JPH0220352B2 - - Google Patents
Info
- Publication number
- JPH0220352B2 JPH0220352B2 JP26241786A JP26241786A JPH0220352B2 JP H0220352 B2 JPH0220352 B2 JP H0220352B2 JP 26241786 A JP26241786 A JP 26241786A JP 26241786 A JP26241786 A JP 26241786A JP H0220352 B2 JPH0220352 B2 JP H0220352B2
- Authority
- JP
- Japan
- Prior art keywords
- workpiece
- vapor phase
- loading port
- saturated vapor
- tank
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000012808 vapor phase Substances 0.000 claims description 26
- 238000001816 cooling Methods 0.000 claims description 23
- 229920006395 saturated elastomer Polymers 0.000 claims description 17
- 238000005476 soldering Methods 0.000 claims description 12
- 238000009834 vaporization Methods 0.000 claims description 3
- 230000008016 vaporization Effects 0.000 claims description 3
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 description 6
- 229910052731 fluorine Inorganic materials 0.000 description 6
- 239000011737 fluorine Substances 0.000 description 6
- 230000000694 effects Effects 0.000 description 4
- 230000007423 decrease Effects 0.000 description 2
- 229920001971 elastomer Polymers 0.000 description 2
- 239000012442 inert solvent Substances 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000003595 mist Substances 0.000 description 2
- 229910000679 solder Inorganic materials 0.000 description 2
- 238000009833 condensation Methods 0.000 description 1
- 230000005494 condensation Effects 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 229920002379 silicone rubber Polymers 0.000 description 1
- 239000004945 silicone rubber Substances 0.000 description 1
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/012—Soldering with the use of hot gas
- B23K1/015—Vapour-condensation soldering
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26241786A JPS63115677A (ja) | 1986-11-04 | 1986-11-04 | 気相式はんだ付け装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP26241786A JPS63115677A (ja) | 1986-11-04 | 1986-11-04 | 気相式はんだ付け装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63115677A JPS63115677A (ja) | 1988-05-20 |
| JPH0220352B2 true JPH0220352B2 (cs) | 1990-05-09 |
Family
ID=17375492
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP26241786A Granted JPS63115677A (ja) | 1986-11-04 | 1986-11-04 | 気相式はんだ付け装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63115677A (cs) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0677814B2 (ja) * | 1988-10-24 | 1994-10-05 | 日立テクノエンジニアリング株式会社 | ベーパーリフロー式はんだ付け装置 |
-
1986
- 1986-11-04 JP JP26241786A patent/JPS63115677A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63115677A (ja) | 1988-05-20 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| EP0000284A1 (en) | Process and apparatus for reflowing solder of solder plated substrates and substrates formed thereby | |
| US4726506A (en) | Soldering apparatus | |
| JPH0220352B2 (cs) | ||
| JPS61238464A (ja) | 物品加熱装置 | |
| JPS62151266A (ja) | 気相式はんだ付け装置 | |
| JPH0257468B2 (cs) | ||
| JPS6330172A (ja) | リフロ−はんだ付け装置 | |
| JPS63313663A (ja) | 気相式はんだ付け装置 | |
| JPH08242069A (ja) | 電子回路基板の製造装置、はんだ付け装置及び製造方法 | |
| JPS62148083A (ja) | ベ−パ−リフロ−式はんだ付け装置 | |
| JPH0245946B2 (cs) | ||
| JPS6213263A (ja) | 気相式はんだ付け装置 | |
| JPH0763840B2 (ja) | 気相式はんだ付け装置 | |
| JPS62238068A (ja) | 気相式はんだ付け装置 | |
| JPS62234659A (ja) | ベ−パ−リフロ−式はんだ付け装置 | |
| JPS62148084A (ja) | ベ−パ−リフロ−式はんだ付装置 | |
| JP2634449B2 (ja) | 気相式はんだ付け装置 | |
| JPH01197062A (ja) | 気相式はんだ付け装置 | |
| JPH02298094A (ja) | プンント基板 | |
| JPH02307668A (ja) | はんだ付け方法 | |
| JPS63123567A (ja) | 気相式はんだ付け方法 | |
| JPH07273443A (ja) | バッチ式気相はんだ付装置 | |
| JPS629770A (ja) | ベ−パ−リフロ−装置 | |
| JPH0220351B2 (cs) | ||
| JPH084928B2 (ja) | 気相式はんだ付け装置におけるワ−ク急冷装置 |