JP2008275415A - Apparatus and method for inspecting surface of metal substrate - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a wiring pattern and plating inspection method and an inspection apparatus capable of simultaneously inspecting wiring patterns and platings without being affected by small variations in plating conditions. <P>SOLUTION: The inspection method and the inspection apparatus for inspecting substrates having metal patterns include: a transfer stage for transferring substrates having surface metal patterns made of plated parts and unplated parts; an imaging stage for imaging the surfaces of the substrates from a direction tiled by 0°-10° from the direction of a normal of the substrates while being synchronized with the transfer of the transfer stage; a first illumination stage for illuminating indirect light of light in a wavelength region in which the difference of reflection intensity between the metal materials of the unplated parts of the substrates and the plating materials of the plated parts is maximum; a second illumination stage for illuminating direct light of light in a wavelength region in which the difference of reflection intensity between the metal materials of the unplated parts of the substrates and the plating materials of the plated parts is maximum; and an image processing and defect determination stage for determining defects through the use of image data of the surfaces of the substrates acquired in the imaging stage. <P>COPYRIGHT: (C)2009,JPO&INPIT

Description

  The present invention relates to a metal substrate surface inspection method and inspection apparatus, and more particularly to a lead frame wiring pattern and plating portion defect inspection method and inspection apparatus.

An example of a substrate having a metal pattern in which the metal pattern is composed of a plated portion and a non-plated portion is a lead frame that is a base material of a semiconductor package. Hereinafter, this lead frame will be described as an example.
In recent years, the packaging technology in the semiconductor technology field is becoming narrower with higher integration and higher functionality of semiconductor devices, and lead frames used in these packages are also becoming more pinned and narrower. Strict quality assurance is required.

  In addition, the lead frame manufacturing method includes a stamping method in which the metal thin plate-like base material is mechanically punched out using an ultra-precision mold, and etching is performed in which the metal is chemically corroded to form a pattern. There is a way.

  The inner lead of a general lead frame is designed to extend so as to spread radially with respect to the center of the die pad. In a semiconductor device using a lead frame, an IC chip is fixed to a die pad, and an electrode pad of the IC chip and a bonding portion at the tip of the inner lead are electrically connected by wire bonding or the like. As IC chips become more multifunctional, the number of electrode pads increases, and with the miniaturization of IC chips, the spacing between electrode pads is becoming narrower. Accordingly, the inner leads of the lead frame to be connected to the electrode pads are also multi-pinned, and the pitch between the inner leads and the inner lead width are various.

  When the pitch between the inner leads and the inner lead width are narrowed, the strength of the inner leads becomes weak, and the inner leads are deformed even by a slight external force. Therefore, in order to prevent contact between the inner leads and the suspension leads that support the die pad and the inner leads, electrical short circuit, deformation of the inner leads, etc., a lead frame with a protective tape applied to the inner leads and suspension lead portions Has been manufactured.

  In the lead frame manufacturing process, a predetermined shape is first formed by etching or stamping a metal thin plate-like substrate. Next, a metal plating such as silver is formed on the tip portion of the inner lead, a protective tape is applied to the inner lead portion, etc., and the tip of the inner lead portion is cut in some cases, and then a downset press is performed.

  FIG. 1 is a schematic plan view of a general lead frame. FIG. 1 schematically shows a case where the lead frame 10 is observed from the surface side. A lead frame 10 manufactured by an etching method or the like has a die pad 11, an inner lead 12, an outer lead 13, a dam bar 14, and a frame portion 15, and a portion where no wiring pattern is formed is called a space portion 19.

  Thereafter, plating 16 for reducing the connection resistance between the semiconductor element and the bonding portion is applied to the inner lead 12. Next, in order to prevent contact between the inner leads and the suspension leads supporting the die pad and the inner leads, electrical short circuit, deformation of the inner leads, etc., a protective tape 17 is applied. As the protective tape 17, a polyimide tape is used in consideration of insulation and the like. Further, a step is formed on the suspension lead 18 by a downset press, and the inner lead tip is cut to remove conduction at the tip of the inner lead 12 in consideration of the loading of semiconductor elements on the die pad 11, and the lead frame is completed.

  The defect items in the final inspection of the lead frame manufactured by the above processes are diverse, such as pattern defects, lead deformation, protective tape defects, plating defects, downset press presence, etc., and product discrimination using automatic inspection machines. necessary.

  However, it is difficult to inspect all defects with a single inspection machine, and in particular, recently, the inspection requirements regarding tape and plating are further increased. The quality of the partial plating applied to the bonding part that is connected to the IC chip is particularly important. As a method for inspecting the plating state using image processing by imaging the plated part with a CCD camera or the like, for example, a patent Document 1 has been proposed.

  Although the technique described in Patent Document 1 can surely obtain the contrast difference between the non-plated portion and the plated portion on the surface of the metal pattern, strictly, the side taper portion of the wiring pattern having a three-dimensional shape is also included. An inspection method for judging whether the plating state including the quality is good or bad is desirable. Further, there has been a demand for an imaging and inspection method that can clearly separate the contrast between the metal surface and the plated portion and can simultaneously perform not only the plated portion but also the state of the metal surface.

  On the other hand, when the surface of the metal plate or the plated surface is observed microscopically, there are rolling flaws and irregularities due to the metal material manufacturing method, and minute brightness and darkness due to these irregularities occurs on the image, and depending on the threshold setting in image processing, it is overdetected It becomes an element, and stable automatic judgment is difficult.

  Therefore, means for imaging the surface of the substrate at an imaging angle of 0 ° to 10 °, illumination means in a wavelength region in which the difference in reflection intensity between the metal material of the non-plated portion and the plating material of the plated portion is maximized, and the solid angle A metal substrate surface inspection method and inspection apparatus using irradiation means for irradiating 2π indirect light have been proposed.

  This inspection method enables imaging of the plating state including the side taper portion of the wiring pattern having a three-dimensional shape, clearly separates the contrast between the metal surface and the plated portion, and also causes a rolling scratch caused by the metal material manufacturing method. It became possible to stabilize the over-detection element due to minute image contrast due to unevenness.

  However, there has been a problem that the plated portion changes in surface condition and composition due to slight fluctuations in manufacturing conditions and the like, and inspection by contrast separation from the metal surface is not stabilized.

The known literature is described below.
JP 2000-171402 A

  The present invention has been devised in view of the above problems, and provides an imaging method suitable for inspecting defects on the surface of a plated metal pattern with high accuracy regardless of slight variations in the manufacturing conditions of plating. In addition, an object of the present invention is to provide a wiring pattern and plating inspection apparatus capable of simultaneously inspecting a wiring pattern and plating in real time with high reliability.

  In order to solve this problem, in claim 1 of the present invention, the surface of the metal pattern of the substrate having the metal pattern is illuminated with illumination, and the wiring pattern defect and In the method of inspecting the surface of a substrate having a metal pattern for simultaneously inspecting plating defects, a transport stage for moving the substrate at a predetermined speed, and a normal direction of the metal pattern to reduce the rolling influence existing on the surface of the metal pattern An imaging stage that is tilted by 0 ° to 10 ° (hereinafter referred to as an imaging angle θ) and is synchronized with the conveyance in the conveyance stage or images the surface of the metal pattern at a predetermined time interval, and a metal with respect to the metal pattern Utilizing the range of wavelengths where the difference in reflection intensity specific to each metal between the metal material of the pattern and the plating material is the largest, the material of the metal substrate and the plating material And a first illumination stage by a first illumination means having a dome illumination for illuminating indirect light, and each metal of the metal material of the metal pattern and the plating material with respect to the metal pattern A second illuminating step by a second illuminating means for making optical separation between the metal substrate material and the plating material by utilizing the wavelength range in which the difference in intrinsic reflection intensity is greatest, and direct light irradiation; An image processing step of extracting and automatically determining a defective portion existing on the surface of the metal pattern using image data obtained by photographing the surface of the metal pattern at the imaging stage, and a substrate having a metal pattern Inspection method.

  This inspection method enables imaging of the plating state including the side taper part of the wiring pattern having a three-dimensional shape, clearly separates the contrast between the metal surface and the plating part, and also causes a rolling scratch caused by the metal material manufacturing method. While maintaining the conventional effect of stabilizing the over-detection element due to minute image light and darkness due to unevenness and unevenness, the second illumination stage made the contrast separation between the metal surface and the plated portion clearer and solved the above problem Is.

  Further, according to claim 2 of the present invention, the metal that simultaneously inspects the wiring pattern defect and the plating defect based on the image data obtained by irradiating the surface of the metal pattern of the substrate having the metal pattern with illumination and picking up the image from above. In the method for inspecting the surface of a substrate having a pattern, the image pickup angle θ is set to 0 ° to 0 ° from the normal direction of the metal pattern in order to reduce the rolling effect existing on the surface of the metal pattern and the conveyance stage for moving the substrate at a predetermined speed. An imaging stage that is tilted by 10 ° and is synchronized with the transport in the transport stage or images the surface of the metal pattern at a predetermined time interval, and each of the metal material of the metal pattern and the plating material with respect to the metal pattern Utilizing the wavelength range where the difference in reflection intensity inherent in metal is the largest, the metal substrate material and the plating material are optically separated, and indirect light irradiation A first illumination stage by a first illumination means having a dome illumination, and an angle range in which a difference in reflection intensity specific to each metal of the metal material of the metal pattern and the plating material is small with respect to the metal pattern Using the image data obtained by photographing the surface of the metal pattern at the imaging stage and the illumination prevention stage by the illumination prevention means that optically separates the metal substrate material and the plating material by using the metal pattern, An inspection method for a substrate having a metal pattern, comprising: an image processing stage that extracts and automatically determines a defective portion existing on the surface of the substrate.

  This inspection method enables imaging of the plating state including the side taper part of the wiring pattern having a three-dimensional shape, clearly separates the contrast between the metal surface and the plating part, and also causes a rolling scratch caused by the metal material manufacturing method. While maintaining the conventional effect of stabilizing the over-detection element due to minute image brightness due to unevenness and unevenness, the illumination separation stage makes the contrast separation between the metal surface and the plated part clearer and solves the above problems is there.

  Further, in claim 3 of the present invention, the front and back surfaces of the metal pattern of the substrate having the metal pattern are illuminated with illumination, and the wiring pattern defect on the surface of the metal pattern is determined based on image data obtained by imaging from above. In a method for inspecting a surface of a substrate having a metal pattern for simultaneously inspecting plating defects, a transfer stage for moving the substrate at a predetermined speed, and an imaging angle θ to reduce the rolling influence existing on the surface of the metal pattern An imaging stage tilted from 0 ° to 10 ° from the normal direction and synchronized with the transport in the transport stage or photographing the surface of the metal pattern at a predetermined time interval, and a metal material of the metal pattern with respect to the metal pattern The optical range between the metal substrate material and the plating material by utilizing the wavelength range in which the difference in reflection intensity specific to each metal is the largest. The first illumination stage by the first illumination means having a dome illumination for separating and illuminating indirect light, and the reflection intensity specific to each of the metal material of the metal pattern and the plating material with respect to the metal pattern A second illumination stage by a second illumination means for optically separating the metal substrate material and the plating material by utilizing the wavelength range in which the difference between them is the largest, and direct light irradiation; Using the image data obtained by photographing the surface of the metal pattern in the third illumination stage by the third illumination means for irradiating the back surface of the metal pattern and in the imaging stage, the defect portion existing on the surface of the metal pattern is detected. An inspection method for a substrate having a metal pattern, comprising an image processing stage for extraction and automatic determination.

  This inspection method enables imaging of the plating state including the side taper part of the wiring pattern having a three-dimensional shape, clearly separates the contrast between the metal surface and the plating part, and also causes a rolling scratch caused by the metal material manufacturing method. While maintaining the conventional effect of stabilizing the over-detection element due to minute image brightness due to unevenness and unevenness, the second illumination stage by the second illumination means makes the contrast separation between the metal surface and the plated portion clearer. The above-mentioned problems can be solved, and the third illumination stage by the third illumination means can detect a defective pattern under the protective tape and lead deformation with high accuracy, which was insufficient in detection power only by the surface illumination means. Defects on the surface of all metal patterns such as pattern defects, lead deformation, protective tape defects, plating defects, downset press presence, etc. Eye can be inspected with a single imaging means, there is an effect that.

  According to claim 4 of the present invention, the surface of the metal pattern of the substrate having the metal pattern is illuminated with illumination, and the wiring pattern defect and the plating defect on the surface of the metal pattern are obtained based on the image data obtained by imaging from above. In the method for inspecting the surface of a substrate having a metal pattern, the imaging stage θ is set to the normal line of the metal pattern in order to reduce the rolling effect existing on the surface of the metal pattern, and the transport stage for moving the substrate at a predetermined speed. An imaging stage that is tilted from 0 ° to 10 ° from the direction and synchronized with the conveyance in the conveyance stage or images the surface of the metal pattern at a predetermined time interval, and the metal material and plating of the metal pattern on the metal pattern Utilizing the wavelength range where the difference in reflection intensity inherent to each metal is the largest, the optical separation between the metal substrate material and the plating material And a difference in reflection intensity specific to each metal of the metal material of the metal pattern and the plating material with respect to the metal pattern, with the first illumination means by the first illumination means having the dome illumination for indirect light irradiation An illumination blocking step by an illumination blocking means for optically separating the material of the metal substrate and the plating material by utilizing a range of angles with a small angle, and a second lighting means for irradiating the back surface of the metal pattern A second illumination stage, and an image processing stage for extracting and automatically determining a defect portion present on the surface of the metal pattern using image data obtained by photographing the surface of the metal pattern in the imaging stage. A method for inspecting a substrate having a metal pattern.

  This inspection method enables imaging of the plating state including the side taper part of the wiring pattern having a three-dimensional shape, clearly separates the contrast between the metal surface and the plating part, and also causes a rolling scratch caused by the metal material manufacturing method. While maintaining the conventional effect of stabilizing the over-detection element due to minute image brightness due to unevenness and unevenness, the illumination separation means makes the contrast separation between the metal surface and the plated part clearer and solves the above problem is there. In addition, the second illumination stage by the second illumination means makes it possible to detect a pattern defect or lead deformation under the protective tape, which was insufficient in detection power with only the surface illumination means, and can detect the pattern defect and lead deformation. There is an effect that it is possible to inspect all defective items on the surface of the metal pattern, such as a protective tape failure, plating failure, presence / absence of downset press, etc. with one imaging means.

  According to claim 5 of the present invention, the surface of the metal pattern of the substrate having the metal pattern is illuminated with illumination, and the wiring pattern defect and the plating defect on the surface of the metal pattern are based on the image data obtained by imaging from above. In the inspection apparatus for the surface of the substrate having the metal pattern, the imaging angle θ is set to the normal line of the metal pattern in order to reduce the rolling influence existing on the surface of the metal pattern and the transport means for moving the substrate at a predetermined speed. An imaging means that is tilted from 0 ° to 10 ° from the direction and is synchronized with the conveying means or images the surface of the metal pattern at a predetermined time interval; and a metal material and a plating material of the metal pattern with respect to the metal pattern By utilizing the range of wavelengths where the difference in reflection intensity inherent to each metal is the largest, the metal substrate material and the plating material are optically separated. Utilizing the first illumination means with dome illumination that emits indirect light, and the wavelength range where the difference in reflection intensity specific to each metal between the metal material of the metal pattern and the plating material with respect to the metal pattern is the largest Then, using the image data obtained by photographing the surface of the metal pattern with the second illuminating means that directly irradiates light with the optical separation between the material of the metal substrate and the plating material, An inspection apparatus for a substrate having a metal pattern, comprising image processing means for extracting and automatically determining a defective portion existing on the surface of the pattern.

  This inspection device enables imaging of the plating state including the side taper portion of the wiring pattern having a three-dimensional shape, clearly separates the contrast between the metal surface and the plating portion, and also causes rolling scratches caused by the metal material manufacturing method. While maintaining the conventional effect of stabilizing the over-detection element due to light and dark minute images due to unevenness and unevenness, the second illumination means made the contrast separation between the metal surface and the plated portion clearer and solved the above problem Is.

  According to claim 6 of the present invention, the surface of the metal pattern of the substrate having the metal pattern is illuminated with illumination, and the wiring pattern defect and the plating defect on the surface of the metal pattern are obtained based on the image data obtained from above. In the inspection apparatus for the surface of the substrate having the metal pattern, the imaging angle θ is set to the normal line of the metal pattern in order to reduce the rolling influence existing on the surface of the metal pattern and the transport means for moving the substrate at a predetermined speed. An imaging means that is tilted from 0 ° to 10 ° from the direction and is synchronized with the conveying means or images the surface of the metal pattern at a predetermined time interval; and a metal material and a plating material of the metal pattern with respect to the metal pattern By utilizing the range of wavelengths where the difference in reflection intensity inherent to each metal is the largest, the metal substrate material and the plating material are optically separated. Utilizing a first illumination means having a dome illumination for indirect light irradiation and an angle range in which a difference in reflection intensity specific to each metal of the metal material of the metal pattern and the plating material is small with respect to the metal pattern. Illumination blocking means for optically separating the material of the metal substrate and the plating material, and using image data obtained by photographing the surface of the metal pattern by the imaging means, the defective portion existing on the surface of the metal pattern is detected. An inspection apparatus for a substrate having a metal pattern, comprising image processing means for extraction and automatic determination.

  This inspection device enables imaging of the plating state including the side taper portion of the wiring pattern having a three-dimensional shape, clearly separates the contrast between the metal surface and the plating portion, and also causes a rolling scratch caused by the metal material manufacturing method. While maintaining the conventional effect of stabilizing the over-detection element due to minute image brightness due to unevenness and unevenness, the illumination separation means makes the contrast separation between the metal surface and the plated part clearer and solves the above problem is there.

  Further, in claim 7 of the present invention, the surface and back surface of the metal pattern of the substrate having the metal pattern are illuminated by illumination, and the wiring pattern defect on the surface of the metal pattern is based on the image data obtained by imaging from above. In the inspection apparatus for the surface of a substrate having a metal pattern for simultaneously inspecting plating defects, a conveying means for moving the substrate at a predetermined speed, and an imaging angle θ to reduce the rolling influence existing on the surface of the metal pattern An imaging unit that is tilted by 0 ° to 10 ° from the normal direction and is synchronized with the transport unit or images the surface of the metal pattern at a predetermined time interval, and a metal material and a plating material of the metal pattern with respect to the metal pattern By utilizing the wavelength range where the difference in reflection intensity inherent to each metal is the largest, the metal substrate material and the plating material are optically separated. And a first illumination unit having a dome illumination for indirect light irradiation, and a wavelength range in which a difference in reflection intensity specific to each metal of the metal material of the metal pattern and the plating material is the largest with respect to the metal pattern Is used to optically separate the material of the metal substrate from the plating material and directly irradiates the light, a third illuminator that irradiates the back surface of the metal pattern, and imaging The image data obtained by photographing the surface of the metal pattern by the means is used to extract a defective portion existing on the surface of the metal pattern and to automatically determine the image processing means, and the substrate having the metal pattern Inspection equipment.

  This inspection device enables imaging of the plating state including the side taper portion of the wiring pattern having a three-dimensional shape, clearly separates the contrast between the metal surface and the plating portion, and also causes a rolling scratch caused by the metal material manufacturing method. While maintaining the conventional effect of stabilizing the over-detection element due to light and dark minute images due to unevenness and unevenness, the second illumination means can clarify the contrast separation between the metal surface and the plated portion and solve the above problem In addition, the third illumination means can detect with high accuracy pattern defects and lead deformation under the protective tape that the surface illumination means had insufficient power of detection, resulting in pattern defects, lead deformation, and defective protective tape. It is possible to inspect the defective items on the surface of all metal patterns such as plating defects, presence / absence of downset press, etc. with one imaging means. There is an effect that.

  According to claim 8 of the present invention, the surface of the metal pattern of the substrate having the metal pattern is illuminated by illumination, and the wiring pattern defect and the plating defect on the surface of the metal pattern are based on the image data obtained by imaging from above. In the inspection apparatus for the surface of the substrate having the metal pattern, the imaging angle θ is set to the normal line of the metal pattern in order to reduce the rolling influence existing on the surface of the metal pattern and the transport means for moving the substrate at a predetermined speed. An imaging means that is tilted from 0 ° to 10 ° from the direction and is synchronized with the conveying means or images the surface of the metal pattern at a predetermined time interval; and a metal material and a plating material of the metal pattern with respect to the metal pattern By utilizing the range of wavelengths where the difference in reflection intensity inherent to each metal is the largest, the metal substrate material and the plating material are optically separated. Utilizing a first illumination means having a dome illumination for indirect light irradiation and an angle range in which a difference in reflection intensity specific to each metal of the metal material of the metal pattern and the plating material is small with respect to the metal pattern. Obtained by photographing the surface of the metal pattern with the illumination preventing means for optically separating the metal substrate material and the plating material, the second illumination means for illuminating the back surface of the metal pattern, and the imaging means. An inspection apparatus for a substrate having a metal pattern, comprising image processing means for extracting and automatically determining a defective portion existing on the surface of the metal pattern using the obtained image data.

  This inspection device enables imaging of the plating state including the side taper portion of the wiring pattern having a three-dimensional shape, clearly separates the contrast between the metal surface and the plating portion, and also causes a rolling scratch caused by the metal material manufacturing method. While maintaining the conventional effect of stabilizing the over-detection element due to minute image brightness due to unevenness and unevenness, the above-mentioned problem has been solved by making the contrast separation between the metal surface and the plated part clearer by the illumination blocking means. . In addition, the second illumination means can detect the pattern defect and lead deformation under the protective tape, which the surface illumination means had insufficient power of detection, with high accuracy, and the pattern defect, lead deformation, protective tape defect, plating defect There is an effect that it is possible to inspect defective items on the surface of all metal patterns such as the presence or absence of a downset press with a single imaging means.

  As described above, according to the present invention, in the imaging of the wiring pattern on the surface of the metal substrate and the plating portion, image data having sufficient contrast is obtained and image processing is performed regardless of slight variations in the plating manufacturing conditions. Therefore, it is possible to provide an inspection apparatus with excellent defect detection sensitivity that can simultaneously inspect a wiring pattern defect and a plating appearance defect of a substrate having a metal pattern with high accuracy.

  Embodiments of a method and apparatus for inspecting the surface of a metal substrate according to the present invention will be described below with reference to the drawings. FIG. 2 is a schematic configuration diagram showing a surface inspection apparatus for a metal substrate according to the present invention.

  The wiring pattern on the surface of the metal substrate and the plating inspection apparatus according to the present invention include a conveying means 50 for moving the metal substrate 10 at a predetermined speed, and the rolling scratches present on the surface of the metal substrate 10 in synchronization with the conveying means 50. In order to reduce the influence, the imaging means 30 for imaging the surface of the metal substrate 10 with an imaging angle θ, and a wavelength region where the difference in reflection intensity between the metal material of the metal substrate and the plating material is the largest with respect to the metal substrate 10. Utilizing the image data obtained by photographing the surface of the metal substrate 10 with the illuminating means 20 including the dome illumination for illuminating the indirect light by utilizing optical separation of the metal material and the plating material by utilizing And a control / image processing means 40 that extracts and automatically determines a defective portion existing on the surface of the metal substrate 10.

  The inspection stage on which the metal substrate 10 is placed and fixed is moved to the imaging area at a predetermined speed by the conveying means 50, and at this time, the movement amount of the inspection stage attached to the conveying means 50, that is, the movement amount of the metal substrate is measured with high accuracy. By obtaining a signal for each unit distance from the unit that performs the division, dividing and distributing the signal and sending this signal to the control / image processing means 40, scanning imaging is performed so as not to be affected by the speed variation of the inspection stage. . When the conveyance speed of the inspection stage can be regarded as constant within the resolution of the imaging means, a method of obtaining an image only by starting imaging with a trigger signal and imaging at a certain time interval can be considered, but as described above, always Imaging that is synchronized with the amount of movement of the stage is more reliable.

3A and 3B are schematic views showing two types of first embodiments of the illumination means 20 according to claim 1 of the present invention. Both (a) and (b) use dome illumination that emits indirect light as the first illumination means 21,
(A) uses ring-shaped direct illumination as the second illumination means 22.
(B) uses direct illumination as the second illumination means 23, and the illuminated portion is arranged near the inner surface of the dome illumination.

  A wiring pattern formed by an etching method or the like has a cross-sectional shape close to a hexagon as the etching progresses from the surface on both sides toward the center in the thickness direction. The side taper portion is formed in a curve. When the illumination means is only coaxial incident light, the light is reflected on the surface of the wiring pattern, and the accuracy of revealing defects occurring between the wiring patterns and in the side taper portion is lowered.

  On the other hand, the dome illumination can irradiate many inspected components including the coaxial direction by irradiating the object to be inspected with a solid angle of 2π. . For dome lighting, a light exit is formed on the inner surface of the dome and light is irradiated directly from the direction of the solid angle 2π to the object to be inspected, and a light exit is formed on the inner surface of the dome and reflected on the inner surface of the dome. There is a type that irradiates the object to be inspected, but either type may be used as long as the same effect can be produced.

  Further, in order to reduce the influence of shading as much as possible, the dome inner diameter of the dome illumination is set to 2 W or more with respect to the width W of the substrate 10 having the metal pattern, and the entire surface of the substrate 10 having the metal pattern in one image pickup. It is preferable to be able to image. As the light source, a metal halide light source, a halogen light source, or the like is selected and used in consideration of the amount of light necessary for imaging.

  The second illumination means 22 or 23 is arranged at a position where direct light can be applied to the substrate width W of the metal pattern and the irradiation of the first illumination means 21 is not hindered. By directly illuminating the light, the effect of the wavelength selection step described later can be improved, and the optical separation between the metal material and the plating material can be made more reliable. Therefore, the illumination shape and the light source are not particularly limited, and embodiments using a light source such as a ring shape or a set of spot shapes, a metal halide light source, a halogen light source, an LED light source, and the like are conceivable. However, the second illuminating means is only an auxiliary of the first illuminating means, and should not cancel the effect of the first illuminating means.

  The imaging unit 30 repeatedly captures a predetermined area from a predetermined position on the substrate 10 having the metal pattern, and obtains image data of the entire surface of the substrate 10 having the metal pattern. The imaging angle θ of the imaging means 30 indicates the angle formed between the vertical direction of the substrate having the metal pattern and the optical axis, and the imaging angle θ is suitably about 3 to 10 °. The reason why the imaging angle θ is not 0 ° is to reduce the influence of fine irregularities such as rolling scratches on the surface of the metal pattern at the time of imaging to prevent erroneous detection and overdetection.

  Various types of cameras can be used as the image pickup means 30, but a line camera, an area camera, monochrome, color, or the like can be selected according to the application. In this embodiment, a monochrome line camera is used. Is shown.

  An imaging slit 29 is provided in the vicinity of the top of the hemispheric dome of the dome illumination that is the first illumination unit 21, and the imaging unit 30 images the substrate 10 through this slit. The shape and size of the slit 29 are set in accordance with the shape and size of the field of view of the imaging means 30. That is, the slit 29 is preferably an elongated rectangular shape when the imaging means 30 is a line camera, and a rectangular shape close to a square when the imaging means 30 is an area camera. In either case, it is necessary that the size of the imaging means 30 is not obstructed. However, if the size is increased more than necessary, the balance of uniform irradiation from the dome illumination will be lost, so care must be taken. is there.

  As a wavelength selection method, the irradiating means 20 illuminates with light having a wavelength of 400 nm or more and 600 nm or less, or an optical filter 35 that transmits a wavelength of 400 nm or more and 600 nm or less is attached to the imaging means 30. There are methods such as imaging only in the wavelength range.

  In this way, by selecting the wavelength of light used for imaging, the metal of the non-plated portion and the plated portion are optically separated, and a clear contrast for defect detection is obtained. Therefore, in accordance with the metal and plating material of the non-plated portion of the substrate 10 having the metal pattern to be imaged, the metal material and the plating material of the non-plated portion are utilized by utilizing the wavelength range in which the difference in reflection intensity is greatest. As a result, the defect detection sensitivity is improved.

  The control / image processing means 40 controls the transport means 50 and performs processing for extracting a defective portion existing on the surface of the metal pattern using image data obtained by photographing the surface of the metal pattern.

  FIG. 4 is a flowchart showing the overall operation of the image processing / defect determination means 40. The conveyance means 50 that moves the substrate 10 having the metal pattern at a predetermined speed, and the wavelength region where the difference in reflection intensity between the metal material of the non-plating portion and the plating material is the largest with respect to the metal pattern are utilized. The metallic material and the plating material are optically separated, and the illumination means 20 having the dome illumination for indirect light irradiation and the conveying means 50 are synchronized, and the surface of the metal pattern is photographed with an imaging angle θ. The metal pattern surface is sequentially imaged by the imaging means 30 (step S1).

  This image data is sent to the control / image processing means 40, and the metal surface of the non-plated part and each part information of the plated part are extracted from this image data (step S2). Further, defect detection / determination processing is executed using the extracted information (step S3). This defect detection / determination process is executed for all the wiring patterns and plating formed on the lead frame 40, and then the entire operation is completed (step S4, YES).

  FIG. 5A schematically shows the inner lead 12, the plating part 16, and the space part 19, and FIG. 5B shows a profile on the line L1 in FIG. In this way, luminance information is separated in each of the inner lead 12, the plating 16, and the space portion 19. Therefore, in the defect detection / determination process (step S3), the obtained image is binarized and multi-valued to extract a defective part, or a reference image is held as master data in advance. In addition, it is possible to detect a defect by performing image processing such as pattern matching or difference processing with the obtained image data.

  In addition, with regard to the presence / absence of protective tape, displacement, and width abnormality, the standard protective tape edge information (coordinates) is obtained, and the abnormality can also be detected by performing measurement processing by calculating the number of pixels from this edge information. Can do. Further, in order to inspect whether the metal pattern is down-set press, a down-set press mark called a tool mark is generated on the suspension lead 18 as the down-set press is performed. The abnormality can be inspected by detecting the presence or absence by image processing.

6A and 6B are schematic views showing a second embodiment of the illumination means 20 according to claim 2 of the present invention. The first illumination means 21 uses dome illumination that emits indirect light, and the illumination blocking means 24 is disposed inside the dome illumination.
(A) is the perspective view which showed arrangement | positioning of a dome illumination and an illumination prevention means in three dimensions.
(B) is a top view inside a dome illumination.

  The illumination blocking means 24 is for blocking the irradiation from the solid angle 2π of the dome illumination that irradiates the indirect light as the first illumination means 21 in a part of the region. No matter what you use. The area of the illumination blocking means 24 is an area parallel to the imaging area of the imaging means 30 and is arranged with reference to the imaging angle θ. Specifically, a range of 15 ° to 0 °, preferably a range of 5 ° to 0 ° is suitable.

  The light blocking means 24 may be formed as long as a low-reflection member can be disposed in the region inside the dome. A low-reflection coating may be applied to the region on the inner surface of the dome, or a tape-like low-reflection member may be used. It may be attached or mechanically fixed.

  In this embodiment, irradiation from the direction of the solid angle 2π of the dome illumination that irradiates the indirect light as the first illumination means 21 is partially blocked. Since the uniform irradiation with the solid angle of 2π is not maintained, the accuracy of revealing the defect generated in the side taper portion is slightly deteriorated, or it comes from minute light and darkness due to rolling scratches and unevenness caused by the manufacturing method of the metal material. The effect of the conventional dome illumination is slightly weakened because the over-detecting element has some influence on the image.

  However, since the difference in reflected light intensity between the metal surface of the non-plated portion and the plated portion is small, the irradiation light in the coaxial direction is blocked by the illumination blocking means 24 to prevent the metal in the non-plated portion. Contrast separation between the surface and the plated portion can be made clearer, and a highly accurate and stable inspection can always be performed regardless of slight variations in the manufacturing conditions of plating.

  FIG. 7 is a schematic view showing a third embodiment of the illumination means 20 according to claim 3 of the present invention. The first illumination means 21 uses dome illumination that irradiates indirect light, the second illumination means 22 uses ring-shaped direct illumination, and the third illumination means 25 is positioned to illuminate the metal substrate 10 from the back surface. It is arranged.

  Since the 1st illumination means 20 in this embodiment is the same as the 1st illumination means 20 in 1st Embodiment, detailed description is abbreviate | omitted. Further, the second illumination means 22 in the present embodiment is also the same as the second illumination means 22 in the first embodiment, and detailed description thereof is omitted.

  The 3rd illumination means 25 irradiates illumination light to the metal substrate 10 from a back surface. As the third illuminating means 25, a light source that guides light from a halogen light source or a metal halide light source to a linear light guide having a cylindrical lens or a diffusion plate can be used. Light transmitted from the back surface of the substrate 10 toward the front surface is irradiated. By irradiating light from the back surface of the metal substrate 10, it is possible to carry out a defect inspection existing under the protective tape 17 attached to the surface of the lead frame, which could not be inspected by illumination from the front surface. It becomes like this.

  FIG. 8A schematically shows the inner lead 12, the plating part 16, and the space part 19, and FIG. 8B shows the profile on the line L2 in FIG. By adding the third illumination means in this way, the first embodiment and the first embodiment using an optical system in which the profile shape of the luminance information is received only in the reflected light in each of the inner lead 12, the plating 16, and the space 19. This is different from the second embodiment.

  FIG. 9 is a schematic view showing a fourth embodiment of the illumination means 20 according to claim 4 of the present invention. The first illumination means 21 uses dome illumination that emits indirect light, and the illumination blocking means 24 is disposed inside the dome illumination. The 2nd illumination means 25 is arrange | positioned in the position which illuminates the metal substrate 10 from a back surface.

  The illumination blocking unit 24 in the present embodiment is the same as the illumination blocking unit 24 in the second embodiment, and a description thereof will be omitted. Moreover, since the 2nd illumination means 25 in this embodiment is the same as the 3rd illumination means 25 in 3rd Embodiment, detailed description is abbreviate | omitted.

  By irradiating light from the back surface of the metal substrate 10 by the illumination means 25, a defect inspection existing under the protective tape 17 attached to the surface of the lead frame, which could not be inspected by the illumination from the front surface, is performed. Will be able to. In addition, since the illumination means 25 is added, the profile shape of the luminance information in each of the inner lead 12, the plating 16, and the space portion 19 uses an optical system that receives only reflected light, and the first embodiment and the second embodiment. Is different.

Example 1
Example 1 in the first embodiment (described in FIG. 3) will be described.
In FIG. 10, a metal halide light source and dome illumination are used as the first illumination means 21, ring-shaped illumination is used as the second illumination means 22, and an 8-bit 256 gradation monochrome line camera is used as the imaging means 30. The image near the inner lead plating of the lead frame when the angle θ is 5 ° and the optical filter 35 that transmits 400 nm to 600 nm is attached to the front surface of the imaging lens is shown.

(Comparative Example 1)
FIG. 11 shows the vicinity of the inner lead plating of the lead frame under the same conditions as in Example 1 (Comparative Example 1) except that Example 1 and the second illumination means 22 are not included (FIG. 5A). The profile on line L1 is shown.

  From this result, it has brightness information in each of the plating part 16, the inner lead part 12, and the space part 19, and automatic extraction of the plating part and the metal pattern surface can be realized by setting an appropriate threshold value. Specifically, there is an Open defect (plating not deposited, foreign matter, chipping, disconnection, etc.) at a portion where the luminance changes from the plating luminance level ML1 of the plating portion 16 to the dark side, and the luminance of the metal pattern surface of the inner lead portion 12 There is a short system defect (plating adhesion, short circuit, protrusion, etc.) in the place where the brightness is changed from the level PL to the bright side, and in the place where the brightness is changed from the metal pattern surface brightness level PL of the inner lead portion 12 to the dark side. It is possible to determine whether there is a defect such as the presence of an Open defect (such as chipping, disconnection, or foreign matter). Further, it can be confirmed that the contrast separation is clearer than the plating luminance level ML2 when the second illumination unit is not included.

(Example 2)
Example 2 in the second embodiment (described in FIG. 6) will be described.
In FIG. 12, a metal halide light source and dome illumination are used as the first illuminating means 21, a low-reflective material is arranged as the illumination blocking means 24 in an imaging angle range of 0 ° to 5 °, and the 8-bit 256 gradation is used as the imaging means 30. The image of the vicinity of the inner lead plating of the lead frame when a monochrome line camera is used, the imaging angle θ is 5 °, and the optical filter 35 that transmits 400 nm to 600 nm is attached to the front surface of the imaging lens is shown.

(Comparative Example 2)
FIG. 13 shows the vicinity of the inner lead plating of the lead frame under the same conditions as in Example 2 (Comparative Example 2) except that Example 2 and the illumination blocking means 24 are not included (on line L1 in FIG. 5A). ) Profile.

  From this result, it has brightness information in each of the plating part 16, the inner lead part 12, and the space part 19, and automatic extraction of the plating part and the metal pattern surface can be realized by setting an appropriate threshold value. However, since the luminance fluctuation near the luminance level PL on the surface of the metal pattern of the inner lead portion 12 is large, it can be seen that minute brightness and darkness due to rolling flaws and unevenness caused by the metal material manufacturing method are generated. This is because in the second embodiment, since the illumination blocking means 24 is provided, uniform irradiation with a solid angle 2π cannot be maintained, and the effect of the conventional dome illumination is slightly weakened.

  However, when the brightness level ML1 when the illumination blocking unit 24 is present and the brightness level ML2 when the illumination blocking unit 24 is not present are compared with the plating unit 16, the contrast separation is clearer when the illumination blocking unit 24 is present. It can be confirmed that Therefore, a highly accurate and stable inspection can always be performed regardless of slight variations in the manufacturing conditions of plating.

(Example 3)
Example 3 in the third embodiment (described in FIG. 7) will be described.
In FIG. 14, a metal halide light source and dome illumination are used as the first illumination means 21, ring-shaped illumination is used as the second illumination means 22, and a halogen light source, a cylindrical lens and a diffusion plate are used as the third illumination means 25. Is used, an 8-bit 256 gradation monochrome line camera is used as the imaging means 30, an imaging angle θ is set to 5 °, and an optical filter 35 that transmits 400 nm to 600 nm is mounted on the front surface of the imaging lens. The image of inner lead plating vicinity of a lead frame is shown.

  FIG. 15 shows a profile in the vicinity of the inner lead plating of the lead frame (on the line L2 in FIG. 8A) in Example 3.

  From this result, it has brightness information in each of the plating part 16, the inner lead part 12, and the space part 19, and automatic extraction of the plating part and the metal pattern surface can be realized by setting an appropriate threshold value. In addition, since the brightness value of the space portion 19 is increased by the third illumination means 25, the protective tape 17 attached to the lead frame surface, which could not be inspected only by the illumination from the surface so far. Underlying defect inspection can be carried out.

Example 4
Example 4 in the above-described fourth embodiment (described in FIG. 9) will be described.
In FIG. 16, a metal halide light source and dome illumination are used as the first illumination unit 21, and a low reflection material is disposed as the illumination blocking unit 24 in the imaging angle range of 0 ° to 5 °. A linear light guide equipped with a halogen light source, a cylindrical lens and a diffuser is used, an 8-bit 256-tone monochrome line camera is used as the imaging means 30, the imaging angle θ is 5 °, and 400 to 600 nm is transmitted in front of the imaging lens. The image of the vicinity of the inner lead plating of the lead frame when the optical filter 35 to be mounted is mounted is shown.

  FIG. 17 shows a profile in the vicinity of the inner lead plating of the lead frame (on the line L2 in FIG. 8A) in Example 4.

  From this result, it has brightness information in each of the plating part 16, the inner lead part 12, and the space part 19, and automatic extraction of the plating part and the metal pattern surface can be realized by setting an appropriate threshold value. In addition, since the brightness value of the space portion 19 is increased by the second illumination means 25, the protective tape 17 attached to the surface of the lead frame, which could not be inspected by the illumination from the surface so far, is provided. It becomes possible to carry out defect inspection existing in

  However, since the luminance fluctuation near the luminance level PL on the surface of the metal pattern of the inner lead portion 12 is large, it can be seen that minute brightness and darkness due to rolling flaws and unevenness caused by the metal material manufacturing method are generated. This is because in the fourth embodiment, since the illumination blocking means 24 is provided, uniform irradiation with a solid angle of 2π cannot be maintained, and the effect of the conventional dome illumination is slightly weakened.

  However, when comparing the brightness level ML1 when the illumination blocking means 24 is present with the brightness level ML2 when there is no illumination blocking means 24, contrast separation is clearer when the illumination blocking means 24 is present. It can be confirmed that Therefore, a highly accurate and stable inspection can always be performed regardless of slight variations in the manufacturing conditions of plating.

FIG. 18 shows an image in the vicinity of the protective tape 17 of the lead frame in Example 4. From this image, it can be confirmed that the luminance difference between the inner lead portion 12 and the space portion 19 is also maintained in the inner lead portion 12 and the space portion 19 below the protective tape 17. Therefore, it becomes possible to inspect the shape defect existing under the protective tape.

The top view which shows schematic shape of a lead frame. The schematic block diagram which shows the principal part structure of the inspection apparatus which concerns on this invention. The schematic block diagram which shows the illumination means which concerns on 1st Embodiment of this invention. The flowchart which shows the whole schematic operation | movement of the test | inspection apparatus of this invention. (A) The schematic plan view of inner lead plating vicinity of a lead frame. (B) Explanatory drawing which shows the line profile on the L1 line | wire in (a) in 1st and 2nd embodiment of this invention. The schematic block diagram which shows the illumination means which concerns on 2nd Embodiment of this invention. The schematic block diagram which shows the illumination means which concerns on 3rd Embodiment of this invention. (A) The schematic plan view of inner lead plating vicinity of a lead frame. (B) Explanatory drawing which shows the line profile on the L1 line | wire in (a) in 3rd and 4th embodiment of this invention. The schematic block diagram which shows the illumination means which concerns on 4th Embodiment of this invention. The example of an image at the time of imaging in 1st Embodiment of this invention. The line profile on the L1 line in the first embodiment of the present invention and the line profile on the L1 line when the second illumination means is not used in the first embodiment. The example of an image at the time of imaging with the 2nd Embodiment of this invention. The line profile on the L1 line in the second embodiment of the present invention, and the line profile on the L1 line when the illumination blocking means in the second embodiment is not used The example of an image at the time of imaging with the 3rd Embodiment of this invention. The line profile on the L2 line in the 3rd Embodiment of this invention. The example of an image at the time of imaging by the 4th Embodiment of this invention. The line profile on the L2 line in the 4th Embodiment of this invention. The example of an image of the vicinity of a protective tape at the time of imaging by the 4th Embodiment of this invention.

Explanation of symbols

10 .. Substrate 11 having a metal pattern... Die pad 12.. Inner lead 13. Outer lead 14. Dam bar 15. Frame portion 16 Plating 17 Protective tape 18 Suspension lead 19 Space portion 20 .. Illumination means 21 .. First illumination means (dome illumination for indirect light irradiation)
22. Second illumination means (in the case of ring-shaped direct illumination)
23 .. Second illumination means (in the case of direct light irradiation)
24 .. Illumination blocking means 25 .. Third illumination means (irradiation from the back)
29..Slit 30 for image pickup .... Image pickup means 35..Optical filter 40..Control / image processing apparatus 50..Conveyance means

Claims (8)

A transport stage for transporting a substrate having a metal pattern composed of a plated portion plated on the surface and a non-plated portion not plated at a predetermined speed;
An imaging step of imaging the surface of the substrate at a predetermined time interval in synchronization with the conveyance in the conveyance step from a direction inclined from 0 ° to 10 ° from the normal direction of the substrate;
A first illumination step of irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plating material of the plated portion is maximum with indirect light by the first illumination means;
A second illumination step of irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plating material of the plated portion is the maximum with a second illumination means;
Using image data of the surface of the substrate obtained in the imaging step, image processing / defect determination step for determining defects present in the non-plated portion and the plated portion,
A method for inspecting a substrate having a metal pattern, characterized by comprising: A transport stage for transporting a substrate having a metal pattern composed of a plated portion plated on the surface and a non-plated portion not plated at a predetermined speed;
An imaging step of imaging the surface of the substrate at a predetermined time interval in synchronization with the conveyance in the conveyance step from a direction inclined from 0 ° to 10 ° from the normal direction of the substrate;
An illumination step of irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plating material of the plated portion is maximum with an indirect light by an illumination unit,
Of the irradiation light by the illuminating means, an illumination blocking step for preventing irradiation of light having an irradiation angle with a small difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plating material of the plated portion;
Using image data of the surface of the substrate obtained in the imaging step, image processing / defect determination step for determining defects present in the non-plated portion and the plated portion,
A method for inspecting a substrate having a metal pattern, characterized by comprising: A transport stage for transporting a substrate having a metal pattern composed of a plated portion plated on the surface and a non-plated portion not plated at a predetermined speed;
An imaging step of imaging the surface of the substrate at a predetermined time interval in synchronization with the conveyance in the conveyance step from a direction inclined from 0 ° to 10 ° from the normal direction of the substrate;
A first illumination step of irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plating material of the plated portion is maximum with indirect light by the first illumination means;
A second illumination step of irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plating material of the plated portion is the maximum with a second illumination means;
Using the third illumination step of illuminating the substrate from the back surface of the substrate with a third illumination means and image data of the surface of the substrate obtained in the imaging step, the non-plated portion and the plated portion An inspection method for a substrate having a metal pattern, comprising: image processing / defect determination stage for determining an existing defect. A transport stage for transporting a substrate having a metal pattern composed of a plated portion plated on the surface and a non-plated portion not plated at a predetermined speed;
An imaging step of imaging the surface of the substrate at a predetermined time interval in synchronization with the conveyance in the conveyance step from a direction inclined from 0 ° to 10 ° from the normal direction of the substrate;
A first illumination step of irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plating material of the plated portion is maximum with indirect light by the first illumination means;
An illumination blocking step for preventing irradiation of light having an irradiation angle with a small difference in reflection intensity between the metal material of the non-plating portion of the substrate and the plating material of the plating portion of the irradiation light by the first illumination means,
Using the second illumination step of illuminating the substrate from the back surface of the substrate with a second illumination means and image data of the surface of the substrate obtained in the imaging step, the non-plated portion and the plated portion An inspection method for a substrate having a metal pattern, comprising: image processing / defect determination stage for determining an existing defect. Transport means for transporting a substrate having a metal pattern composed of a plated portion plated on the surface and a non-plated portion not plated at a predetermined speed;
Imaging means for imaging the surface of the substrate at a predetermined time interval in synchronization with conveyance by the conveyance means from a direction inclined from 0 ° to 10 ° from the normal direction of the substrate;
A first illuminating means for irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plated material of the plated portion is maximum with indirect light;
A second illuminating means for directly irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plated material of the plated portion is maximum;
Using image data of the surface of the substrate obtained by the imaging means, image processing / defect determination means for determining defects present in the non-plated portion and the plated portion,
A method for inspecting a substrate having a metal pattern, characterized by comprising: Transport means for transporting a substrate having a metal pattern composed of a plated portion plated on the surface and a non-plated portion not plated at a predetermined speed;
Imaging means for imaging the surface of the substrate at a predetermined time interval in synchronization with conveyance by the conveyance means from a direction inclined from 0 ° to 10 ° from the normal direction of the substrate;
Illumination means for irradiating light of a wavelength region in which the difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plating material of the plated portion is maximum with indirect light,
Of the irradiation light by the illumination means, an illumination blocking means for preventing irradiation of light at an irradiation angle with a small difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plating material of the plated portion;
Using image data of the surface of the substrate obtained by the imaging means, image processing / defect determination means for determining defects present in the non-plated portion and the plated portion,
An inspection apparatus for a substrate having a metal pattern, characterized by comprising: Transport means for transporting a substrate having a metal pattern composed of a plated portion plated on the surface and a non-plated portion not plated at a predetermined speed;
Imaging means for imaging the surface of the substrate at a predetermined time interval in synchronization with conveyance by the conveyance means from a direction inclined from 0 ° to 10 ° from the normal direction of the substrate;
A first illuminating means for irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plated material of the plated portion is maximum with indirect light;
A second illuminating means for directly irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plated material of the plated portion is maximum;
Third illumination means for illuminating the substrate from the back surface of the substrate;
Using image data of the surface of the substrate obtained by the imaging means, image processing / defect determination means for determining defects present in the non-plated portion and the plated portion,
An inspection apparatus for a substrate having a metal pattern, characterized by comprising: Transport means for transporting a substrate having a metal pattern composed of a plated portion plated on the surface and a non-plated portion not plated at a predetermined speed;
Imaging means for imaging the surface of the substrate at a predetermined time interval in synchronization with conveyance by the conveyance means from a direction inclined from 0 ° to 10 ° from the normal direction of the substrate;
A first illuminating means for irradiating light of a wavelength region in which a difference in reflection intensity between the metal material of the non-plated portion of the substrate and the plated material of the plated portion is maximum with indirect light;
Illumination prevention means for preventing irradiation of light having an irradiation angle with a small difference in reflection intensity between the metal material of the non-plating portion of the substrate and the plating material of the plating portion of the irradiation light by the first illumination means,
Second illumination means for illuminating the substrate from the back surface of the substrate;
Using image data of the surface of the substrate obtained by the imaging means, image processing / defect determination means for determining defects present in the non-plated portion and the plated portion,
An inspection apparatus for a substrate having a metal pattern, characterized by comprising: