JPH02235360A - Semiconductor device - Google Patents

Abstract

PURPOSE:To prevent the generation of a recess at the tine of hermetic sealing even in the case of a large lid by installing a supporting stud part to support the lid from the inside, in the lid and a vessel which seal a semiconductor element. CONSTITUTION:At the central part of a vessel 1, a die pad part 2 for mounting a semiconductor element is formed, around which inner lead mounting parts 3, 4 are formed step-wise. A semiconductor element 5 is mounted on the die pad part 2. A square type stud part 15 is installed at each corner of the die pad part 2. The length of the part 15 is so set that the upper end comes into contact with the inner surface of a lid 13, and the lid 13 is retained from the inside by four points. By this constitution, the lid 13 can be prevented from being depressed in the case of hermetic sealing, and the generating of failures caused by mutual contact of metal thin wires 12 connecting each electrode of the semiconductor element with the inner leads 8, 9 corresponding with each of the above electrodes can be prevented.

Description

DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] This invention relates to a semiconductor device, and particularly to improvements in the sealed portion thereof. [Prior Art] FIGS. 5 and 6 show the structure of a conventional semiconductor device, with FIG. 5 being a side sectional view and FIG. 6 being a sectional perspective view. In these figures, (1) is a container made of ceramic or the like, which has a die pad part 1 for mounting a semiconductor element formed approximately in the center, and a stepped inner lead mounting part (31) around it.
4]. (5l is the semiconductor element attached to the die pad part, (6) is the plurality of electrodes provided on the semiconductor element, ■ is the brazing material that fixes the semiconductor element to the die pad part, and Au-Si, solder, etc. are used. (8l is the internal lead fixed to the lower internal lead mounting part B),
(9) is also an internal lead fixed to the upper internal lead attachment part (A), external lead (11) is connected to the internal lead hole and extends outside the container, and (11) is also an internal lead (
9) and an external lead extending outside the container, (l2
) is a thin metal wire such as aluminum that connects each electrode of the semiconductor element and the corresponding internal lead, {l3} is a lid attached to the end face of the container to isolate and seal the semiconductor element from the external atmosphere, 14》 is a sealing material inserted between the lid and the container. Note that the internal lead attachment parts (3) and (4) are only one stage when the number of electrodes on the semiconductor element is small. However, when the number of electrodes increases due to the expansion of the functionality of the semiconductor element, the internal lead mounting parts (3) and (4) Since the number also increases, a two-tiered structure is used as shown in the figure.
In some cases, there may be a multi-tiered structure. [Problem to be solved by the invention] Since the conventional semiconductor device is configured as described above,
With the increase in the number of electrodes in semiconductor devices, the mounting part under the internal lead (
3) (The number of stages of 41 has increased, and the lid (l3) has increased accordingly.
The dimensions of become larger. However, the lid (l3) is as shown in Figures 5 and 6.
Since the structure is such that only the surrounding area is fixed to the container {1), when the inside of the container is made into a vacuum state for airtight sealing, a dent is formed in the lid (l3) as shown in FIG. As a result of the deformation, the thin metal wires connected to the upper internal lead attachment part were contacted and deformed, which could result in defects such as shorts due to contact between the thin metal wires. The present invention has been made to solve these problems, and aims to provide a semiconductor device that does not form a dent during hermetically sealing even if the lid becomes large. [Means for Solving the Problems] A semiconductor device according to the present invention is such that a support portion for supporting the lid from the inside is provided inside the container. [Function] According to the present invention, since the tip of the support portion provided inside the container reaches the inner surface of the lid and supports the lid from inside, deformation of the lid can be prevented during airtight sealing.

[Embodiments of the invention]

An embodiment of this invention will be explained below with reference to the drawings. 1st
The figure is a side sectional view of the embodiment, and FIG. 2 is a sectional perspective view. In these figures, (15) is a prismatic support part provided at each corner of the die pad part, and the upper end is the lid (l).
The length is such that it touches the inner surface of II (1) at four points.
3) is supported from the inside. The rest of the configuration is the same as the conventional device, so the explanation will be omitted. This embodiment is constructed as described above, and the die pad section ■
Since the II (13) is supported from the inside by four supporting parts (l5) provided at each corner of the metal No defects occur due to mutual contact of the thin wires (l2). 3 and 4 are side cross-sectional views showing other embodiments of the present invention, in which the lower internal lead mounting portion B) is provided with a support portion (15);
The figure shows a support part (I5) provided in the upper internal lead attachment part (A). In either embodiment, effects similar to those shown in FIGS. 1 and 2 can be expected.

〔Effect of the invention〕

As described above, according to the present invention, since the support part that supports the lid from the inside is provided in the container, even if the lid becomes larger due to the increase in the number of electrodes of semiconductor elements, it will not be deformed, and therefore reliability will be improved. And a semiconductor device with high productivity can be obtained.

[Brief explanation of the drawing]

FIG. 1 and FIG. 2 show an embodiment of this invention.
FIG. 1 is a side sectional view, FIG. 2 is a sectional perspective view, FIGS. 3 and 4 are side sectional views showing other embodiments of the present invention, and FIGS. 5 and 6 are side sectional views showing a conventional semiconductor device. 5 is a side sectional view, and FIG. 6 is a sectional perspective view. In the figure, (1) is the container, ■ is the die pad part, (3
) 141 is the internal lead attachment part, (5) is the semiconductor element, (
6) is an electrode, (81 (91) is an internal lead, (l1) is an external lead, (12) is a thin metal wire, (13) is a base, (1
5) is a support part. In addition, in the figures, the same reference numerals indicate the same or equivalent parts. Agent Patent Attorney Masu Oiwa 11 yen 1 ts: l #t Sai Imada 3 Nagi 74 Diagram

Claims (1)

[Claims] A container for accommodating a semiconductor device, a lead provided in the container and comprising an internal lead connected to an electrode of the semiconductor device, and an external lead connected to the internal lead and extending outside the container, and attached to the container. A semiconductor device comprising: a lid that seals the semiconductor element; and a support portion that is provided in the container and supports the lid from inside.