JPH0219626B2 - - Google Patents

Info

Publication number
JPH0219626B2
JPH0219626B2 JP58207104A JP20710483A JPH0219626B2 JP H0219626 B2 JPH0219626 B2 JP H0219626B2 JP 58207104 A JP58207104 A JP 58207104A JP 20710483 A JP20710483 A JP 20710483A JP H0219626 B2 JPH0219626 B2 JP H0219626B2
Authority
JP
Japan
Prior art keywords
ball
wire
bonding
tip
high voltage
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP58207104A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6098635A (ja
Inventor
Kazunori Kimura
Masajiro Takasaki
Hitoshi Sakuma
Tomio Kobayashi
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58207104A priority Critical patent/JPS6098635A/ja
Publication of JPS6098635A publication Critical patent/JPS6098635A/ja
Publication of JPH0219626B2 publication Critical patent/JPH0219626B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
JP58207104A 1983-11-04 1983-11-04 ワイヤボンデイング方法 Granted JPS6098635A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58207104A JPS6098635A (ja) 1983-11-04 1983-11-04 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58207104A JPS6098635A (ja) 1983-11-04 1983-11-04 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6098635A JPS6098635A (ja) 1985-06-01
JPH0219626B2 true JPH0219626B2 (enExample) 1990-05-02

Family

ID=16534264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58207104A Granted JPS6098635A (ja) 1983-11-04 1983-11-04 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6098635A (enExample)

Family Cites Families (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5917977B2 (ja) * 1979-10-18 1984-04-24 株式会社新川 ワイヤボンダ−におけるボ−ル形成方法

Also Published As

Publication number Publication date
JPS6098635A (ja) 1985-06-01

Similar Documents

Publication Publication Date Title
US5058797A (en) Detection method for wire bonding failures
US5981371A (en) Bump forming method
US3934108A (en) Lead bonding method and apparatus
US4476366A (en) Controlled bonding wire ball formation
JPH0794545A (ja) ワイヤボンデイング装置
JPH0219626B2 (enExample)
JPS5916409B2 (ja) ワイヤボンド形成方法
US4687897A (en) Flame-off limited circuit for wire bonding ball forming apparatus
JPS60231573A (ja) 溶接機のア−クスタ−ト装置
JP3457196B2 (ja) ボールボンディング方法
JP2611891B2 (ja) ワイヤボンディング装置及びその方法
JPS5988842A (ja) ワイヤの接続不良検出方法
JPH0513493A (ja) ワイヤボンデイング装置
JPS6384132A (ja) ワイヤボンデイング検査方法および検査装置
JPH10321665A (ja) ワイヤボンディング用ボールの適否判定方法
JPH10303234A (ja) ワイヤボンディング方法
JPH0250445A (ja) ワイヤーボンディング方法
JPH0237098B2 (enExample)
JPS602154B2 (ja) 抵抗溶接制御方法
JPS62104126A (ja) ワイヤボンデイング方法
JPS62126643A (ja) ワイヤボンデイング方法
JPH06333971A (ja) ワイヤボンディング装置
JP3908380B2 (ja) ワイヤボンディング装置及び該装置を用いた半導体装置の製造方法
JPS59115533A (ja) ワイヤボンデイング装置
JPH11150145A (ja) ワイヤボンディングの検査方法