JPH0477258U - - Google Patents

Info

Publication number
JPH0477258U
JPH0477258U JP12052190U JP12052190U JPH0477258U JP H0477258 U JPH0477258 U JP H0477258U JP 12052190 U JP12052190 U JP 12052190U JP 12052190 U JP12052190 U JP 12052190U JP H0477258 U JPH0477258 U JP H0477258U
Authority
JP
Japan
Prior art keywords
semiconductor pellet
suction nozzle
pellet surface
nozzle
pick
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP12052190U
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP12052190U priority Critical patent/JPH0477258U/ja
Publication of JPH0477258U publication Critical patent/JPH0477258U/ja
Pending legal-status Critical Current

Links

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は本考案の一実施例を示す半導体ペレツ
トピツクアツプ機構の部分断面側面図、第２図は
本考案の他の実施例を示す半導体ペレツトピツク
アツプ機構の吸着ノズル部における部分断面側面
図、第３図は従来の一例を示す半導体ペレツトピ
ツクアツプ機構の部分断面側面図である。 １，１ａ……吸着ノズル、２，２ａ……レバー
、３……バランスばね、４……電磁石、４ａ……
コイル、４ｂ……鉄芯、５……ストツパ、６……
連結ばね、７……ベアリング、８，８ａ……ノズ
ルガイド、９……支点、１０，１０ａ……ブロツ
ク、１１……ホルダ、１２……コラム、１２ａ…
…支持体。 FIG. 1 is a partially sectional side view of a semiconductor pellet pick-up mechanism showing one embodiment of the present invention, and FIG. 2 is a partially sectional side view of the suction nozzle portion of the semiconductor pellet pick-up mechanism showing another embodiment of the present invention. 3 is a partially sectional side view of a conventional semiconductor pellet pickup mechanism. 1, 1a... Suction nozzle, 2, 2a... Lever, 3... Balance spring, 4... Electromagnet, 4a...
Coil, 4b... Iron core, 5... Stopper, 6...
Connection spring, 7... Bearing, 8, 8a... Nozzle guide, 9... Fulcrum, 10, 10a... Block, 11... Holder, 12... Column, 12a...
...Support.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレツト面と接触するとともに吸着する
吸着するノズルと、この吸着ノズルを前記半導体
ぺレツト面に垂直方向に移動案内するノズルガイ
ドと、前記吸着ノズルが前記半導体ぺレツト面を
押し付ける押圧力を設定する電磁コイルとを有す
ることを特徴とする半導体ペレツトピツクアツプ
機構。 A suction nozzle that contacts and attracts the semiconductor pellet surface, a nozzle guide that moves and guides the suction nozzle in a direction perpendicular to the semiconductor pellet surface, and a pressing force with which the suction nozzle presses the semiconductor pellet surface is set. A semiconductor pellet pick-up mechanism characterized by having an electromagnetic coil.
JP12052190U 1990-11-16 1990-11-16 Pending JPH0477258U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP12052190U JPH0477258U (en) 1990-11-16 1990-11-16

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP12052190U JPH0477258U (en) 1990-11-16 1990-11-16

Publications (1)

Publication Number Publication Date
JPH0477258U true JPH0477258U (en) 1992-07-06

Family

ID=31868423

Family Applications (1)

Application Number Title Priority Date Filing Date
JP12052190U Pending JPH0477258U (en) 1990-11-16 1990-11-16

Country Status (1)

Country Link
JP (1) JPH0477258U (en)

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0266951A (en) * 1988-09-01 1990-03-07 Tokyo Sokuhan Co Ltd Die-bonding apparatus
JPH02222155A (en) * 1989-02-22 1990-09-04 Toshiba Corp Die bonding apparatus

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0266951A (en) * 1988-09-01 1990-03-07 Tokyo Sokuhan Co Ltd Die-bonding apparatus
JPH02222155A (en) * 1989-02-22 1990-09-04 Toshiba Corp Die bonding apparatus

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