JP3737760B2 - Mounting head of component assembly mounting device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention relates to a mounting head of a component assembly mounting apparatus for transporting a chip component to a predetermined position on a substrate such as a silicon wafer.
[0002]
[Prior art]
In recent years, with the demand for speeding up and downsizing of computers and the like, a single substrate, for example, a highly integrated substrate on which a plurality of chip components are mounted on a silicon wafer has been adopted. In order to achieve high integration of the substrate, chip parts and the like conveyed at high speed must be accurately arranged on the silicon wafer.
[0003]
For that purpose, it is necessary that the mounting head for carrying the chip components and the like is position-controlled at high speed and with high accuracy. 3 and 4 are a schematic configuration diagram and a schematic side view of a mounting head in a conventional component assembling and mounting apparatus.
[0004]
3 and 4, reference numeral 20 denotes a mounting head. The mounting head 20 includes a linear slider 22, a collet 24 having a suction hole 25 at the tip, and a bracket 23 for connecting the linear slider 22 and the collet 24. The linear slider 22 forming the mounting head 20 is configured to move up and down on the slide guide 21.
[0005]
Reference numeral 26 denotes, for example, a lens barrel (objective lens) of a camera that performs position confirmation and image processing of a chip part and the like. Reference numeral 27 denotes an attachment part that is sucked into the suction hole 25 at the tip of the collet 24. , 28 is fixed to the rear surface of the collet 24 and is connected to a vacuum pump (not shown) through the bracket 23, 29 is a fixing member for fixing the slide guide 21, and 30 is , A spacer for connecting the fixing member 29 and the component assembly mounting device main body mounting bracket 31 to each other.
[0006]
Here, with reference to FIGS. 3 and 4, a description will be given of a method of transferring the chip component 27 to a predetermined position on a silicon wafer (not shown) by the mounting head 20 in the conventional component assembling and mounting apparatus. For convenience of explanation, the correction stage provided in the middle of normal conveyance will be omitted.
[0007]
First, when the component assembly / mounting apparatus is transferred by a control signal of a control mechanism (not shown), the mounting head 20 attached thereto is brought onto an arrangement table (not shown) on which chip components 27 are arranged. The Thereafter, the linear slider 22 is moved downward by an instruction to move downward by a control signal from a control mechanism (not shown), and is brought onto the chip component 27 to be transported.
[0008]
Thereafter, when the vacuum pump (not shown) is operated, the suction hole 25 at the tip of the collet 24 is brought into a vacuum state through the connecting portion 28 connected thereto, and the chip component 27 is sucked into the suction hole 25. .
[0009]
Then, the component assembling / mounting apparatus is transferred in the direction of the silicon wafer (not shown) by the control signal of the control mechanism described above, and the transfer is completed when the transfer is stopped at a predetermined position of the silicon wafer. The conveyance by the mounting head 20 is performed at a considerably high speed.
[0010]
By the way, for example, when a chip component 27 is sucked into the suction hole 25, a landing impact of the mounting head on the chip component 27 is usually reduced in a component transfer portion (mounting head 20) of a component assembly mounting device such as a semiconductor die bonder. In order not to damage the chip component 27, it is usual to provide a relief mechanism by the linear slider 22 or the like.
[0011]
Further, when the chip part 27 is sucked by the suction hole 25, the chip part 27 is pressed by a separate coil spring or the like so that it is sucked in a predetermined posture. .
[0012]
However, as described above, the conveyance of the chip component 27 is performed at a considerably high speed, and the sliding resistance of the linear slider 22 is reduced as much as possible in order to reduce the damage to the chip component 27 at the time of suction. Although it must be kept small, if the sliding resistance is reduced, the movement of the linear slider 22 is likely to be loose.
[0013]
When the play of the linear slider 22 occurs, a counterclockwise moment acts on the chip component 27 due to the structure and the pressure applied by the coil spring during suction. Accordingly, the chip parts 27 are not attracted to the suction holes 25 of the collet 24 in the correct posture, and thus are not arranged on the silicon wafer at a predetermined interval. That is, the component mounting accuracy is deteriorated.
[0014]
Therefore, in order to eliminate such drawbacks, there has been a method of applying a guide using a static pressure bearing 42 by pneumatic pressure as shown in FIGS. 5 and 6 are a schematic configuration diagram and a schematic side view of a mounting head in a conventional component assembling and mounting apparatus. The same parts as those in FIGS. 3 and 4 are denoted by the same reference numerals, and detailed description thereof is omitted.
[0015]
5 and 6, reference numeral 40 denotes a mounting head. The mounting head 40 includes a linear slider 41, a collet 24 having a suction hole 25 at the tip, and a bracket 43 for connecting the linear slider 41 and the collet 24. And more generally formed. In FIG. 6, the shape of the bracket 43 is different from that in FIG. It is formed in a letter shape.
[0016]
[Problems to be solved by the invention]
However, even in the method of FIGS. 5 and 6, the structure around the static pressure bearing must be enclosed because of its structure, and in order to confirm the operation from the upper camera barrel 26, the method shown in FIG. In this way, the center point of the static pressure bearing 42 and the work point (the point where the chip component 27 is sucked into the suction hole 25) are considerably separated from each other, making it difficult to check from above the work. When the backlash occurs in the constituent members constituting the mounting head 40, the distance between the center of the bearing and the work point becomes larger than that in the configuration shown in FIG. A clockwise moment will act. Therefore, the static pressure bearing 42 needs to have a pressure receiving area that can withstand this moment, and there is a drawback that the whole structure is enlarged.
[0017]
[Means for Solving the Problems]
The present invention has been made to solve such problems, and the invention according to claim 1 provides
A head body 1 having a plurality of stepped through holes 3 and 4 on the upper surface portion 1a and a substantially U-shaped cutout 2 formed between the plurality of stepped through holes 3 and 4,
A plurality of stepped rods 5 and 6 that are inserted into the plurality of stepped through holes 3 and 4 are provided on the front side of the plurality of stepped rods 5 and 6, and are adsorbed to the tip at the center. A connecting member 7 to which a collet 8 provided with a portion 9 is attached;
A camera barrel 12 mounted above the notch 2 formed in the head body 1;
When the head body 1 and the connecting member 7 are assembled to form the mounting head 10, the suction portion 9 of the collet 8 is positioned on a center line connecting the centers of the plurality of stepped through holes 3, 4. It is characterized by comprising.
[0018]
DETAILED DESCRIPTION OF THE INVENTION
DESCRIPTION OF EXEMPLARY EMBODIMENTS Hereinafter, preferred embodiments of the invention will be described with reference to the accompanying drawings. The embodiments described below are preferable specific examples of the present invention, and thus various technically preferable limitations are given. However, the scope of the present invention is particularly limited in the following description. As long as there is no description of the effect, it is not restricted to these aspects.
[0019]
FIG. 1 is a schematic overall perspective view showing a preferred embodiment of a mounting head in a component assembly mounting apparatus according to the present invention, and FIG. 2 is a schematic overall side view of the component assembly mounting apparatus according to the present invention.
[0020]
1 and 2, reference numeral 1 denotes a substantially rectangular parallelepiped head body. Stepped through holes 3 and 4 are formed in front of the upper surface portion 1a (a front surface portion 1b side described later). Further, a substantially U-shaped cutout 2 is formed at a substantially central portion in front of the upper surface portion 1a (a front surface portion 1b side described later). In addition, 1b is a front part, 1c is a side part, 1d is a bottom part.
[0021]
Reference numerals 5 and 6 denote stepped rods inserted into the stepped through holes 3 and 4, respectively, and are erected on the front portions 7 a ₁ and 7 a _{2 of} the substantially U-shaped connecting member 7. Reference numeral 7 b denotes a central portion of the connecting member 7, and 7 c denotes a side portion of the connecting member 7. Reference numeral 8 denotes a collet fixed to the substantially central portion 7 b of the connecting member 7, and reference numeral 9 denotes a suction portion provided at the tip of the collet 8.
[0022]
Reference numeral 10 denotes a mounting head. The mounting head 10 includes a head body 1 having the stepped through holes 3 and 4 and a connection having rods 5 and 6 inserted through the stepped through holes 3 and 4. The member 7 is fixed to a substantially central portion 7b of the connecting member 7 and is formed more generally than a collet 8 having a suction portion 9 at the tip thereof.
[0023]
Reference numeral 11 denotes a mounting part, for example, a chip part, and reference numeral 12 denotes a camera barrel (objective lens) for performing position confirmation and image processing of the chip part, for example. 1 is fixed by a means (not shown) above a notch 2 formed at a substantially central portion in front of the upper surface 1a. Reference numeral 13 denotes a bracket for connecting the head main body 1 and the linear slider 14, reference numeral 15 denotes a spacer for connecting the linear slider 14 and a bracket 16 for mounting the component assembly mounting apparatus main body, and reference numeral 17 denotes a vacuum pump (not shown). It is the connection part connected with.
[0024]
As apparent from FIGS. 1 and 2, in this embodiment, the suction portion 9 provided at the tip of the collet 8 is located on the line connecting the centers of the stepped through holes 3 and 4 described above. It is configured as follows. Further, a substantially U-shaped notch 2 is formed at a substantially central portion of the front surface 1b which is the front of the upper surface 1a of the head body 1, and the chip component is disposed above the notch 2 as described above. A camera barrel (objective lens) 12 for performing position confirmation and image processing is provided. Accordingly, since the center of the camera barrel 12 and the center of the chip component sucked by the sucking portion 9 coincide with each other, the position confirmation and image processing of the chip component etc. are performed from above the camera barrel 12. It can be done easily, quickly and accurately.
[0025]
Further, in this embodiment, the stepped rods 5 and 6 inserted through the stepped through holes 3 and 4 are supplied with air from above the stepped through holes 3 and 4 by a device (not shown). An air slider is configured.
[0026]
That is, since the stepped through holes 3a and 3b (4a and 4b) have a two-stage structure as shown in FIG. 2, even when compressed air (not shown) is supplied, the stepped through holes 3a and 3b (4a and 4b) are arranged around the through holes 3a and 3b. An air film is formed around the stepped rods 5 and 6 through the porous resin (not shown), and this acts as a bearing, so that the sliding resistance is very small. Therefore, the movement of the stepped rods 5 and 6 moving up and down in the stepped through holes 3 and 4 is very smooth, and the chip component 11 is not damaged when the chip component 11 is sucked. Is.
[0027]
Further, since the through-holes 3 and 4 and the rods 5 and 6 have a stepped structure, the compressed air can be pressed and slid like an air cylinder by taking in and out the compressed air in the communication passage to this. In this embodiment, when compressed air of a constant pressure is supplied from the communication passage to the through holes 3 and 4, when this air adsorbs the chip part 11, it is adsorbed in a predetermined posture. For the pressure.
[0028]
Since the adjustment of the pressing force can be easily performed, the pressing force more than necessary for maintaining the posture is not applied. Therefore, the vertical movement of the stepped rods 5 and 6 can be performed smoothly. Together, the chip component 11 is attracted to the suction portion 9 of the collet 8 in a correct posture, and thus the chip component 11 is arranged on the silicon wafer at a predetermined interval. That is, according to the embodiment, the component mounting accuracy is good.
[0029]
Here, with reference to FIG. 1 and FIG. 2, a description will be given of a method of transporting the chip component 11 to a predetermined position on a silicon wafer (not shown) by the mounting head 10 in the component assembling and mounting apparatus according to this embodiment. For convenience of explanation, the correction stage provided in the middle of normal conveyance will be omitted.
[0030]
First, the component assembly / mounting device is transferred by a control signal of a control mechanism (not shown), so that the mounting head 10 attached thereto is brought onto an arrangement table (not shown) on which chip components 11 are arranged. The Thereafter, the linear slider 14 is moved downward by an instruction to move downward by a control signal from a control mechanism (not shown), and is brought onto the chip component 11 to be transported.
[0031]
Thereafter, when the above-described vacuum pump (not shown) is operated, the suction part 9 at the tip of the collet 8 is brought into a vacuum state through the connection part 17 connected thereto, and the chip component 11 is sucked by the suction part 9. .
[0032]
When the chip part 11 is sucked by the suction portion 9, according to the present embodiment, as described above, the stepped through holes 3a and 3b (4a and 4b) and the through holes 3a and 3b (4a and 4b) Since the stepped rods 5 and 6 that move up and down each have a two-stage configuration, the sliding resistance is very small, the movement is very smooth, and the chip part 11 is damaged. There is nothing.
[0033]
In addition, as described above, the stepped through holes 3a and 3b (4a and 4b) and the stepped rods 5 and 6 are adsorbed in a correct posture when adsorbing the chip component 11 due to its structure. Become.
[0034]
As described above, when the chip component 11 is attracted to the suction portion 9 in a correct posture, the component assembly mounting device is transferred toward the silicon wafer (not shown) by the control signal of the control mechanism, and at a predetermined position of the silicon wafer, When the transfer is stopped, the transfer cycle is completed.
[0035]
According to the present embodiment, in the conveyance cycle, the chip component 11 is performed in a state where the chip component 11 is attracted to the suction portion 9 in a correct posture. Therefore, the chip component 11 is arranged on the silicon wafer at a predetermined interval. It will be. That is, according to the present embodiment, the component mounting accuracy is good. Accordingly, even when the process moves to the next step, since it is performed smoothly, the productivity is very good.
[0036]
【The invention's effect】
In the present invention, a plurality of stepped through holes are provided on the upper surface portion, and a substantially U-shaped notch is formed between the plurality of stepped through holes. A connecting member having a plurality of stepped rods inserted into the plurality of stepped through holes on the front side thereof, and a collet provided with a suction portion at the tip at the center thereof; and the head body And a camera barrel attached above the notch formed in the head, and assembling the head body and the connecting member to form a mounting head, the centers of the plurality of stepped through holes are connected. By configuring the collet suction part to be located on the center line, for example, damage to the chip parts during transportation can be eliminated, and the position confirmation of the chip parts, image processing, etc. can be performed accurately and reliably. Because it can be done, the next work In which suitable can be obtained as a mounting head of an equal component assembly mounting device chip component or the like which is transported can be correctly positioned.
[Brief description of the drawings]
FIG. 1 is a schematic overall perspective view showing an embodiment of a mounting head in a component assembly mounting apparatus according to the present invention.
FIG. 2 is a schematic overall side view of the component assembling and mounting apparatus according to the present invention.
FIG. 3 is a schematic configuration diagram of a mounting head in a conventional component assembling and mounting apparatus.
4 is a schematic side view of FIG. 3;
FIG. 5 is a schematic configuration diagram of a mounting head in another conventional component assembling / mounting apparatus.
6 is a schematic side view of FIG. 5. FIG.
[Explanation of symbols]
DESCRIPTION OF SYMBOLS 1 Head main body 1a Upper surface part 1b of head main body, 1c Side surface part 1d of head main body Lower surface part 2 of head main body 2 Notch part 3, 4 Stepped hole 5, 6 Rod 7 Substantially U-shaped connection member 7a One side Part 7b Central part 7c The other side part 8 Collet 9 Suction part 10 Mounting head 11 Head chip part 12 Camera barrel 13 Bracket 14 Linear slider 15 Spacer 16 Body mounting bracket 17 Connecting part 20 Mounting head 21 Slide guide 22 Linear slider 23 Bracket 24 Collet 25 Suction hole 26 Camera barrel mounting part 27 Mounting part 28 Connecting part 29 Fixing member 30 Spacer 31 Body mounting bracket 40 Mounting head 41 Linear slider 42 Hydrostatic bearing 43 Bracket 44 Fixing member 45 Spacer 46 Body mounting bracket

Claims (1)

A head body in which a plurality of stepped through holes are provided on the upper surface portion, and a substantially U-shaped notch is formed between the plurality of stepped through holes,
A collet with a plurality of stepped rods inserted into the plurality of stepped through holes is provided on the front side of the collet with a suction portion at the tip thereof. An attached connecting member;
A camera barrel attached above a notch formed in the head body,
A component configured such that when the head main body and the connecting member are assembled to form a mounting head, the collet suction portion is positioned on a center line connecting the centers of the plurality of stepped through holes. Mounting head for assembly mounting equipment.

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