JPH02214184A - Manufacture of semiconductor device - Google Patents
Manufacture of semiconductor deviceInfo
- Publication number
- JPH02214184A JPH02214184A JP3541689A JP3541689A JPH02214184A JP H02214184 A JPH02214184 A JP H02214184A JP 3541689 A JP3541689 A JP 3541689A JP 3541689 A JP3541689 A JP 3541689A JP H02214184 A JPH02214184 A JP H02214184A
- Authority
- JP
- Japan
- Prior art keywords
- active layer
- mask
- layer
- semiconductor laser
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 title claims abstract description 15
- 238000004519 manufacturing process Methods 0.000 title claims description 12
- 238000005253 cladding Methods 0.000 claims description 13
- 238000000034 method Methods 0.000 claims description 5
- 239000010409 thin film Substances 0.000 claims 3
- 239000000758 substrate Substances 0.000 abstract description 8
- 125000005842 heteroatom Chemical group 0.000 abstract 1
- 238000005516 engineering process Methods 0.000 description 1
- 230000010355 oscillation Effects 0.000 description 1
- 238000000927 vapour-phase epitaxy Methods 0.000 description 1
- 238000001947 vapour-phase growth Methods 0.000 description 1
- 238000001039 wet etching Methods 0.000 description 1
Landscapes
- Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
- Semiconductor Lasers (AREA)
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
この発明は半導体レーザの製造方法に関するものである
。DETAILED DESCRIPTION OF THE INVENTION [Field of Industrial Application] The present invention relates to a method for manufacturing a semiconductor laser.
第2図は、従来の半導体レーザのダブルへテロ構造の部
分を断面にして示した各製造工程図で、図において、(
11は基板、(2)は下クラッド層、(3)は活性層、
(4)は上クラフト層である。Figure 2 is a cross-sectional view of the double heterostructure of a conventional semiconductor laser.
11 is a substrate, (2) is a lower cladding layer, (3) is an active layer,
(4) is the upper craft layer.
次に製造工程について説明する。Next, the manufacturing process will be explained.
基板(1)上に下クラッド層(2)及び活性層(3)を
気相成長法等により成長させCa図)、ストライプ状の
露光マスクパターンを用いた写真製版により、活性層(
3]上にストライプのウェットエツチングマスクをつく
り、この後、ウェットエツチングにより、活性層(3)
をストライプ状に残す(b図)。次に、このマスクを取
り去り、その後再度気相成長等により上クラッド(4)
を成長させる(0図)。こうして半導体レーザの基本的
な構造であるダブルへテロ構造を形成する。The lower cladding layer (2) and the active layer (3) are grown on the substrate (1) by vapor phase epitaxy or the like (Fig. Ca), and the active layer (Fig.
3] Create a striped wet etching mask on top, and then wet-etch the active layer (3).
are left in a stripe pattern (Figure b). Next, this mask is removed, and then the upper cladding (4) is formed again by vapor phase growth.
(Figure 0). In this way, a double heterostructure, which is the basic structure of a semiconductor laser, is formed.
従来の半導体レーザの製造方法は以上のように構成され
ていたので、活性胴の上側、横側か再成長界面となるた
め半導体レーザの発振しきい値のリーク電流となり、ま
た寿命が短いという問題点があった。Conventional semiconductor laser manufacturing methods have the above-mentioned structure, which causes problems such as leakage current at the oscillation threshold of the semiconductor laser due to the regrowth interface on the top or side of the active body, and short life. There was a point.
この発明は上記のような問題点を解消するためになされ
たもので、特性がよく寿命の長い半導体レーザの製造方
法を得る事を目的とする。The present invention was made to solve the above-mentioned problems, and an object of the present invention is to provide a method for manufacturing a semiconductor laser with good characteristics and a long life.
この発明に係る半導体レーザの製造方法はストライプ状
の活性nをMBE成長装置内でストライプ状のマスクに
より形成し、再成長界面をつくらずにダブルへテロ構造
を得るようにしたものである。The method for manufacturing a semiconductor laser according to the present invention is to form a striped active n layer using a striped mask in an MBE growth apparatus, thereby obtaining a double heterostructure without creating a regrowth interface.
この発明におけるストライプ状のマスクはMBE成長装
雪内でMBをストライプ状にしゃ断し、活性胴のストラ
イプを形成させる。The striped mask in this invention cuts off the MB in stripes in the MBE growth layer, forming stripes of active shells.
以下、この発明の一実施例を図について説明する。 An embodiment of the present invention will be described below with reference to the drawings.
第1図(a)〜(elにおいて、(1)は基板、(2)
は下クラッド層、(3)は活性層、(4)は上クラッド
層、(至)は活性層成長用マスクである。In Fig. 1(a) to (el), (1) is the substrate, (2)
is a lower cladding layer, (3) is an active layer, (4) is an upper cladding layer, and (to) is a mask for growing the active layer.
次に製造方法について説明する。Next, the manufacturing method will be explained.
先づ、基板ぐυをMBE装置内に入れ(a図)、基板(
1)全体に下クラッド層(2)を成長させる(b図)。First, put the board (Fig.
1) Grow the lower cladding layer (2) over the entire surface (Figure b).
次に、活性層成長用マスク(5)を基板(1)上に搬送
して接近させる(0図)。この後活性層用MBを導入し
て、マスク(5)のスリット通過したものだけ下クラッ
ド層(2)上に成長させる。こうして、ストライプ状の
活性層(3)を形成する(d図)。次に、マスクを取去
り上クラッド層(4)を成長させる(e図)。Next, the active layer growth mask (5) is transferred onto the substrate (1) and brought close to it (Figure 0). Thereafter, MB for the active layer is introduced, and only the MB that has passed through the slit of the mask (5) is grown on the lower cladding layer (2). In this way, a striped active layer (3) is formed (Figure d). Next, the mask is removed and an upper cladding layer (4) is grown (Figure e).
こうして、ダブルへテロ構造を形成する。In this way, a double heterostructure is formed.
以上のようにこの発明によれば、活性層をストライプ状
に加工する事をMBE成長装置内で再成長界面を持たず
に一括成長することが出来るので、特性が良い寿命の長
い半導体レーザが得られる効果がある。As described above, according to the present invention, since the active layer can be processed into stripes and grown all at once in an MBE growth apparatus without a regrowth interface, a semiconductor laser with good characteristics and a long life can be obtained. It has the effect of
第1図は、この発明の一実施例による半導体レーザの製
造方法を示す製造工程断面図、第2図は従来の半導体レ
ーザの製造方法を示す製造工程断面図である。
図において、(1)は基板、(2)は下クラッド層、(
3)は活性層、(4)は上クラッド層、(5)は活性層
成長用マスクを示す。
なお、図中、同一符号は同一、または相当部分を示す。FIG. 1 is a manufacturing process cross-sectional view showing a method for manufacturing a semiconductor laser according to an embodiment of the present invention, and FIG. 2 is a manufacturing process cross-sectional view showing a conventional semiconductor laser manufacturing method. In the figure, (1) is the substrate, (2) is the lower cladding layer, (
3) shows an active layer, (4) shows an upper cladding layer, and (5) shows a mask for growing the active layer. In addition, in the figures, the same reference numerals indicate the same or equivalent parts.
Claims (1)
ッド層を有する半導体レーザにおいて、前記薄膜直方体
状の活性層をストライプ状の窓を有するマスクを用いた
MBE成長により形成し、下クラッド層から活性層、上
クラッド胴の成長を連続一括成長する事を特徴とする半
導体レーザの製造方法。In a semiconductor laser having a thin film rectangular active layer and cladding layers on top, bottom, left and right sides of the thin film rectangular active layer, the thin film rectangular active layer is formed by MBE growth using a mask having striped windows; A method for manufacturing a semiconductor laser characterized by continuous growth of a cladding layer, an active layer, and an upper cladding body.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3541689A JPH02214184A (en) | 1989-02-15 | 1989-02-15 | Manufacture of semiconductor device |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3541689A JPH02214184A (en) | 1989-02-15 | 1989-02-15 | Manufacture of semiconductor device |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02214184A true JPH02214184A (en) | 1990-08-27 |
Family
ID=12441271
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3541689A Pending JPH02214184A (en) | 1989-02-15 | 1989-02-15 | Manufacture of semiconductor device |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02214184A (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002261029A (en) * | 2001-03-02 | 2002-09-13 | Sumitomo Electric Ind Ltd | Growth method and apparatus of epiwafer |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5382162A (en) * | 1976-12-27 | 1978-07-20 | Fujitsu Ltd | Beam epitaxial growth method |
JPS6187385A (en) * | 1984-10-05 | 1986-05-02 | Nec Corp | Buried-structure semiconductor laser |
JPS62167289A (en) * | 1986-01-16 | 1987-07-23 | Nec Corp | Processing method for silicon base plate |
-
1989
- 1989-02-15 JP JP3541689A patent/JPH02214184A/en active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5382162A (en) * | 1976-12-27 | 1978-07-20 | Fujitsu Ltd | Beam epitaxial growth method |
JPS6187385A (en) * | 1984-10-05 | 1986-05-02 | Nec Corp | Buried-structure semiconductor laser |
JPS62167289A (en) * | 1986-01-16 | 1987-07-23 | Nec Corp | Processing method for silicon base plate |
Cited By (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP2002261029A (en) * | 2001-03-02 | 2002-09-13 | Sumitomo Electric Ind Ltd | Growth method and apparatus of epiwafer |
JP4605331B2 (en) * | 2001-03-02 | 2011-01-05 | 住友電気工業株式会社 | Epiwafer growth method and growth apparatus |
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