JPH02204918A - 異方性導電膜 - Google Patents

異方性導電膜

Info

Publication number
JPH02204918A
JPH02204918A JP2506489A JP2506489A JPH02204918A JP H02204918 A JPH02204918 A JP H02204918A JP 2506489 A JP2506489 A JP 2506489A JP 2506489 A JP2506489 A JP 2506489A JP H02204918 A JPH02204918 A JP H02204918A
Authority
JP
Japan
Prior art keywords
conductive film
connection
resin
anisotropic conductive
particles
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2506489A
Other languages
English (en)
Inventor
Kenichi Maruyama
丸山　憲一
Masaru Kamimura
上村　優
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
Original Assignee
Seiko Epson Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp filed Critical Seiko Epson Corp
Priority to JP2506489A priority Critical patent/JPH02204918A/ja
Publication of JPH02204918A publication Critical patent/JPH02204918A/ja
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/293—Base material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29299—Base material
    • H01L2224/2939—Base material with a principal constituent of the material being a polymer, e.g. polyester, phenolic based polymer, epoxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29399—Coating material
    • H01L2224/294—Coating material with a principal constituent of the material being a metal or a metalloid, e.g. boron [B], silicon [Si], germanium [Ge], arsenic [As], antimony [Sb], tellurium [Te] and polonium [Po], and alloys thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/26—Layer connectors, e.g. plate connectors, solder or adhesive layers; Manufacturing methods related thereto
    • H01L2224/28—Structure, shape, material or disposition of the layer connectors prior to the connecting process
    • H01L2224/29—Structure, shape, material or disposition of the layer connectors prior to the connecting process of an individual layer connector
    • H01L2224/29001—Core members of the layer connector
    • H01L2224/29099—Material
    • H01L2224/29198—Material with a principal constituent of the material being a combination of two or more materials in the form of a matrix with a filler, i.e. being a hybrid material, e.g. segmented structures, foams
    • H01L2224/29298—Fillers
    • H01L2224/29499—Shape or distribution of the fillers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/8385—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester
    • H01L2224/83851—Bonding techniques using a polymer adhesive, e.g. an adhesive based on silicone, epoxy, polyimide, polyester being an anisotropic conductive adhesive
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/321—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by conductive adhesives

Landscapes

  • Non-Insulated Conductors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。

Description

【発明の詳細な説明】 ［産業上の利用分野］ 本発明は液晶デイスプレィパネル、等の平面型デイスプ
レィパネルの如き細密な端子ピッチの多端子電極の取シ
出しを必要とする装置に対して有効な接続材料である異
方性導電膜に関する。
［従来の技術］ 従来の異方性導電膜の接続構造は、例えば液晶表示装置
においては第２図に示すように、異方性導電膜１は熱可
塑性あるいは熱硬化性の樹脂３中に、均一な粒径を有し
た導電粒子２を分散させたものを工Ｔｏ端子（７−１７
−２）が形成されたガラス基板６とＩＦＰＯ４との間に
介在させ圧着することによって、工Ｔｏ端子（７−１７
−２）とｌＰＰ０端子（５−１，５−２）とを該粒子を
通して、電気的接続を行い、かつ前記樹脂５が、ガラス
基板６とＦＰＯ４の間に充填され接続を行なっていた。
［発明が解決しようとする課題］ しかし、前述の従来技術では、圧着後の接続端子間（５
−１と７−１．５−２と７−２）の厚さは、導電粒子２
０粒径あるいは、変形後の粒径となるが、例えば、圧着
時における圧着力２時間等の製造工程における圧着バラ
ツキが発生し、圧着力が増大した場合には、導電粒子が
過大変形あるいは破壊され、初期的導通不良や温度等の
影響によって異方性導電膜が膨張、収縮を繰り返す等の
経時変化による劣化を受は易（なり導通不良に至る。一
方、圧着力が減少した場合には、工ＴＯ端子（７−１、
７−２）とＦＰＯ端子（５−１，５−２）との電気的接
続ができず導通不良となるという問題点があった。
そこで、本発明は上記問題点を解決するものであり、そ
の目的とするところは、基板とＦＰＣとの充分な接続が
得られ且つ信頼性の高い電気的接続が得られる異方性導
電膜を提供することにある［課題を解決するだめの手段
］ 上記問題点を解決するために、本発明の異方性導電膜は
、面に交差する方向のみに導電性を有し、圧着により、
電子部品相互を電気的に接続する異方性導電膜において
、該導電膜の樹脂中に、粒径な異にする導電粒子を分散
させたことを特徴とする。
［実施例］ 第１図は、本発明の一実施例を示す図であり、液晶表示
装置における工Ｔｏが形成されたガラス基板６とＦＰＣ
４の異方性導電膜釦よる接続状態の断面図である。本実
施例の異方性導電膜は、Ｆｐｏ端子（５−１，５−２＞
と１ＴＯ端子（７−１，７−２）間および、端子間（５
−１と５−２７−１と７−２０間）に該接続端子を電気
的に導通させるための導電粒子２とガラス基板６とＦＰ
Ｃ４間の厚さを均一に保ちかつ導電性を有したスペーサ
ー粒子８が、樹脂３中に分散されている具体的には前記
異方性導電膜の構造は、熱可塑性樹脂または、熱硬化性
樹脂等の樹脂３中に、接続端子の導電に寄与する導電性
粒子２（例えば、ニッケル、炭素、はんだ、タングステ
ン等の金属性導電物あるいは絶縁性プラスチックに導電
物質をコーティングした物）と圧着時の圧力と温度に対
して充分なつぶれ強度と耐熱性を持ち、接続後の端子間
の隙間が適正かつ前記導電粒子２のつぶれ径を一定にし
、また導電にも寄与するスペーサー粒子Ｂ（例えば、硬
質プラスチックに導電物質なコーティングした物）が分
散されているのである。
前記構造の異方性導電膜を使い、圧着接続することによ
り、第１図の様な接続状態となり、スペーサー粒子８に
よって、導電粒子２は、適正なつぶれ状態となり、つぶ
れ過ぎなどにより生じる電気的接続不良を防いでいる。
さらに、隣接接続端子間（５−１と５−２．７−１と７
−２間）の樹脂３の充填量も、接続端子間（５−１と７
−１５−２と７−２の間）の厚さが均一になることによ
り一定となり、接読の機械的強度を向上させると共に、
経時変化による導通不良が防止できる。
［発明の効果］ 以上述べたように本発明の異方性導電膜を用い接続すれ
ば、導電粒子が、適正な状態で接続端子と接し、充分な
圧着接続状態が確保され、信頼性の高い電気的接続が得
られる。また、樹脂の充填量が一定となり、接続強度が
向上し、接続長期安定性、信頼性が確保できる。
【図面の簡単な説明】
第１図は本発明の異方性導電膜を用いた液晶表示装置の
要部拡大断面図。 第２図は、従来の異方性導電膜を用いた液晶表示装置の
要部拡大断面図。 １・・・・・・・・・異方性導電膜 ２・・・・・・・・・導電性粒子 ３・・・・・・・・・樹　脂 ４　・・・　・・・　・・・　ＩＦＰＯ５−１５−２・
・・・・・ＦＰＯ端子 ６・・・・・・・・・ガラス基板 ７−１７−２・・・・・・工ＴＯ端子 ８・・・・・・・・・スペーサー粒子 以上 出願人　セイコーエプソン株式会社

Claims (1)

    【特許請求の範囲】
  1. 面に交差する方向のみに導電性を有し、圧着により電子
    部品相互を電気的に接続する異方性導電膜において、該
    導電膜の樹脂中に、粒径を異にする導電粒子を分散させ
    たことを特徴とする異方性導電膜。
JP2506489A 1989-02-03 1989-02-03 異方性導電膜 Pending JPH02204918A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2506489A JPH02204918A (ja) 1989-02-03 1989-02-03 異方性導電膜

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2506489A JPH02204918A (ja) 1989-02-03 1989-02-03 異方性導電膜

Publications (1)

Publication Number Publication Date
JPH02204918A true JPH02204918A (ja) 1990-08-14

Family

ID=12155493

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2506489A Pending JPH02204918A (ja) 1989-02-03 1989-02-03 異方性導電膜

Country Status (1)

Country Link
JP (1) JPH02204918A (ja)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0996321A2 (en) * 1998-10-22 2000-04-26 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film
EP0996321A3 (en) * 1998-10-22 2003-02-12 Sony Chemicals Corporation Anisotropically electroconductive adhesive and adhesive film

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