JPH0426781B2 - - Google Patents
Info
- Publication number
- JPH0426781B2 JPH0426781B2 JP17018286A JP17018286A JPH0426781B2 JP H0426781 B2 JPH0426781 B2 JP H0426781B2 JP 17018286 A JP17018286 A JP 17018286A JP 17018286 A JP17018286 A JP 17018286A JP H0426781 B2 JPH0426781 B2 JP H0426781B2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- cut end
- semiconductor device
- cut
- connecting band
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000011347 resin Substances 0.000 claims description 26
- 229920005989 resin Polymers 0.000 claims description 26
- 239000004065 semiconductor Substances 0.000 claims description 13
- 238000007789 sealing Methods 0.000 claims description 6
- 238000010438 heat treatment Methods 0.000 claims description 4
- 238000004519 manufacturing process Methods 0.000 claims description 4
- 238000000034 method Methods 0.000 claims description 4
- 238000002844 melting Methods 0.000 claims description 2
- 230000008018 melting Effects 0.000 claims description 2
- 238000001723 curing Methods 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 2
- 239000007788 liquid Substances 0.000 description 2
- 239000000758 substrate Substances 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
Description
【発明の詳細な説明】
産業上の利用分野
本発明は、リードフレーム上に取付けられた半
導体素子を、樹脂で封止するようにした樹脂封止
型半導体装置の製造方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of Industrial Application The present invention relates to a method for manufacturing a resin-sealed semiconductor device in which a semiconductor element mounted on a lead frame is sealed with a resin.
従来の技術
従来、この種半導体装置として、第２図及び第
３図に示すものがある。2. Description of the Related Art Conventionally, as this type of semiconductor device, there are those shown in FIGS. 2 and 3.
すなわち、同図において、１は、放熱板ともな
る素子取付用基板２と、３本のリード線３とを一
体にしたもの複数個を、連結帯４により連結した
リードフレーム、５は、基板２上に取付けた半導
体素子、６は素子、５の電極とリード線３とをボ
ンデイング結線した金属細線、７は、基板２とそ
の上に取付けた素子５とを被覆して設けた封止樹
脂、８は、電気装置等への取付用の透孔である。 That is, in the figure, 1 is a lead frame in which a plurality of integrated circuit boards 2 for mounting an element, which also serves as a heat dissipation plate, and three lead wires 3 are connected by a connecting band 4, and 5 is a board 2. The semiconductor element mounted on the substrate 2, 6 the element, a thin metal wire bonding the electrode 5 and the lead wire 3, 7 a sealing resin provided to cover the substrate 2 and the element 5 mounted thereon; 8 is a through hole for attachment to an electrical device or the like.
上記構成よりなる半導体装置は、第２図に示す
複数個連結されたものを、その連結帯４を切断し
て個々に分離した場合、第３図ａに示すように、
封止樹脂７より、連結帯４の切断端４′が突出し
た状態となる。 In the semiconductor device having the above configuration, when a plurality of connected devices shown in FIG. 2 are separated into individual devices by cutting the connecting band 4, as shown in FIG. 3a,
The cut end 4' of the connecting band 4 protrudes from the sealing resin 7.
この状態であると、半導体装置を電気装置のシ
ヤーシ等に取付けた場合、シヤーシと切断端４′
が接近して、電気的絶縁性が劣化することがあつ
た。 In this state, when the semiconductor device is attached to the chassis of an electrical device, the chassis and the cut end 4'
The electrical insulation properties sometimes deteriorated due to the close contact between the two.
これがため、従来より、この切断端４′に樹脂
を被覆するのであるが、通常、液状の樹脂を塗布
し、これを加熱炉を通して硬化させるようにして
いた。 For this reason, the cut end 4' has conventionally been coated with resin, but usually a liquid resin is applied and the resin is hardened by passing it through a heating oven.
発明が解決しようとする問題点
しかし、液状の樹脂を使用すると、その温度、
粘度等により吐出量が変り易く、適量を塗布する
ための制御が、大変困難になる欠点があつた。Problems to be solved by the invention However, when liquid resin is used, its temperature,
The discharge amount tends to change depending on the viscosity, etc., and it has the disadvantage that it is very difficult to control the amount to be applied.
問題点を解決するための手段
本発明は、上記欠点を改良除去するために提案
されたもので、切断端に、樹脂タブレツトを搭載
して、これを加熱溶融硬化させることにより、切
断端に樹脂を被覆するようにしたことを特徴とす
る。Means for Solving the Problems The present invention was proposed in order to improve and eliminate the above-mentioned drawbacks, and by mounting a resin tablet on the cut end and heating and melting it to harden it, the resin is attached to the cut end. It is characterized by being coated with.
実施例
以下、本発明の一実施例を第１図により説明す
ると、先ず、連結帯を切断することにより個々に
分離された半導体装置を用意し、第１図ａに示す
ように、その切断端１１が、頂部に来るよう、傾
斜させて保持し、切断端１１に樹脂ダブレツト１
２を搭載する。次に、これを加熱炉内に入れ、樹
脂タブレツト１２を加熱して、溶融させるととも
に硬化させ、第１図ｂに示すような半導体装置を
得る。次に、これを180°回転させ、同様にして、
もう一方の切断端１１にも、樹脂を被覆する。Embodiment Hereinafter, an embodiment of the present invention will be described with reference to FIG. 1. First, semiconductor devices separated into individual devices are prepared by cutting a connecting band, and as shown in FIG. 1a, the cut ends are separated. 11 is at the top, and hold the resin doublet 1 on the cut end 11.
Equipped with 2. Next, this is placed in a heating furnace, and the resin tablet 12 is heated to melt and harden it, thereby obtaining a semiconductor device as shown in FIG. 1B. Then rotate this 180° and do the same,
The other cut end 11 is also coated with resin.
尚、樹脂タブレツト１２としては、封止樹脂１
３と同一のものを用いることができる。この場
合、封止樹脂１３は、一旦加熱溶融硬化させてあ
るので、樹脂タブレツト１２の加熱溶融時に、再
度溶融することはない。 In addition, as the resin tablet 12, the sealing resin 1
The same one as 3 can be used. In this case, since the sealing resin 13 is once heated and melted and hardened, it will not be melted again when the resin tablet 12 is heated and melted.
発明の硬貨
本発明は、以上のように、樹脂タブレツトを加
熱溶融硬化させて、切断端に樹脂を被覆するよう
にしたから、樹脂タブレツトの量規制が簡単に実
施でき、切断端への樹脂被覆がきわめて簡単とな
つて、生産性を大幅に拡大でき、品質的にも優れ
た製品を提供できることが可能となつた。Coin of the Invention As described above, in the present invention, since the resin tablet is heated and melted and hardened to coat the cut end with the resin, the amount of the resin tablet can be easily controlled, and the resin coating on the cut end can be easily controlled. This has made it extremely simple, greatly increasing productivity and making it possible to provide products with excellent quality.
第１図は、本発明に係る製造方法を説明するた
めの工程簡略図、第２図は、連結帯切断前の半導
体装置の平面図、第３図は、連結帯切断後を示す
もので、ａは側面図、ｂは側断面図である。
１１……切断端、１２……樹脂タブレツト、１
３……封止樹脂。
1 is a simplified process diagram for explaining the manufacturing method according to the present invention, FIG. 2 is a plan view of the semiconductor device before the connecting band is cut, and FIG. 3 is a diagram showing the semiconductor device after the connecting band is cut. A is a side view, and b is a side sectional view. 11...Cut end, 12...Resin tablet, 1
3...Sealing resin.
Claims (1)
その連結帯を切断することにより個々に分離した
後、その封止樹脂より突出した切断端を、樹脂で
被覆するようにした樹脂封止型半導体装置の製造
方法において、切断端に樹脂ダブレツトを搭載し
て、加熱溶融硬化させることにより、切断端に樹
脂を被覆するようにしたことを特徴とする樹脂封
止型半導体装置の製造方法。1 A plurality of resin-sealed semiconductor devices connected together,
A method for manufacturing a resin-encapsulated semiconductor device in which the connecting band is separated into individual devices by cutting, and the cut ends protruding from the sealing resin are covered with resin, in which a resin doublet is mounted on the cut ends. A method for manufacturing a resin-sealed semiconductor device, characterized in that the cut end is coated with a resin by heating and melting and curing the cut end.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17018286A JPS6327029A (en) | 1986-07-18 | 1986-07-18 | Manufacture of resin-sealed semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP17018286A JPS6327029A (en) | 1986-07-18 | 1986-07-18 | Manufacture of resin-sealed semiconductor device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6327029A JPS6327029A (en) | 1988-02-04 |
| JPH0426781B2 true JPH0426781B2 (en) | 1992-05-08 |
Family
ID=15900204
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP17018286A Granted JPS6327029A (en) | 1986-07-18 | 1986-07-18 | Manufacture of resin-sealed semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS6327029A (en) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN1042769C (en) * | 1991-08-27 | 1999-03-31 | Tdk株式会社 | High voltage capacitor and magnetron |
| JP3473795B2 (en) * | 1995-05-22 | 2003-12-08 | Ｔｄｋ株式会社 | High voltage capacitors and magnetrons |
-
1986
- 1986-07-18 JP JP17018286A patent/JPS6327029A/en active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6327029A (en) | 1988-02-04 |
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