JPH0219972Y2 - - Google Patents
Info
- Publication number
- JPH0219972Y2 JPH0219972Y2 JP1982134105U JP13410582U JPH0219972Y2 JP H0219972 Y2 JPH0219972 Y2 JP H0219972Y2 JP 1982134105 U JP1982134105 U JP 1982134105U JP 13410582 U JP13410582 U JP 13410582U JP H0219972 Y2 JPH0219972 Y2 JP H0219972Y2
- Authority
- JP
- Japan
- Prior art keywords
- board
- substrate
- flexible substrate
- connector
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000000758 substrate Substances 0.000 claims description 36
- 229920003002 synthetic resin Polymers 0.000 claims description 9
- 239000000057 synthetic resin Substances 0.000 claims description 9
- 239000000463 material Substances 0.000 description 15
- 229920005989 resin Polymers 0.000 description 4
- 239000011347 resin Substances 0.000 description 4
- 239000004593 Epoxy Substances 0.000 description 3
- 239000000853 adhesive Substances 0.000 description 3
- 230000001070 adhesive effect Effects 0.000 description 3
- -1 polyethylene Polymers 0.000 description 3
- 239000004698 Polyethylene Substances 0.000 description 2
- BZHJMEDXRYGGRV-UHFFFAOYSA-N Vinyl chloride Chemical compound ClC=C BZHJMEDXRYGGRV-UHFFFAOYSA-N 0.000 description 2
- 229920000573 polyethylene Polymers 0.000 description 2
- 229920001169 thermoplastic Polymers 0.000 description 2
- 229920001187 thermosetting polymer Polymers 0.000 description 2
- 239000004416 thermosoftening plastic Substances 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000004793 Polystyrene Substances 0.000 description 1
- NIXOWILDQLNWCW-UHFFFAOYSA-N acrylic acid group Chemical group C(C=C)(=O)O NIXOWILDQLNWCW-UHFFFAOYSA-N 0.000 description 1
- 239000003990 capacitor Substances 0.000 description 1
- 239000011248 coating agent Substances 0.000 description 1
- 238000000576 coating method Methods 0.000 description 1
- 239000002131 composite material Substances 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920002223 polystyrene Polymers 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 238000003466 welding Methods 0.000 description 1
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13410582U JPS5937737U (ja) | 1982-09-03 | 1982-09-03 | 集積回路塔載ボ−ド |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13410582U JPS5937737U (ja) | 1982-09-03 | 1982-09-03 | 集積回路塔載ボ−ド |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS5937737U JPS5937737U (ja) | 1984-03-09 |
| JPH0219972Y2 true JPH0219972Y2 (fr) | 1990-05-31 |
Family
ID=30302274
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13410582U Granted JPS5937737U (ja) | 1982-09-03 | 1982-09-03 | 集積回路塔載ボ−ド |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5937737U (fr) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2547565B2 (ja) * | 1987-04-17 | 1996-10-23 | 三洋電機株式会社 | 混成集積回路の製造方法 |
| JP2503984Y2 (ja) * | 1987-04-17 | 1996-07-03 | 三洋電機株式会社 | 混成集積回路 |
| JP4626289B2 (ja) * | 2004-12-14 | 2011-02-02 | 株式会社デンソー | 電子機器の製造方法、基板の製造方法、電子機器及び基板 |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4976242U (fr) * | 1972-10-23 | 1974-07-02 |
-
1982
- 1982-09-03 JP JP13410582U patent/JPS5937737U/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS5937737U (ja) | 1984-03-09 |
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