JPS59222580A - スパツタ装置の放電トリガ方式 - Google Patents

スパツタ装置の放電トリガ方式

Info

Publication number
JPS59222580A
JPS59222580A JP9617883A JP9617883A JPS59222580A JP S59222580 A JPS59222580 A JP S59222580A JP 9617883 A JP9617883 A JP 9617883A JP 9617883 A JP9617883 A JP 9617883A JP S59222580 A JPS59222580 A JP S59222580A
Authority
JP
Japan
Prior art keywords
discharge
electrode
power supply
power source
trigger
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP9617883A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0222145B2 (enExample
Inventor
Kazuhiko Mashiro
真白　和彦
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Canon Anelva Corp
Original Assignee
Canon Anelva Corp
Anelva Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Canon Anelva Corp, Anelva Corp filed Critical Canon Anelva Corp
Priority to JP9617883A priority Critical patent/JPS59222580A/ja
Publication of JPS59222580A publication Critical patent/JPS59222580A/ja
Publication of JPH0222145B2 publication Critical patent/JPH0222145B2/ja
Granted legal-status Critical Current

Links

Classifications

    • C—CHEMISTRY; METALLURGY
    • C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
    • C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
    • C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
    • C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
    • C23C14/34—Sputtering

Landscapes

  • Chemical & Material Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Engineering & Computer Science (AREA)
  • Materials Engineering (AREA)
  • Mechanical Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physical Vapour Deposition (AREA)
  • Drying Of Semiconductors (AREA)
JP9617883A 1983-05-31 1983-05-31 スパツタ装置の放電トリガ方式 Granted JPS59222580A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP9617883A JPS59222580A (ja) 1983-05-31 1983-05-31 スパツタ装置の放電トリガ方式

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP9617883A JPS59222580A (ja) 1983-05-31 1983-05-31 スパツタ装置の放電トリガ方式

Publications (2)

Publication Number Publication Date
JPS59222580A true JPS59222580A (ja) 1984-12-14
JPH0222145B2 JPH0222145B2 (enExample) 1990-05-17

Family

ID=14158068

Family Applications (1)

Application Number Title Priority Date Filing Date
JP9617883A Granted JPS59222580A (ja) 1983-05-31 1983-05-31 スパツタ装置の放電トリガ方式

Country Status (1)

Country Link
JP (1) JPS59222580A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142763A (ja) * 1985-12-18 1987-06-26 Hitachi Ltd スパツタ装置
WO1995007544A1 (en) * 1993-09-07 1995-03-16 Materials Research Corporation Soft plasma ignition in plasma processing chambers

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62142763A (ja) * 1985-12-18 1987-06-26 Hitachi Ltd スパツタ装置
WO1995007544A1 (en) * 1993-09-07 1995-03-16 Materials Research Corporation Soft plasma ignition in plasma processing chambers
US6190512B1 (en) 1993-09-07 2001-02-20 Tokyo Electron Arizona Inc. Soft plasma ignition in plasma processing chambers
KR100341376B1 (ko) * 1993-09-07 2002-11-22 도쿄 엘렉트론 가부시키가이샤 플라즈마처리실에서 캐소드를 구동하는전원회로및플라즈마처리방법

Also Published As

Publication number Publication date
JPH0222145B2 (enExample) 1990-05-17

Similar Documents

Publication Publication Date Title
US3763031A (en) Rf sputtering apparatus
US6190512B1 (en) Soft plasma ignition in plasma processing chambers
US6447655B2 (en) DC plasma power supply for a sputter deposition
JPS6130665A (ja) スパツタ装置
JP3424182B2 (ja) 表面処理装置
KR910021495A (ko) 투명 도전막의 제조방법 및 그 제조장치
DE59602601D1 (de) Vorrichtung zum Beschichten von Substraten im Vakuum
JPS59222580A (ja) スパツタ装置の放電トリガ方式
WO1999011103A1 (fr) Procede de commande d'une unite de traitement a plasma
US6080292A (en) Monitoring apparatus for plasma process
JP3310608B2 (ja) スパッタリング装置
JPS61261473A (ja) スパツタリング装置
JP2836072B2 (ja) スパッタリング装置
JPH04136165A (ja) 反応性ガス導入型成膜装置
JPS6070174A (ja) スパッタリング装置
JPS6163021A (ja) 放電加工装置
JPH01106432A (ja) 半導体製造装置及び半導体装置の製造方法
JPH04143275A (ja) スパッタリング装置
JP2901634B2 (ja) 高周波バイアススパッタリング装置及びその方法
JPS63213668A (ja) 薄膜加工装置
JPH01184276A (ja) スパッタによる成膜方法及びその装置
JPS5845379A (ja) 高速スパッタ装置
JPH0230384B2 (ja) Supatsutahohooyobisochi
JPH0225988B2 (enExample)
JP2002004037A (ja) スパッタリングターゲットの製造方法及びスパッタリング装置