JPH02222155A - Die bonding apparatus - Google Patents

Abstract

PURPOSE:To make an apparatus compact and to improve indexes by overlapping pellet supporting rings, taking out the pellets with the swing of a common rotary shaft, making it possible to rotate a collet shaft in the direction of theta, using the single shafts for stamping head and the mounting head, and selectively using the collet and stamping probe. CONSTITUTION:A supporting ring 2 of a pellet 1 is attached to an X-Y table 3 through a rotary shaft 4 and made to swing. The pellet is pushed up with 4 pin 12 and sucked with a collect 14 of a collet shaft 13. Meanwhile, the positions of the pellet 1 on the supporting ring 2 and a lead frame 5 are inputted into a microcomputer 34 through cameras 7. An X-Y table 35 and the table 3 are moved based on the correcting values. The pellet 1 is moved and mounted on a bonding agent layer 6 in parallel. The correcting value of theta is sent into a pulse motor 17. The amount of rotation is transferred to the collet shaft 13 through a pin 24 and a supporting post 25, and correction is performed. The bonding pressure is adjusted with an electromagnetic pressure changing part 18 at the upper end of the collet shaft 13 and a spring 19. The collet 14 and a stamping probe 10 are adequately selected and used.

Description

[Detailed Description of the Invention] [Object of the Invention] (Industrial Application Field) The present invention relates to a semiconductor assembly process, and in particular, to a die bonding process in an assembly apparatus for a die bonding process (hereinafter referred to as a die bonding apparatus). Concerning improvements in bonding mechanisms.

(Conventional technology) The assembly process of integrated circuit elements and individual semiconductor elements has been automated earlier than the pre-processing process of building elements and circuits onto semiconductor substrates, and bonders and die bonding equipment have been developed and put into practical use. This has greatly contributed to improving productivity.

Die bonding apparatuses having somewhat different structures are used depending on the type of semiconductor element to be processed, ie, an integrated circuit element or the like, and a light emitting element or the like.

Incidentally, manufacturing equipment at production sites naturally strives to improve the index with the aim of improving productivity, and the outline of the die bonding equipment will be explained with reference to FIG. When assembling integrated circuit elements and individual semiconductor elements, it is common to use a frame such as a glass epoxy substrate, and the integrated circuit elements and individual semiconductor elements are assembled on the bed formed on the frame. The elements (semiconductor elements to be described later include both) are die-bonded, but an adhesive is used instead of a mold that uses a known metal layer or solder layer.

As shown in FIG. 2, this type of die bonding apparatus is divided into the following mechanisms. That is, the bed part (not shown)
There are a lead frame (LeadFrame) formed thereon, that is, a magazine 51 for storing a metal member 50, and a frame chuck stage (Chuck Stage) 52 for arranging the metal member 50 and performing a die bonding process. In addition, a metal support ring 53 (hereinafter referred to as support ring)
A semiconductor wafer that has undergone a dicing process is pasted on the film, and then this film is stretched and subjected to a braking process to install semiconductor belens I to 54 for die bonding. be done. It is further divided into a collet 55 that fixes the semiconductor pellet 54 by suction, a camera section 56 that takes pictures of the frame chuck stage 52 and the metal member 50, and a gauging section 57. The die bonding device that uses adhesive as described above does not perform the so-called scrubbing motion of the collet 55, but instead uses a bead portion (not shown in the drawings, hereinafter referred to simply as the metal member 50) formed on the metal member 50. A method has been adopted in which semiconductor pellets are simply placed on an adhesive layer placed on the substrate.

The positional correction between the bellows 1 and the support ring 53 is performed using first and second XY tables 58 and 59 attached to the support ring 53 and the frame chuck stage 52, and a gauging section 57. Of course, both X-Y tables 5
At 8.59, a calculation section (not shown) including a microcomputer and the like is installed which calculates a correction value from the image obtained by the camera section 56 and the standard positional relationship.

When sucking the semiconductor pellets 54 fixed to the membrane attached to the support ring 53 to the cholera (~55), the corresponding semiconductor pellets 5 are removed by the push-up bar 60 disposed below the cholera.
A method is adopted in which the metal member 4 is pushed up, conveyed to the gauging section 57, and then sucked by another collet and conveyed to the metal member 50. In addition, in order to install the adhesive layer on the metal member 50, the adhesive layer housed in the paste rotary table 62 is stamped with a stamping needle (e).
61 and then applied to the bed portion of the metal member 50.

By the way, the semiconductor pellet 54 sucked into the collet 55
The position of the semiconductor pellets is corrected by applying a pre-king process to the semiconductor pellets by stretching the film as described above, so the semiconductor pellets are not arranged in a perfectly aligned state and are somewhat meandering. Therefore, if it is sucked into the collet 55 as it is, it will be mounted in that positional relationship, causing problems in the subsequent bonding process.

For this purpose, the semiconductor pellet (the back surface opposite to the element area is formed flat due to the use of a semiconductor substrate) and the metal member are arranged in parallel by position correction by the camera section 56 and the calculation section, and the gauging section 57 The inclination, ie, θ, of the semiconductor pellet 54 is mechanically corrected to ensure wetting of the adhesive layer.

(Problem to be Solved by the Invention) In such a method, as the dimensions of the semiconductor pellets 1~ increase or the number thereof increases, the diameter of the X-Y table increases, and the area occupied by the entire device increases. Furthermore, the presence of the gauging section requires a plurality of collets, resulting in a complicated structure.

In addition, multiple stamping needles and mounting collets are formed in each vertically movable single head (not shown), which not only complicates the mechanism but also increases the weight of the device. It's blocking the index. As devices become more complex and larger,
The reality is that improvements are desired in terms of increased costs and maintenance.

The present invention has been made in view of the above circumstances, and in particular, it is an object of the present invention to provide a die bonding device that has an improved index of the device itself by realizing miniaturization and low cost.

Structure of the Invention C] (Means for Solving the Problems) A support ring to which a membrane is attached, a plurality of semiconductor pellets held by the membrane, and a push-up that pushes a single semi-sensitive pellet I~ from the back side. A pin, a rotating shaft that is commonly attached to a plurality of support rings that are arranged one on top of the other, a first X-Y table that makes this rotating shaft movable, a mechanism that allows the support ring to rotate freely, and a semiconductor pellet mount. A metal member that
A second X-Y table to be installed on the metal member, a camera member to be attached to the support ring to take pictures of the semiconductor pellet and the metal member, a collet to suck the semiconductor pellet, and a collet I~shaft to attach the collet to, installed here. It is equipped with a rotation mechanism and a calculation unit electrically connected to the rotation mechanism and the first and second X-Y tables, and the calculation unit compares the semiconductor pellet obtained by the camera member, the metal member position, and the standard position. However, the die bonding apparatus according to the present invention is characterized in that the amount of movement of the first and second XY tables and the amount of rotation of the collet are determined based on this.

(Function) In the die bonding apparatus according to the present invention, a plurality of support rings each having a film attached thereto with a plurality of semiconductor pellets attached thereto are stacked, and a rotation axis (swing) (
In addition, since the collet shaft is configured to rotate in the 0 direction, a single collet can be placed in a single head by omitting the gauging part of conventional equipment. , X of the semiconductor element is attracted here.

A method was adopted in which the Y direction was transported by an X-Y table, and the rotation at an angle θ was corrected during transport using a rotation mechanism, that is, a pulse motor installed in the head. This greatly contributed to miniaturization and lower prices.

Furthermore, the stamping head and the mount head have each achieved weight reduction as axle heads, greatly contributing to the improvement of the index. The stamping needle and collet according to the dimensions of the semiconductor pellet loaded in the conventional equipment are stocked on the X-taple of the feeder.
) It has a structure that allows it to be used by replacing it at will.

With this structure, the index for mounting a single semiconductor pellet was improved from the conventional 1.2 seconds to 0.9 seconds.

(Embodiment) An embodiment of the present invention will be described with reference to FIGS. 1a, b, and c. That is, as shown in the schematic diagram of FIG. 1a,
The difference from conventional die bonding equipment is that a plurality of support rings 2 that hold semiconductor pellets 1 with membrane bodies (not shown) are attached to the first XY child table, and the support rings 2 are The point is that the rotating shaft 4 allows swinging.

Second, the metal member 5 (accurately referred to as the bed part, but this expression will be used hereafter) consisting of a lead frame on which the semiconductor belenium 1-1 is mounted has a columnar adhesive layer 6...
are arranged, and correction values for the positions of the metal member 5 and the semiconductor pellet 1 are determined by the camera member 7 and a calculation section electrically connected thereto.

The X-Y tables placed in each area are moved according to this value to the normal position. In addition, the inclination, that is, θ, of the semiconductor pellet 1 is corrected by the operation of the rotation mechanism installed here when the semiconductor pellet 1 is transported by the collet, and the gauging part is omitted and the tilt is fixed on a single collet shaft. It is equipped with a collet to reduce weight and simplify the structure. Next, details will be explained below. That is, a rotating shaft 4 is attached to the support ring 2 that holds the semiconductor pellet, and both components are attached to the first X-Y table 3 or the An air cylinder (not shown) located at a location is connected to the rotating shaft to enable swing movement of the support ring 2.

For example, a semiconductor substrate (not shown) on which a semiconductor element is driven is attached to an organic film stretched over the support ring 2 . This is a Blade Dic.
The dicing line (Dici
ngLjne) to the middle of the thickness, and by stretching the attached organic film membrane, it is separated into individual semiconductor pellets. Therefore, the individual semiconductor berenes 1~ are attached to the organic film membrane in a somewhat meandering state.

On the other hand, the lead frame, that is, the metal member 5 on which the semiconductor pellets are mounted, is placed in a stacked state 8 so that it can be moved downwards, and is transported from there to the frame chuck stage 9 in preparation for the die bonding process. . This metal member 5 is selectively used for so-called DIR, SIP, or a mixture of both, depending on the type of semiconductor pellet, but as described above, the metal member 5 on which the semiconductor pellet 1 is mounted has an adhesive layer as shown in the figure. 6... are installed in a column shape with a stamping needle 10. In this step, the adhesive layer 6 stored in the rotary container 11 is applied to a predetermined metal member 5 using a stamping needle 10 .

The semiconductor pellet 1- held by the support ring 2 is pushed up by a push-up pin 12 arranged on the back side, and then
The semiconductor pellet 1 is moved by the collet 14 attached here by moving the collet shaft 13 which is movable in two directions.
- to attract. As is clear from the enlarged view of the main part in Figure 1, the collet shaft J3 has a hollow part 15 connected to the pressure reducing mechanism.
is formed, and the semiconductor pellets 1-1 are attracted to the cholera 1 to 14 by the reduced pressure state maintained by the operation of the pressure reducing mechanism.

In addition, to attach the collet 14 to the collet 1 to the shaft 13, as shown in Figure 1, the pipe 16 installed at the tip of the collet shaft 13 is connected to the decompression mechanism for holding the collet, and the resulting reduced pressure state A collet 14 is fixed to the part.

The collet shaft 13 is rotatable by a rotation mechanism shown in FIG. 1, which includes an attached pulse motor 17 and the like. A collet shaft 13, which is a part of the collet shaft 13, is provided with a collet 14 at its tip, and a pressurizing force changing portion 18 at its upper end (indicating a position away from the collet). Also,
A spring 19 is installed between the rotation mechanism and the cholera 1-14 to adjust the pressure applied to the cholera 1-14.

I will not give a separate number for the rotating mechanism, but Kore I~
A pulley 21 is installed integrally with the first bearing mechanism 20 that is attached surrounding the shaft 13, and a small pulse motor 17 that functions as an O correction is connected to the pulley 20, and another pulley 22 and a pulley 21 are connected to each other. A timing belt 23 connects between the two. Furthermore, in order to transmit the rotation of the small pulse motor 17 to the collet shaft 13, a pin 24 is provided on another pulley 22, and a support 2 is provided between the pin 24 and the collet shaft 13.
5 is installed to constitute a rotation mechanism.

As mentioned above, the pressurizing force changing section j8 is installed at the upper end of the collet shaft 13, and an enlarged view thereof is shown in FIG. 1C.

This adjusts the bonding pressure of the collet 14 in cooperation with the spring 19, and the pressure directed downwards of the spring 19, that is, in the direction of the collet 1-14, is adjusted by electromagnetic force, which will be described later, to achieve a predetermined die bonding. It's about gaining pressure.

As shown in FIG. 1C, a pressing force adjustment lever 28 is attached to the blanket 26 installed at the upper end of the collet shaft 13 via a second bearing portion 27. This lever 28 extends vertically via a fulcrum 29 and is integrated with the coil 30. In order to generate the electromagnetic force, an armature 30 and a permanent magnet 31 are arranged with a coil 30 in between, and the permanent magnet 31
is a stand (not shown) that supports this die bonding device.
Fix it to the fixed blanket 33 attached to.

By the way, the semiconductor belens 1 to 1 held on the support ring 2
As shown in FIGS. 1a and 1b, the positions of the metal member 1 and the metal member 5 are photographed by a camera member 7, such as an image pickup tube, and then input as electrical signals to a calculation unit 34, which is comprised of a microcomputer or the like. The standard positional relationship between the two parts, that is, the x, y, and θ values are input into the calculation unit 34 in advance.
By comparing with this, the positions of the metal member 5 and the semiconductor pellet 1 are corrected, and a second
and moves the LX-Y tables 35 and 3. Further, after that, the semiconductor pellet 1 is transported by the collet 14 toward a predetermined metal member 5, and is placed and fixed in parallel with the adhesive layer 6.

However, if it is necessary to correct the θ value due to the operation of the calculation unit 34, the correction value is
The required amount of rotation is transmitted to the collet shaft 13 via the pin 24 and the column 25, and the correction of the requested angle, ie, the θ value, is completed.

By such adjustment, the semiconductor pellets are arranged parallel to the adhesive layer 6 arranged at a predetermined position, and sufficient wetness necessary for adhesion is ensured, so that adhesive strength is also ensured.

In such a die bonding apparatus, the semiconductor elements 1 of the same type installed on the support ring are rotated at 90 degrees or 1
806 can be changed and mounted on the same metal member 5 without changing the structure. In addition, semiconductor pellet 1
The index required to mount the 1.
This has significantly improved the processing time from 2 seconds to 0.9 seconds, making it possible to improve the productivity of semiconductor pellets.

〔Effect of the invention〕

As described above, the die bonding apparatus according to the present invention has the following features: (1) Support rings that hold a plurality of semiconductor pellets are arranged one on top of the other, and a common rotating shaft is attached to each of them, and only the necessary ones are removed by the swing motion of the supporting rings. The method is to take it out. Therefore, it has a large role to play in downsizing the device.

(2) Since the collet shaft can rotate in the θ direction, it is possible to omit the gauging mechanism that was essential to conventional devices, making it possible to make the device smaller and at lower cost.

(3) The stamping head part and the mounting head part are each an axle head, so they are simple and lightweight. This weight reduction improves the die bonding index of the semiconductor pellet, making it suitable for the dimensions of the semi-sensor pellet. The stamping needles and collets are stocked on the feeder X table and selected according to the required dimensions.

[Brief explanation of the drawing]

FIG. 1a is a schematic diagram showing an embodiment of the present invention;
FIG. 2c is a cross-sectional view and a perspective view showing an enlarged main part of the device, and FIG. 2 is a schematic diagram of the conventional device. 1 Semiconductor pellet 2... Support ring 3.35.
・X-Y table 4 Rotating shaft 6 ・Adhesive layer 7 ・Camera member 5, 8 ・Metal member 9 ・Frame chuck stage 10 ・Stamping needle 11 ・Rotary container 12 ・Push-up pin 13-・・
Collet shaft 14 = collet I5... hollow part
16...Tube 17...Pulse motor 18.
... Pressure force changing part 19 ... Spring 20.
27...Bearing mechanism 21, 22...Pulley 23.
・Timing belt 24・・Pin 25・
Supports 26, 33...Blanket 28/Lever 29
・・Fulcrum 30・・Coil 31・・Armature 32・Permanent magnet 34・・Agent of calculation department Patent attorney Norio Ogo

Claims (1)

[Claims] A support ring to which the film is attached, a plurality of semiconductor pellets held by the film, a push-up pin that pushes a single semiconductor pellet from the back side, a rotating shaft that is commonly attached to the plurality of support rings that are stacked, and A first X-Y table that makes the support ring movable, a mechanism that makes the rotating shaft rotatable, a metal member that mounts the semiconductor pellet, a second X-Y table that is installed on the metal member, and a support. A camera member attached to the ring to take pictures of semiconductor pellets and metal members, a collet that sucks the semiconductor pellets, a collet shaft attached to the collet, a rotation mechanism installed here, a rotation mechanism, and first and second X-Y tables. The calculation unit compares the semiconductor pellet and metal member positions obtained by the camera member with the standard position, and moves the first and second X-Y tables based on the comparison. A die bonding device characterized by determining the rotation amount and the rotation amount of a collet shaft.