JPH022315B2 - - Google Patents
Info
- Publication number
- JPH022315B2 JPH022315B2 JP55149464A JP14946480A JPH022315B2 JP H022315 B2 JPH022315 B2 JP H022315B2 JP 55149464 A JP55149464 A JP 55149464A JP 14946480 A JP14946480 A JP 14946480A JP H022315 B2 JPH022315 B2 JP H022315B2
- Authority
- JP
- Japan
- Prior art keywords
- linear expansion
- laminate
- fiber
- semiconductor device
- cloth
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 239000000835 fiber Substances 0.000 claims description 58
- 239000004744 fabric Substances 0.000 claims description 38
- 239000004065 semiconductor Substances 0.000 claims description 33
- 239000002131 composite material Substances 0.000 claims description 29
- 239000004760 aramid Substances 0.000 claims description 20
- 229920003235 aromatic polyamide Polymers 0.000 claims description 20
- 229920005989 resin Polymers 0.000 claims description 20
- 239000011347 resin Substances 0.000 claims description 20
- 239000003365 glass fiber Substances 0.000 claims description 12
- 239000002184 metal Substances 0.000 claims description 11
- 229910052751 metal Inorganic materials 0.000 claims description 11
- 238000000465 moulding Methods 0.000 claims description 2
- 239000002759 woven fabric Substances 0.000 claims 1
- 239000000758 substrate Substances 0.000 description 28
- 229910000679 solder Inorganic materials 0.000 description 18
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 14
- 238000005219 brazing Methods 0.000 description 12
- 239000003822 epoxy resin Substances 0.000 description 12
- 229920000647 polyepoxide Polymers 0.000 description 12
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 11
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 11
- 229910052710 silicon Inorganic materials 0.000 description 11
- 239000010703 silicon Substances 0.000 description 11
- 229920001187 thermosetting polymer Polymers 0.000 description 10
- 239000000463 material Substances 0.000 description 9
- 229910052802 copper Inorganic materials 0.000 description 8
- 239000010949 copper Substances 0.000 description 8
- 239000000945 filler Substances 0.000 description 8
- 239000011521 glass Substances 0.000 description 8
- ZWEHNKRNPOVVGH-UHFFFAOYSA-N 2-Butanone Chemical compound CCC(C)=O ZWEHNKRNPOVVGH-UHFFFAOYSA-N 0.000 description 6
- WRDNCFQZLUCIRH-UHFFFAOYSA-N 4-(7-azabicyclo[2.2.1]hepta-1,3,5-triene-7-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1C2=CC=C1C=C2 WRDNCFQZLUCIRH-UHFFFAOYSA-N 0.000 description 6
- 239000004020 conductor Substances 0.000 description 6
- 239000011889 copper foil Substances 0.000 description 6
- 230000000052 comparative effect Effects 0.000 description 5
- 239000011229 interlayer Substances 0.000 description 5
- 239000010410 layer Substances 0.000 description 5
- 239000002966 varnish Substances 0.000 description 5
- 239000004593 Epoxy Substances 0.000 description 4
- 229920000271 Kevlar® Polymers 0.000 description 4
- 239000004761 kevlar Substances 0.000 description 4
- 239000011159 matrix material Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 230000001351 cycling effect Effects 0.000 description 3
- 238000010586 diagram Methods 0.000 description 3
- XNWFRZJHXBZDAG-UHFFFAOYSA-N 2-METHOXYETHANOL Chemical compound COCCO XNWFRZJHXBZDAG-UHFFFAOYSA-N 0.000 description 2
- XRASRVJYOMVDNP-UHFFFAOYSA-N 4-(7-azabicyclo[4.1.0]hepta-1,3,5-triene-7-carbonyl)benzamide Chemical compound C1=CC(C(=O)N)=CC=C1C(=O)N1C2=CC=CC=C21 XRASRVJYOMVDNP-UHFFFAOYSA-N 0.000 description 2
- XXBDWLFCJWSEKW-UHFFFAOYSA-N dimethylbenzylamine Chemical compound CN(C)CC1=CC=CC=C1 XXBDWLFCJWSEKW-UHFFFAOYSA-N 0.000 description 2
- 238000009661 fatigue test Methods 0.000 description 2
- 239000011888 foil Substances 0.000 description 2
- 238000010438 heat treatment Methods 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 229910052718 tin Inorganic materials 0.000 description 2
- 238000009941 weaving Methods 0.000 description 2
- QTWJRLJHJPIABL-UHFFFAOYSA-N 2-methylphenol;3-methylphenol;4-methylphenol Chemical compound CC1=CC=C(O)C=C1.CC1=CC=CC(O)=C1.CC1=CC=CC=C1O QTWJRLJHJPIABL-UHFFFAOYSA-N 0.000 description 1
- 229910021578 Iron(III) chloride Inorganic materials 0.000 description 1
- 229920003369 Kevlar® 49 Polymers 0.000 description 1
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical class C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 1
- 239000000969 carrier Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 229930003836 cresol Natural products 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 1
- 238000005553 drilling Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000014509 gene expression Effects 0.000 description 1
- RBTARNINKXHZNM-UHFFFAOYSA-K iron trichloride Chemical compound Cl[Fe](Cl)Cl RBTARNINKXHZNM-UHFFFAOYSA-K 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000005259 measurement Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 238000013021 overheating Methods 0.000 description 1
- AQZYBQIAUSKCCS-UHFFFAOYSA-N perfluorotripentylamine Chemical compound FC(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)N(C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)C(F)(F)F AQZYBQIAUSKCCS-UHFFFAOYSA-N 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 238000001259 photo etching Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
- 239000002356 single layer Substances 0.000 description 1
- 239000002904 solvent Substances 0.000 description 1
- 238000010998 test method Methods 0.000 description 1
- 229920006337 unsaturated polyester resin Polymers 0.000 description 1
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14946480A JPS5773990A (en) | 1980-10-27 | 1980-10-27 | Leadless semiconductor device mounting structure |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP14946480A JPS5773990A (en) | 1980-10-27 | 1980-10-27 | Leadless semiconductor device mounting structure |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5773990A JPS5773990A (en) | 1982-05-08 |
| JPH022315B2 true JPH022315B2 (de) | 1990-01-17 |
Family
ID=15475696
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP14946480A Granted JPS5773990A (en) | 1980-10-27 | 1980-10-27 | Leadless semiconductor device mounting structure |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5773990A (de) |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS533487A (en) * | 1976-06-30 | 1978-01-13 | Matsushita Electric Works Ltd | Laminates |
| JPS5530974A (en) * | 1978-08-29 | 1980-03-05 | Toray Industries | Fabric construction for composite material |
| JPS5553497A (en) * | 1978-10-14 | 1980-04-18 | Matsushita Electric Works Ltd | Method of manufacturing multilayer printed circuit board |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4896258U (de) * | 1972-02-18 | 1973-11-15 |
-
1980
- 1980-10-27 JP JP14946480A patent/JPS5773990A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS533487A (en) * | 1976-06-30 | 1978-01-13 | Matsushita Electric Works Ltd | Laminates |
| JPS5530974A (en) * | 1978-08-29 | 1980-03-05 | Toray Industries | Fabric construction for composite material |
| JPS5553497A (en) * | 1978-10-14 | 1980-04-18 | Matsushita Electric Works Ltd | Method of manufacturing multilayer printed circuit board |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5773990A (en) | 1982-05-08 |
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