JPH0220032A - Sealing method for resin of semiconductor element - Google Patents

Sealing method for resin of semiconductor element

Info

Publication number
JPH0220032A
JPH0220032A JP63170164A JP17016488A JPH0220032A JP H0220032 A JPH0220032 A JP H0220032A JP 63170164 A JP63170164 A JP 63170164A JP 17016488 A JP17016488 A JP 17016488A JP H0220032 A JPH0220032 A JP H0220032A
Authority
JP
Japan
Prior art keywords
resin
sealing
semiconductor element
resistor
formed
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP63170164A
Inventor
Kazunao Kinugawa
Shinichiro Ohashi
Isato Watanabe
Original Assignee
Seikosha Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seikosha Co Ltd filed Critical Seikosha Co Ltd
Priority to JP63170164A priority Critical patent/JPH0220032A/en
Publication of JPH0220032A publication Critical patent/JPH0220032A/en
Application status is Pending legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L2224/00Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42Wire connectors; Manufacturing methods related thereto
    • H01L2224/47Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805Shape
    • H01L2224/4809Loop shape
    • H01L2224/48091Arched

Abstract

PURPOSE: To improve the flow stopping effect of sealing resin for sealing a semiconductor element by mounting the element on a board formed with a heat generating resistor through an insulating film on a pattern face, so dropping the resin as to cover the element in a sealing range, energizing the resistor, heating and curing the resin.
CONSTITUTION: A wiring pattern 2 is formed on a printed board 1, a semiconductor element 2 is die bonded onto a wiring pattern 2, and further mounted by a wire bonding. A heat generating resistor 4 is so formed through an insulating film 5 as to surround a boundary of a potting range of an IC chip 3 on the surface of the wiring pattern 2 of the board 1. The chip 3 is mounted in the sealing range, and sealing resin 6 is so dropped as to cover the chip 3. A voltage is applied to both ends 4a, 4b of the resistor 4 to heat the whole resin. A phenomenon in which the viscosity of the resin is momentarily reduced is observed, its curing reaction is accelerated, fuming gas is discharged, and the whole resin 6 is cured.
COPYRIGHT: (C)1990,JPO&Japio
JP63170164A 1988-07-08 1988-07-08 Sealing method for resin of semiconductor element Pending JPH0220032A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP63170164A JPH0220032A (en) 1988-07-08 1988-07-08 Sealing method for resin of semiconductor element

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP63170164A JPH0220032A (en) 1988-07-08 1988-07-08 Sealing method for resin of semiconductor element

Publications (1)

Publication Number Publication Date
JPH0220032A true JPH0220032A (en) 1990-01-23

Family

ID=15899870

Family Applications (1)

Application Number Title Priority Date Filing Date
JP63170164A Pending JPH0220032A (en) 1988-07-08 1988-07-08 Sealing method for resin of semiconductor element

Country Status (1)

Country Link
JP (1) JPH0220032A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5850690A (en) * 1995-07-11 1998-12-22 De La Rue Cartes Et Systemes Sas Method of manufacturing and assembling an integrated circuit card
US6848173B2 (en) * 1994-07-07 2005-02-01 Tessera, Inc. Microelectric packages having deformed bonded leads and methods therefor

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6848173B2 (en) * 1994-07-07 2005-02-01 Tessera, Inc. Microelectric packages having deformed bonded leads and methods therefor
US5850690A (en) * 1995-07-11 1998-12-22 De La Rue Cartes Et Systemes Sas Method of manufacturing and assembling an integrated circuit card

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