When recognizing the outer shape, by illuminating the lower surface of the semiconductor chip instead of the upper surface as described above, the outer shape of the semiconductor chip can be recognized without affecting the surface condition of the wafer, and recognition errors are eliminated.

FIG. 2 shows another embodiment of the present invention in which the illumination 2 is integrated with the push-up holder 7. The light source 8 is installed separately from the push-up holder 7. The push-up holder 7 is a material that transmits light. In this embodiment, the light of the illumination 2 is applied from directly below the chip, and the outer shape of the semiconductor chip 1 can be detected more reliably. Also, the installation space for lighting is efficient.

[0014]

As described above, the semiconductor manufacturing apparatus of the present invention applies the illumination only from the upper surface of the semiconductor chip when detecting the butt mark of the semiconductor chip, and the lower surface of the semiconductor chip when recognizing the outer shape of the semiconductor chip. By illuminating only from the outside, it is possible to stably recognize the outer shape of the semiconductor chip without affecting the variation of the wafer surface condition and the partial pattern with high light reflectance when recognizing the outer shape of the semiconductor chip. Becomes

[Brief description of drawings]

FIG. 1 is a vertical sectional view showing an embodiment of the present invention.

FIG. 2 is a vertical sectional view showing another embodiment of the present invention.

FIG. 3 is a vertical sectional view showing a conventional semiconductor manufacturing apparatus.

[Explanation of symbols]

 1 semiconductor chip 2 illumination 3 camera 4 push-up pin 5 adhesive tape 6 collet 7 push-up holder 8 light source

Claims (1)

[Claims] 1. In a semiconductor manufacturing apparatus for picking up the semiconductor chips one by one from a wafer attached to an adhesive tape cut into semiconductor chip units, the wafer is illuminated with light for image recognition of the semiconductor chips. A semiconductor manufacturing device characterized in that it can be applied not only from the upper surface but also from the lower surface.