JPH0223010Y2 - - Google Patents
Info
- Publication number
- JPH0223010Y2 JPH0223010Y2 JP1983104693U JP10469383U JPH0223010Y2 JP H0223010 Y2 JPH0223010 Y2 JP H0223010Y2 JP 1983104693 U JP1983104693 U JP 1983104693U JP 10469383 U JP10469383 U JP 10469383U JP H0223010 Y2 JPH0223010 Y2 JP H0223010Y2
- Authority
- JP
- Japan
- Prior art keywords
- glass
- insulating substrate
- intermediate layer
- inorganic powder
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 41
- 239000011521 glass Substances 0.000 claims description 28
- 239000000843 powder Substances 0.000 claims description 19
- 239000013078 crystal Substances 0.000 claims description 11
- 238000002425 crystallisation Methods 0.000 claims 1
- 230000008025 crystallization Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 description 17
- 239000004020 conductor Substances 0.000 description 13
- 239000011230 binding agent Substances 0.000 description 5
- 238000000926 separation method Methods 0.000 description 3
- 239000000919 ceramic Substances 0.000 description 2
- 239000004973 liquid crystal related substance Substances 0.000 description 2
- 239000000155 melt Substances 0.000 description 2
- 230000008018 melting Effects 0.000 description 2
- 238000002844 melting Methods 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 229910018072 Al 2 O 3 Inorganic materials 0.000 description 1
- 239000005388 borosilicate glass Substances 0.000 description 1
- 239000004568 cement Substances 0.000 description 1
- 230000008602 contraction Effects 0.000 description 1
- 230000007423 decrease Effects 0.000 description 1
- 238000010304 firing Methods 0.000 description 1
- 239000011810 insulating material Substances 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000007750 plasma spraying Methods 0.000 description 1
- 239000004576 sand Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052709 silver Inorganic materials 0.000 description 1
- 238000005476 soldering Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
Landscapes
- Gas-Filled Discharge Tubes (AREA)
- Structure Of Printed Boards (AREA)
- Manufacturing Of Printed Wiring (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983104693U JPS6013766U (ja) | 1983-07-06 | 1983-07-06 | 基板構造 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983104693U JPS6013766U (ja) | 1983-07-06 | 1983-07-06 | 基板構造 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS6013766U JPS6013766U (ja) | 1985-01-30 |
JPH0223010Y2 true JPH0223010Y2 (enrdf_load_stackoverflow) | 1990-06-21 |
Family
ID=30245717
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983104693U Granted JPS6013766U (ja) | 1983-07-06 | 1983-07-06 | 基板構造 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS6013766U (enrdf_load_stackoverflow) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP5773630B2 (ja) * | 2010-12-03 | 2015-09-02 | 京セラ株式会社 | 発光素子搭載用基板およびその製造方法 |
JP5967836B2 (ja) * | 2012-03-14 | 2016-08-10 | 日本特殊陶業株式会社 | セラミック基板およびその製造方法 |
-
1983
- 1983-07-06 JP JP1983104693U patent/JPS6013766U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS6013766U (ja) | 1985-01-30 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US4835038A (en) | Substrate coated with multiple thick films | |
KR19980701656A (ko) | 세라믹 회로 보드 지지 기판용 글라스 본딩 층 | |
JPH1075060A (ja) | 多層ガラス・セラミック基板の製造方法 | |
JPH0223010Y2 (enrdf_load_stackoverflow) | ||
JP3201118B2 (ja) | チップ抵抗器 | |
JPH08222478A (ja) | チップ型電子部品 | |
JP3398294B2 (ja) | 電子部品収納用パッケージ | |
JPH11340005A (ja) | チップ型電子部品 | |
JP2001284754A (ja) | ガラスセラミック回路基板 | |
JPS63226016A (ja) | チツプ型電子部品 | |
JP2001126901A (ja) | チップ部品 | |
JP3622852B2 (ja) | サーミスタの製造方法 | |
JP2002164246A (ja) | 電子部品 | |
JP2002076609A (ja) | 回路基板 | |
JPS61183152A (ja) | ガラス基板 | |
JP2763470B2 (ja) | 配線基板 | |
JP3182986B2 (ja) | チップ型圧電共振子 | |
JPH0869938A (ja) | 積層セラミックコンデンサ及びその製造方法 | |
JPH0515698Y2 (enrdf_load_stackoverflow) | ||
JP2000049431A (ja) | セラミック回路基板 | |
JPH0414919Y2 (enrdf_load_stackoverflow) | ||
JPS6381894A (ja) | セラミツクス回路基板の製造方法 | |
JP2001339155A (ja) | セラミック回路基板 | |
JP3457841B2 (ja) | 電子部品収納用容器 | |
JP2516606Y2 (ja) | 表面実装型電子部品 |