JPH0338047A - Manufacture of semiconductor device - Google Patents

Abstract

PURPOSE:To surely judge whether defect marks exist in chips having various kinds of size and pattern, by detecting and deciding whether a defect mark exists by use of a mark detecting part, which mark is in position data at the center part of a chip calculated from data for detection. CONSTITUTION:A full cut wafer is mounted on a table 3; by moving the table 3, the center of a chip whose defect mark is to be detected is set below a camera 5; by illuminating the chip from bellow, an image is picked up. The outward form of the chip is recognized from the image; the center position is calculated from the outward form; by illuminating from above, the image is picked up; whether the defect mark at the center position of the chip to be judged exists is discriminated by a mark detecting part 62. Thereby whether the defect mark exists can be surely judged in the case of chips to be judged for which the descrimination of the defect mark is difficult.

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] The present invention relates to a method of manufacturing a semiconductor device, and in particular to a method of determining whether there is a defective mark on a chip before bonding the chip.

The purpose of this paper is to provide a method for reliably determining the presence or absence of defective marks on chips with various dimensions and patterns that make up a full-cut wafer.

(1) Place a fully cut wafer on a table, move the table, set the center of the chip to be judged for the presence or absence of a defective mark below the camera, and capture the image by illuminating it from below. , a semiconductor device that recognizes the outer shape of the chip from the image, calculates the center position from the outer shape, and then captures the image by illuminating it from above, and detects and determines the presence or absence of a defective mark at the center position of the chip to be determined using a mark detection unit. [2] A full-cut wafer is placed on a table, and a camera captures an image of one corner of the chip to be judged for the presence or absence of a defective mark.
Recognize the position of the 1st corner end, then move the table, capture the image of the diagonal corner diagonal to the 1st corner, recognize the position of the diagonal corner end, 1st then the 1st corner.
The semiconductor device manufacturing method is configured by capturing an image of the center of a line segment connecting a corner end and the diagonal corner end, and detecting and determining the presence or absence of a defective mark at the center using a mark detection section.

[Industrial application field]

The present invention relates to a method of manufacturing a semiconductor device, and more particularly to a method of determining whether there is a defective mark on the top surface of a chip before bonding the chip.

When selecting good chips from full-cut wafers that include defective chips with defective marks (usually ink marks) and performing guide bonding, one chip of the fully set full-cut wafer is CC the area containing
A D camera takes an image, 1) Recognizes the chip outline through image processing, calculates the position data of the center of the chip from the position data of the edge of the chip, and 2) Detects and determines the presence or absence of a defective mark in the center. Gui bonding is performed by selecting non-defective chips without marks.

At this time, it is necessary to reliably determine the presence or absence of defective marks for chips having various patterns and various dimensions.

[Conventional technology]

A conventional method for recognizing defective marks on chips of full-cut wafers and a subsequent bonding method will be described.

The schematic diagram of the defective mark recognition device (2) shown in FIG. 6 is a schematic diagram of a conventional defective mark recognition device, where l is a full-cut wafer and 3 is an X-Y table.

31 is an X-Y table (fixed part), 32 is a stand, 41 is an upper light source, 5 is a CCD camera, 51 is a lens, 6 is an image processing section, 61 is an arithmetic processing section, and 62 is a mark detection section.

7 represents an X-Y table driving section, and 8 represents a control section.

Figure 7 shows a fully cut wafer with defective marks.
1 represents a full cut wafer, 2 represents a chip, and 21 represents a defective mark.

The defective mark is made by testing each chip in advance on a wafer using a measurement prober, and applying ink to the center of the upper surface of the defective chip in a substantially circular shape. In order to prevent this defective mark from contaminating the surrounding chips and to reduce ink consumption, as long as the mark can be confirmed,
Preferably small.

Full-cut wafer 1 has UV tape (adhesion strength decreases when exposed to ultraviolet light) on the back side, the scribe line is cut halfway through the UV tape, and each chip has a width of about 0.1 mm. They are lined up and separated by a scribe line.

First, place the full-cut wafer l on the x-y table 3,
The X-Y table 3 is moved to a position where an image of the chip whose presence or absence of a defective mark is to be determined is captured. Upper light source 4
1, the upper surface of the fully cut wafer 1 is illuminated with light, and an image including the entire chip is captured by the CCD camera 5. The image is divided into two pixels, for example 255×255, and then captured.

FIG. 8 schematically shows an image of a chip captured by the CCD camera 5, in which 2 represents the chip to be determined and 21 represents a defective mark. The lens 51 used has a magnification that can capture an image of one entire chip.

The image of the fully cut wafer 1 obtained by the upper light source 41 is as follows.

The scribe line part and the defect mark 21 part in the center of the chip are dark because there is little reflected light.

Other parts of the image appear bright because there is a lot of reflected light. Electric signals corresponding to the brightness and darkness of the image are sent to the image processing section 6. In the image processing unit 6, a certain signal level is set in advance, and larger image signals are determined to be white, and smaller image signals are determined to be black, and the entire image is binarized and converted into black and white. Let it be a set of pixels.

The external shape of the chip to be judged 2 is recognized by the image processing section 6.
For example, this can be determined from the boundary where the pixel series in the X and Y directions is reversed from white to black or from black to white.

The center of the chip with the defective mark 21 is the arithmetic processing section 6.
1, it can be calculated as the midpoint between the left end and the right end and the midpoint between the top end and the bottom end of the external shape of the chip 2 to be determined.

Then, it is determined whether the pixel at the center of the chip 2 to be determined is black or white, and if it is black, it is determined that there is a defective mark.

If it is white, it is determined that there is no defective mark.

If it is determined that there is a defective mark, the control unit 8 issues a command to the X-Y table drive unit 7 to move the X-Y table 3 by a distance of one chip so that the adjacent chip comes under the lens 51. Make it. Then, the presence or absence of a defective mark is determined in the same manner as described above.

If it is determined that there is no defective mark, the chip is transported to a position where die bonding is to be performed.

Figure 9 is a schematic diagram of the die bonder, where 1 is a full-cant wafer, 3 is an X-Y table, 32 is a stand, 5 is a CCD camera,
9 is a chip transfer arm, 91 is a lead frame supply section, 92 is a lead frame storage section, 93 is a lead frame, and 94 is an adhesive supply section.

95 is a bonding arm, 96 is an intermediate table, 97
9 represents a wafer supply section, and 98 represents a lead frame transport section.

For chips that are determined to have no defect mark, the tip of the chip transfer arm 9 comes to that position and vacuum-chucks the chip.
It is conveyed onto the intermediate table 96. After precision positioning is performed on the intermediate table 96, the bonding arm 95 carries it onto the lead frame 93, where die bonding is performed.

By the way, there are various patterns on the chip surface of full-cut wafers, and some parts do not reflect the light from the upper light source well and appear dark, and even for the same type of chips, the chip surface may vary between manufacturing lofts. Some chips have different light reflection conditions, making it extremely difficult to recognize scribe lines and defective marks.

FIG. 10(a) schematically shows an example of a chip in which it is difficult to recognize such a defective mark.

In addition to the scribe line and the black part of the defect mark 21, a slightly black pattern exists as noise.

This makes it difficult to set the level of binary conversion between white and black.

In other words, in order to completely judge these noises as white, it is necessary to set the judgment level closer to the black part, which may lead to cases in which parts of the scribe line and defect mark 21 are mistaken as white. be.

Furthermore, in recent years, with the development of large capacity memory and ASIC,
As the chip size increases, the chip outline is changed to CCD.
If an attempt is made to capture everything on the screen of the camera 5, the magnification of the lens 51 has to be lowered, and as a result, the scribe line of the image captured by the COD camera 5 becomes thinner, and the defect mark 21 also becomes smaller.

FIG. 10(b) shows an example of a chip in which it is difficult to recognize such defective marks.

The scribe line in the image of COD camera 5 becomes thinner,
Depending on the lighting, the screen may become extremely thin or have cuts, making it difficult to recognize. The defect mark 21 also becomes smaller and the 9 images become thinner, reducing the reliability of recognition.

[Problem to be solved by the invention]

Therefore, it has become difficult to reliably determine the presence or absence of a defective mark using only the conventional defective mark recognition method.

The present invention provides [1] a method for reliably determining the presence or absence of a defective mark on a chip with black pattern noise on the surface, and [2] a method for reliably determining the presence or absence of a defective mark on a large chip with a thin scribe line and a small defective mark. The purpose is to provide a method for making judgments.

[Means for solving the problem] The above problem is solved by the following problems:
A full-cut wafer l containing a plurality of chips separated by a scribe line, including a defective chip 1, is placed on a mounting section 33 that transmits light, and is illuminated by a lower light source 42 provided below the mounting section 33. Light it up.

The camera 5 provided above the mounting section 33 captures an image of the region of the full-cut wafer l that includes at least the chip 2 to be determined, and the image is binarized by the image processing section 6. a step of obtaining position data of the outer shape edge; and a step of calculating position data of the center of the target chip 2 by the arithmetic processing unit 61 from the position data of the outer shape edge of the target chip 2.

A step of illuminating with an upper light source 41 provided above the mounting section 33, capturing an image of the target chip 2 with the camera 5, and binarizing the image with the image processing section 6 to obtain detection data. and a step of using a mark detection unit 62 to detect and determine the presence or absence of a defective mark in the position data of the center of the chip calculated from the detection data; Bad mark 2
A full-cut wafer 1 including a defective chip 1 and a plurality of chips separated by a scribe line is placed on a table 3, and is illuminated by an upper light source 41 provided above the table 3. An image of the corner portion is captured by a camera 5 installed above the table 3,
The image is binarized by the image processing unit 6 to obtain position data of the L corner end, and the table 3 is moved relative to the camera 5 to obtain the position data of the L corner end. An image including corner portions is captured into the camera 5.

The image is binarized by the image processing unit 6 to obtain position data of the diagonal corner end, and the center of the line segment connecting the position data of the first corner end and the position data of the diagonal corner end is calculated. A step of calculating the data by the processing unit 61 and determining it as the position data of the center of the chip 2 to be determined, and a step of moving the table 3 relative to the camera 5 to calculate the position data of the center of the chip 2 to be determined. The image of the position data part is sent to the camera 5.
, the image is binarized by the image processing unit 6, and the mark detection unit 62 detects and determines the presence or absence of a defective mark in the position data of the center of the target chip 2. resolved.

[Effect]

(1) Full-cut wafer 1 mounted on the mounting section 33
An upper light source 41 that illuminates from above and a lower light source 42 that illuminates from below are provided.

First, the lower light source 42 is turned on. The scribe line area becomes brighter because the light passes upwards.

The portion of the chip 2 to be determined becomes dark because light is blocked. Therefore, the scribe line part is white, and the judged chip 2
It is easy to set the level to binarize the part as black, and the outer shape of the chip 2 to be judged is its left edge, right edge, upper edge,
It is easy to recognize the bottom edge as the boundary between white and black.

It is also easy to calculate the center position of the chip to be determined 2 as the middle between the left end and the right end, and the middle between the upper end and the lower end.

Next, only the upper light source 41 is turned on to determine the presence or absence of the defective mark 21. Since we already know the center position of the defective mark 21, if there is a defective mark 21, that position should be the darkest in the image, and even if there is a black noise pattern, the defective mark will not be black. By shifting the level of black and white determination toward the black portion, it is possible to classify a black noise pattern as white, thereby reliably determining the presence or absence of a defective mark.

[2] When recognizing the presence or absence of a defective mark on a large chip, increase the magnification of the 5 lens and capture a partial image of the chip. By doing this, the scribe line can be made thicker and the defect mark can be printed larger.

Since the dimensions of the chip and the thickness of the scribe line are known in advance, it is possible to set one corner of a certain chip to be captured in the image of the camera 5. To recognize the l corner from an image9 For example, scan the binarized pixels in the X and Y directions, and find the l corner from the X and Y coordinates of the position where the transition from white to black or black to white The position of the corner can be recognized and the position data of the l-corner end can be obtained.

Next, move the table 3 and bring the diagonal corner diagonal to the l corner below the camera 5.

In this case as well, the chip size is known in advance, so even if the fully cut wafer l is slightly bent or twisted, the table 3 can be moved and the diagonal corner
It is possible to come down. To recognize diagonal corners from an image 1. For example, scan the binarized pixels in the X and Y directions and find out from the X and Y coordinates of the position where the color is reversed from white to black or from black to white. The position of the diagonal corner can be recognized and the position data of the end of the diagonal corner can be obtained.

Assuming that the center position of the chip 2 to be judged is in the middle of the straight line connecting the l corner end position and the diagonal corner end position, 1
It is easy to calculate the center position of the chip from the position coordinates of the corner ends, the amount of movement of the table 3, and the position coordinates of the diagonal corner ends.

Next, the table 3 is moved to bring the center of the chip 2 to be determined under the camera 5 and capture an image. If there is a defective mark in the center, it will be shown in a large size, so it is possible to reliably determine whether or not there is a defective mark.

(Example) FIGS. 1 to 3 are diagrams for explaining Example 1, and are an example of recognizing a defective mark of a chip with black pattern noise as shown in FIG. 10(a).

FIG. 1 is a schematic diagram of a defective mark recognition device I, in which 1 is a full-cut wafer, 3 is an X-Y table, 31 is an X-Y table (fixed part), 32 is a stand, and 33 is a mounting part.

41 is the upper light source, 42 is the lower light source, and 5 is the camera CCD.
A camera, 51 a lens, 6 an image processing section, 61 an arithmetic processing section, 62 a mark detection section, 7 an X-Y table drive section, and 8 a control section.

FIG. 2 shows procedure I for determining the presence or absence of defective marks.

FIG. 3 shows an image of the chip; FIG. 3(a) shows an image of the chip with illumination below the wafer, and FIG. 3(b) shows an image of the chip with illumination above the wafer.

The following description will be given with reference to FIGS. 3 to 3.

First, a full-cut wafer l is placed on the mounting section 33 of the X-Y table 3 so that the left and right ends of the chips are parallel to the Y direction, and the top and bottom ends are parallel to the X direction.

The X-Y table 3 is moved to set the chip 2 to be determined at a position where the CCD camera 5 can capture an image of the entire chip 2 to be determined for the presence or absence of a defective mark 21.

With the lower light source 42 turned on and the upper light source 41 turned off,
An image of an area including one chip is captured by a CCD camera 5. Since light passes through the scribe line portion of the full-cut wafer 1 and is blocked in the portion of the target chip, the image of the target chip obtained by illuminating the bottom of the wafer is as shown in Figure 3(a).
It becomes as shown in .

An image is captured by a CCD camera 5. The image is decomposed into pixels and electrical signals corresponding to each pixel are sent to the image processing section 6. A signal level for binarizing the image into white and black is set in advance in the image processing unit 6, and when a signal larger than that level comes, it becomes white.

When a signal smaller than that level arrives, it is determined to be black and the image is converted into black and white.

Next, a series of pixels in the X direction is scanned, and a boundary where white is inverted from black or from black to white is recognized as the left end or right end of the chip to be determined.

Next, a series of pixels in the Y direction is scanned, and a boundary where white is inverted from black or from black to white is recognized as the top or bottom edge of the chip.

Next, the arithmetic processing unit 61 calculates the left end and right end position data,
Then, the positional data of the center is calculated from the positional data of the upper end and the lower end, and this is determined as the center of the chip 2 to be determined.

Next, with the lower light source 42 turned off and the upper light source 41 turned on, the CCD camera 5 captures an image of the area including the l chip. FIG. 3(b) schematically shows an image of a chip by illuminating the top of the wafer, where 2 represents a chip to be determined and 21 represents a defective mark.

The image captured by the CCD camera 5 is decomposed into pixels, and electrical signals corresponding to each pixel are sent to the image processing section 6.

A signal level for binarizing the image into white and white is set in advance in the image processing unit 6.

When a signal larger than that level comes, it is judged as white, and when a signal smaller than that level comes, it is judged as black, and the image is converted into black and white. At this time, in order to determine that even if there is black pattern noise, it is white, the binarization level is set closer to the black part.

The mark detection unit 62 detects and determines whether there is black or white at the chip center position determined in the previous step.

If it is black, it is determined that there is a defective mark, and if it is white, it is determined that there is no defective mark.

FIGS. 4 and 5 are diagrams for explaining the embodiment (2), which is an example of recognizing a defective mark on a large-sized chip as shown in FIG. 10(b).

The defective mark recognition devices used are the defective mark recognition device ■ shown in Fig. 1 and the defective mark recognition device ■ shown in Fig. 6.
Either is fine.

FIG. 4 shows the procedure (2) for determining the presence or absence of defective marks.

FIG. 5 shows an image of the chip, FIG. 5(a).

(b), (c), and (d) are overall views, respectively.

An image of one corner, an image of a diagonal corner, and an image of the center of the chip are shown.

This will be explained below with reference to FIGS. 4 to 6.

As shown in the general view of FIG. 5(a), the images captured by the CCD camera 5 are divided into an image of one corner, an image of a diagonal corner, and an image of the center of the chip.

First, the full-cut wafer l is mounted on the X-Y table 3 so that the left and right ends of the chip are parallel to the Y direction, and the top and bottom ends are parallel to the X direction, and the X-Y table 3 is moved to mark the defective part. The chip 2 to be determined for which the presence or absence of 21 is to be determined is set at a position where an image of its l corner can be captured by the CCD camera 5.

Next, the upper light source 41 is turned on and the CCD camera 5
Image the corner.

FIG. 5(b) shows an image of the l corner captured by the CCD camera 5.

The image is decomposed into pixels and electrical signals corresponding to each pixel are sent to the image processing section 6. A signal level for binarizing the image into white and black is set in advance in the image processing unit 6,
When a signal larger than that level comes, it is judged as white, and when a signal smaller than that level comes, it is judged as black, and the image is converted into black and white.

Next, a series of pixels in the X direction is scanned, and a boundary where white is inverted from black or from black to white is recognized as the left end of the chip 2 to be determined.

Next, a series of pixels in the Y direction is scanned, and a boundary where white is inverted from black or from black to white is recognized as the upper end of the chip 2 to be determined.

Next, the position of the first corner end is recognized as the intersection of a line extending from the left end in the Y direction and a line extending from the top end in the X direction.

Next, the XY table 3 is moved so that a diagonal corner diagonal to one corner of the chip 2 to be determined is located below the CCD camera 5. Since the dimensions of the chip 2 to be judged are known in advance, even if the fully cut wafer 1 is slightly bent or twisted, the X-Y table 3 can be moved to a position where the CCD camera 5 can at least take in the diagonal corner. It is possible to do so.

Next, the CCD camera 5 images the diagonal corners.

FIG. 5(c) shows an image of a diagonal corner captured by the CCD camera 5. FIG.

The image is decomposed into pixels and electrical signals corresponding to each pixel are sent to the image processing section 6. A signal level for converting the image into 24M white and black is set in advance in the image processing unit 6, and when a signal larger than that level comes, it is judged as white, and when a signal smaller than that level comes, it is judged as black. to convert the image into black and white.

Next, a series of pixels in the X direction is scanned, and a boundary where white is inverted from black or from black to white is recognized as the right end of the chip 2 to be determined.

Next, a series of pixels in the Y direction is scanned, and a boundary where white is inverted from black or from black to white is recognized as the lower end of the chip 2 to be determined.

Next, the position of the diagonal corner end is recognized as the intersection of a line extending from the right end in the Y direction and a line extending from the bottom end in the X direction.

Next, the position of the diagonal corner end, the position of the first corner end found earlier, and the X- from the first corner to the diagonal corner.
From the amount of movement of the Y table 3, the arithmetic processing unit 61 calculates the center point on the line connecting the l corner end and the diagonal corner end;2.
Set that as the center of the chip.

Next, X-
Move Y table 3. Then, a region including the center of the chip is imaged.

FIG. 5(d) shows an image of the center of the chip.

The image is decomposed into pixels, and electrical signals corresponding to each pixel are sent to the image processing section 6. 4. The signal level for binarizing the image into white and black is set in the image processing unit 6 in advance. When a signal larger than that level comes, it is judged as white, and when a signal smaller than that level comes, it is judged as black, and the image is converted into black and white. Then, the mark detection section 62 detects and determines whether there is black or white at the chip center position. If it is black, it is determined that there is a defective mark, and if it is white, it is determined that there is no defective mark.

〔Effect of the invention〕

As described above, according to the two aspects of the present invention, when a target chip and an I chip, in which a black and white pattern exists as noise on the chip and it is difficult to recognize a defective mark, and an I chip are captured on the screen at the same time, the scribe line becomes thin.

Moreover, even in a chip to be determined in which the defective mark becomes small on the screen and it becomes difficult to determine the presence or absence of the defective mark, the presence or absence of the defective mark can be determined reliably.

Therefore, when selecting a good chip with no defect marks from a full-cut wafer and die bonding that chip to a lead frame, it is necessary to select a good chip without fail and die bonding that chip to the lead frame. be able to.

[Brief explanation of drawings]

1 to 3 are diagrams for explaining Embodiment I. Figure 1 is a schematic diagram of the defective mark recognition device (■). FIG. 2 shows procedure I for determining the presence or absence of defective marks. FIGS. 3(a) and 3(b) are images of the chip. FIG. 4 and FIG. 5 are diagrams for explaining the embodiment (2). FIG. 4 shows a defect mark presence/absence determiner 111 [U. FIGS. 5(a) to 5(d) are images of the chip. FIG. 6 is a schematic diagram of the defective mark recognition device H. Figure 7 shows a fully cut wafer with defect marks. Figure 8 is an image of the chip taken into the COD camera. Figure 9 is a schematic diagram of a die bonder. FIGS. 10(a) and 10(b) are examples of chips whose defective marks are difficult to recognize. In fig. l is a full cut wafer. 2 is a chip, and the judged chip 21 is a defective mark. 3 is a table, which is an X-Y table. 31 is an X-Y table (fixed part). 32 is the stand. 33 is a mounting section. 41 is the upper light source. 42 is the lower light source. 5 is a camera, which is a CCD camera. 51 is the lens. 6 is an image processing section. 61 is an arithmetic processing unit. 62 is a mark detection section. 7 is an X-Y table drive unit. 8 is a control unit. 9 is a chip transfer arm. 91 is a lead frame supply section. 92 is a lead frame storage section. 93 is the lead frame. 94 is an adhesive supply section. 95 is a bonding arm 96 is an intermediate table. 97 is a wafer supply section. 98 is a defective mark on the lead frame transport section/)! PI constant value I ・'t/2 Figure (α) r7 image lower illumination 1;
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Claims (1)

[Claims] [1] Light passes through a full-cut wafer (1) including a defective chip with a defective mark (21) in the center of the top surface of the chip and including a plurality of chips separated by a scribe line. It is placed on a placing part (33) and illuminated by a lower light source (42) provided below the placing part (33).
A camera (5) installed above captures an image of an area including at least the target chip (2) of the full-cut wafer (1), and the image is binarized by an image processing unit (6). a step of obtaining positional data of the external edge of the chip (2); and a calculation processing unit (61) from the positional data of the external edge of the chip (2) to be determined, position data of the center of the chip (2) to be determined; A step of calculating an image of the chip to be determined (2) by illuminating it with an upper light source (41) provided above the mounting section (33) and capturing an image of the chip to be determined (2) by the camera (5).
), and the image is processed by the image processing unit (6).
The present invention is characterized by comprising a step of converting into a value to obtain detection data, and a step of detecting and determining the presence or absence of a defective mark in the position data of the center of the chip calculated from the detection data using the mark detection section (62). A method for manufacturing a semiconductor device. [2] A full-cut wafer (1) containing a defective chip with a defective mark (21) in the center of the top surface of the chip and a plurality of chips separated by a scribe line is placed on a table (3).
), and the upper light source (
A camera (41) installed above the table (3) captures an image of one corner of the chip to be determined (2)
5), the image is binarized by the image processing unit (6), and the position data of the one corner end is obtained; and the table (3) is moved relative to the camera (5). The camera (5) captures an image including a diagonal corner portion diagonal to the first corner end, and the image processing unit (6) binarizes the image to obtain position data of the diagonal corner end. the center of a line segment connecting the position data of the one corner end and the position data of the diagonal corner end is calculated by the arithmetic processing unit (61), and the center of the line segment is calculated by the arithmetic processing unit (61), and the center of the line segment is calculated by the calculation processing unit (61),
2) determining the center position data, and moving the table (3) relative to the camera (5) to obtain an image of the center position data of the chip to be determined (2). is captured by the camera (5), the image is binarized by the image processing unit (6), and the image is binarized by the chip to be determined (2).
A method for manufacturing a semiconductor device, comprising the step of: detecting and determining the presence or absence of a defective mark in the position data of the center using a mark detection section (62).