JPH022318B2 - - Google Patents

Info

Publication number
JPH022318B2
JPH022318B2 JP59170893A JP17089384A JPH022318B2 JP H022318 B2 JPH022318 B2 JP H022318B2 JP 59170893 A JP59170893 A JP 59170893A JP 17089384 A JP17089384 A JP 17089384A JP H022318 B2 JPH022318 B2 JP H022318B2
Authority
JP
Japan
Prior art keywords
ceramic
laminated
ceramic capacitor
multilayer
green sheets
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP59170893A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6148996A (ja
Inventor
Hisashi Honda
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
NEC Corp
Original Assignee
Nippon Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nippon Electric Co Ltd filed Critical Nippon Electric Co Ltd
Priority to JP59170893A priority Critical patent/JPS6148996A/ja
Publication of JPS6148996A publication Critical patent/JPS6148996A/ja
Publication of JPH022318B2 publication Critical patent/JPH022318B2/ja
Granted legal-status Critical Current

Links

Landscapes

  • Production Of Multi-Layered Print Wiring Board (AREA)
JP59170893A 1984-08-16 1984-08-16 セラミツク多層配線基板の製造方法 Granted JPS6148996A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59170893A JPS6148996A (ja) 1984-08-16 1984-08-16 セラミツク多層配線基板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59170893A JPS6148996A (ja) 1984-08-16 1984-08-16 セラミツク多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPS6148996A JPS6148996A (ja) 1986-03-10
JPH022318B2 true JPH022318B2 (fr) 1990-01-17

Family

ID=15913267

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59170893A Granted JPS6148996A (ja) 1984-08-16 1984-08-16 セラミツク多層配線基板の製造方法

Country Status (1)

Country Link
JP (1) JPS6148996A (fr)

Families Citing this family (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2555638B2 (ja) * 1987-10-07 1996-11-20 株式会社村田製作所 多層セラミック基板の製造方法
JP2555639B2 (ja) * 1987-10-07 1996-11-20 株式会社村田製作所 多層セラミック基板の製造方法
JPH0632384B2 (ja) * 1987-12-22 1994-04-27 株式会社住友金属セラミックス 積層セラミック基板の製造方法

Also Published As

Publication number Publication date
JPS6148996A (ja) 1986-03-10

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