JPH0219980Y2 - - Google Patents
Info
- Publication number
- JPH0219980Y2 JPH0219980Y2 JP1983013824U JP1382483U JPH0219980Y2 JP H0219980 Y2 JPH0219980 Y2 JP H0219980Y2 JP 1983013824 U JP1983013824 U JP 1983013824U JP 1382483 U JP1382483 U JP 1382483U JP H0219980 Y2 JPH0219980 Y2 JP H0219980Y2
- Authority
- JP
- Japan
- Prior art keywords
- layer
- melting point
- point glass
- printed
- resistor
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000002844 melting Methods 0.000 claims description 31
- 230000008018 melting Effects 0.000 claims description 30
- 239000011521 glass Substances 0.000 claims description 28
- 239000000758 substrate Substances 0.000 claims description 13
- 239000010410 layer Substances 0.000 description 84
- 238000009966 trimming Methods 0.000 description 8
- 238000010304 firing Methods 0.000 description 7
- 238000007639 printing Methods 0.000 description 7
- 238000010586 diagram Methods 0.000 description 4
- 238000009413 insulation Methods 0.000 description 4
- 239000002356 single layer Substances 0.000 description 4
- 239000000919 ceramic Substances 0.000 description 3
- 238000004891 communication Methods 0.000 description 3
- 238000000034 method Methods 0.000 description 3
- 230000003679 aging effect Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000011347 resin Substances 0.000 description 2
- 229920005989 resin Polymers 0.000 description 2
- 239000004593 Epoxy Substances 0.000 description 1
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000002474 experimental method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 239000011241 protective layer Substances 0.000 description 1
- 230000035939 shock Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
Landscapes
- Parts Printed On Printed Circuit Boards (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
- Non-Adjustable Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983013824U JPS59121860U (ja) | 1983-02-02 | 1983-02-02 | 印刷配線基板 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP1983013824U JPS59121860U (ja) | 1983-02-02 | 1983-02-02 | 印刷配線基板 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS59121860U JPS59121860U (ja) | 1984-08-16 |
JPH0219980Y2 true JPH0219980Y2 (fi) | 1990-05-31 |
Family
ID=30145201
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP1983013824U Granted JPS59121860U (ja) | 1983-02-02 | 1983-02-02 | 印刷配線基板 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS59121860U (fi) |
Families Citing this family (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP6923615B2 (ja) * | 2015-02-17 | 2021-08-25 | ローム株式会社 | 抵抗器の製造方法 |
-
1983
- 1983-02-02 JP JP1983013824U patent/JPS59121860U/ja active Granted
Also Published As
Publication number | Publication date |
---|---|
JPS59121860U (ja) | 1984-08-16 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5510594A (en) | Method of manufacturing thick-film circuit component | |
US4725925A (en) | Circuit board | |
JPH0219980Y2 (fi) | ||
US6128199A (en) | Composite device and manufacturing method thereof | |
JPH08316002A (ja) | 電子部品及び複合電子部品 | |
JP2003249403A (ja) | チップ抵抗器 | |
JPH0363237B2 (fi) | ||
JPS63253659A (ja) | 厚膜混成集積回路装置 | |
JPS6165464A (ja) | 厚膜多層基板における膜抵抗体の製造方法 | |
JPS644325B2 (fi) | ||
JPH0239116B2 (fi) | ||
JP2739453B2 (ja) | ヒューズ機能付コンデンサ、及びその製造方法 | |
JP2517726B2 (ja) | 多層配線基板の製造方法 | |
JP2766146B2 (ja) | コンデンサ内蔵多層回路基板 | |
JPH0794308A (ja) | 多層抵抗モジュール | |
JPS6165465A (ja) | 厚膜多層基板における膜抵抗体の製造方法 | |
JPS5827302A (ja) | 抵抗を含むチツプ形素子 | |
JPH0720942Y2 (ja) | 抵抗素子を含む複合セラミック多層基板 | |
JPH09320893A (ja) | 厚膜コンデンサと厚膜抵抗器との複合素子の製造方法 | |
JP3165517B2 (ja) | 回路装置 | |
JPS62265751A (ja) | 混成集積回路装置 | |
JPS5936922Y2 (ja) | 混成集積回路装置 | |
JPH0138924Y2 (fi) | ||
JPH0445263Y2 (fi) | ||
JPS6154657A (ja) | 混成集積回路 |