JPS63177428A - Sealing method for semiconductor device with resin - Google Patents

Abstract

PURPOSE:To obtain the stability of coating area and coating shape and to improve the productivity by surrounding the outer periphery of a predetermined range including a semiconductor chip secured to a substrate with a high meltingpoint resin frame, attaching a low melting-point resin plate to the top, heating the resin to melt it, thereby preventing the resin from extending after the sealing resin is coated. CONSTITUTION:A semiconductor chip 2 is bonded to a predetermined position on a semiconductor device substrate 1, and a predetermined range including the chip 2 is sealed with resin. In such a resin sealing method, the outer periphery of the predetermined range including the chip 2 is surrounded by a resin frame 5 made of high melting point resin, a low melting-point resin plate 6 formed in a plate state is attached to the top of the frame 5, they are simultaneously heated to be melted to seal the chip 2. The heating temperature of the resin is set, for example, to a point higher than the melting point of the plate 6 and lower than the melting point of the frame 5. Thus, the sealing resin does not flow over the predetermined coating range to obtain a stable sealing shape.

Description

[Detailed Description of the Invention] [Industrial Application Field] This invention relates to the surface of one or more semiconductor chips die-bonded or wire-bonded on a semiconductor substrate and a predetermined area around the semiconductor chip in the manufacturing process of a semiconductor device. The present invention relates to a resin sealing method when sealing a portion using resin.

[Conventional technology]

A conventional resin sealing method of this type will be explained with reference to FIG. In FIG. 4, 1 is a semiconductor device substrate mainly made of glass epoxy material, etc.; 2 is a semiconductor chip bonded to a predetermined portion (one or more) of the semiconductor device substrate 1;
3 is the surface electrode of this semiconductor chip 2 and the semiconductor device substrate 1
Wires made of thin gold or aluminum wires are used to electrically connect the lead patterns provided on the semiconductor chip 2 and the wires 3, and a sealing resin 4 is used to protect and seal the semiconductor chip 2 and the wires 3.

Next, the operation will be explained. First, the semiconductor chip 2 is mounted on a base provided at a predetermined location on the semiconductor substrate 1.
, Pb-5n solder or the like is used as a brazing material, and then wire bonding is performed using a wire 3 between the surface K i of the semiconductor chip 2 and the lead pattern provided on the semiconductor device substrate 1 to establish an electrical connection. I do.

Next, a predetermined amount of the resin fIFj4 is applied from the top of the semiconductor chip 2 within the resin sealing range using a separate dispenser (not shown). This sealing resin 4 is normally a viscous liquid at room temperature, and after being applied to a predetermined shape, it is cured by being heated through a curing furnace.

[Problem that the invention seeks to solve]

However, when implemented using the method described above, the following problems arise. That is, when resin is dripped with a dispenser, the applied area of the dropped a-liquid 4 expands over time, and the expanding area generally changes over time due to the relationship between the viscosity, amount, specific gravity, surface tension, etc. of the resin. It can be found by a function, but
In reality, it is difficult to make the resin components uniform, and variations occur depending on the manufacturing lot. It is also difficult to always make the dispense amount uniform.

The biggest problem here is that the sealing resin is cured by heating at high temperatures in a curing furnace. This is because if the equipment is stopped due to some trouble, if left as it is, the dripped resin will always spread out from the coating process until it is put into the curing furnace, and as shown in Figure 5, the resin will spread beyond the necessary range. The coating spreads out, causing variations in the area and height after coating for a given coating shape, and in some cases exceeds the specifications for the coating area, resulting in poor productivity and problems with consistent quality. .

This invention was made to solve the above-mentioned problems, and it prevents the resin from spreading after applying the sealing resin, stabilizes the applied area and shape, and improves productivity. The purpose is to obtain a sealing method that can achieve this.

[Means for solving problems]

A method for resin-sealing a semiconductor device according to the present invention includes surrounding the outer periphery of a predetermined area including a semiconductor chip fixed to a semiconductor device substrate with a frame having a predetermined height made of a high melting point resin. A plate-shaped low melting point resin is attached to the top of the resin frame, and these two types of resin with different melting points are heated and melted to seal a predetermined area including the semiconductor chip. It is.

[Effect]

By using the sealing method according to the present invention, it is possible to prevent the sealing resin from flowing and spreading beyond a predetermined range.

〔Example〕

Figures 1 to 3 show an embodiment of the present invention. Figures 1 and 2 are a perspective view and a sectional view showing the state before heating and melting the resin, and Figure 3 is a heating FIG. 2 is a cross-sectional view of a semiconductor device substrate sealed in a manner similar to that shown in FIG.

In the figure, 5 is a frame-shaped high melting point resin, and 6 is a plate-shaped low melting point resin placed thereon.

As described above, the outer periphery of a predetermined resin-sealed area containing the semiconductor chip 2 is fixedly surrounded by a frame 5 made of a high melting point resin, and a plate-shaped plate is placed on the upper part of this W resin frame 5. melting point resin 6
When the resin 6 is attached and heated simultaneously through a curing furnace, the low melting point resin 6 melts first at a constant temperature, and even if it becomes a low viscosity liquid, the convex part formed by the high melting point resin frame melts first. , its spread is prevented and it does not flow out beyond the predetermined application range, resulting in a stable sealed shape.

〔Effect of the invention〕

As described above, according to the present invention, two types of frame-shaped resins having different melting points and a plate-shaped resin placed on the frame-shaped resin are heated and melted, and the sealing resin covers a predetermined application area. A stable sealing shape is obtained without overflowing, and there is no need to remove resin that has spread too much during the resin curing process in a curing oven, which greatly contributes to improving productivity and quality. There is.

[BRIEF DESCRIPTION OF THE DRAWINGS] FIG. 1 is a perspective view showing an embodiment of the present invention, showing the state before heating and melting the resin, and FIG. 2 is a cross-sectional view of FIG. FIG. 3 is a cross-sectional view of the sealed semiconductor device substrate. FIG. 4 is a perspective view showing a conventional resin sealing method;
FIG. 5 is a perspective view for explaining an example of a failure caused by the conventional Ia resin sealing method. In the figure, 1 is a semiconductor device substrate, 2 is a semiconductor chip, 3 is a wire, 5 is a high melting point resin frame, and 6 is a low melting point Il! This is a monthly board. Note that the same reference numerals in the figures indicate the same or corresponding parts.

Claims (3)

[Claims] (1) In a resin sealing method in which a semiconductor chip is bonded to a predetermined location on a semiconductor device substrate and a predetermined area including the semiconductor chip is sealed with resin, a predetermined area of the outer periphery including the semiconductor chip is The semiconductor chip is sealed by surrounding it with a resin frame made of melting point resin, and then attaching a plate-shaped low melting point resin plate to the top of the resin frame, and simultaneously heating and melting them. 1. A method for resin-sealing a semiconductor device. (2) A method for resin-sealing a semiconductor device according to claim 1, wherein the heating temperature of the resin is set higher than the melting point of the resin plate and lower than the melting point of the resin frame. (3) A resin sealing method for a semiconductor device according to claim 1 or 2, wherein the resin frame is formed in a rectangular shape.