JPH0222145B2 - - Google Patents
Info
- Publication number
- JPH0222145B2 JPH0222145B2 JP9617883A JP9617883A JPH0222145B2 JP H0222145 B2 JPH0222145 B2 JP H0222145B2 JP 9617883 A JP9617883 A JP 9617883A JP 9617883 A JP9617883 A JP 9617883A JP H0222145 B2 JPH0222145 B2 JP H0222145B2
- Authority
- JP
- Japan
- Prior art keywords
- discharge
- electrode
- power source
- voltage
- power supply
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Physical Vapour Deposition (AREA)
- Drying Of Semiconductors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9617883A JPS59222580A (ja) | 1983-05-31 | 1983-05-31 | スパツタ装置の放電トリガ方式 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP9617883A JPS59222580A (ja) | 1983-05-31 | 1983-05-31 | スパツタ装置の放電トリガ方式 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS59222580A JPS59222580A (ja) | 1984-12-14 |
| JPH0222145B2 true JPH0222145B2 (enExample) | 1990-05-17 |
Family
ID=14158068
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP9617883A Granted JPS59222580A (ja) | 1983-05-31 | 1983-05-31 | スパツタ装置の放電トリガ方式 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS59222580A (enExample) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS62142763A (ja) * | 1985-12-18 | 1987-06-26 | Hitachi Ltd | スパツタ装置 |
| US6190512B1 (en) * | 1993-09-07 | 2001-02-20 | Tokyo Electron Arizona Inc. | Soft plasma ignition in plasma processing chambers |
-
1983
- 1983-05-31 JP JP9617883A patent/JPS59222580A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS59222580A (ja) | 1984-12-14 |
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