JPS6098635A - ワイヤボンデイング方法 - Google Patents

ワイヤボンデイング方法

Info

Publication number
JPS6098635A
JPS6098635A JP58207104A JP20710483A JPS6098635A JP S6098635 A JPS6098635 A JP S6098635A JP 58207104 A JP58207104 A JP 58207104A JP 20710483 A JP20710483 A JP 20710483A JP S6098635 A JPS6098635 A JP S6098635A
Authority
JP
Japan
Prior art keywords
ball
wire
bonding
high voltage
tip
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58207104A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0219626B2 (enExample
Inventor
Kazunori Kimura
木村　一乘
Masajiro Takasaki
高崎　正次郎
Hitoshi Sakuma
均 佐久間
Tomio Kobayashi
十三男 小林
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP58207104A priority Critical patent/JPS6098635A/ja
Publication of JPS6098635A publication Critical patent/JPS6098635A/ja
Publication of JPH0219626B2 publication Critical patent/JPH0219626B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/01—Manufacture or treatment
    • H10W72/015—Manufacture or treatment of bond wires
    • H10W72/01551—Changing the shapes of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07511—Treating the bonding area before connecting, e.g. by applying flux or cleaning

Landscapes

  • Wire Bonding (AREA)
JP58207104A 1983-11-04 1983-11-04 ワイヤボンデイング方法 Granted JPS6098635A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58207104A JPS6098635A (ja) 1983-11-04 1983-11-04 ワイヤボンデイング方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58207104A JPS6098635A (ja) 1983-11-04 1983-11-04 ワイヤボンデイング方法

Publications (2)

Publication Number Publication Date
JPS6098635A true JPS6098635A (ja) 1985-06-01
JPH0219626B2 JPH0219626B2 (enExample) 1990-05-02

Family

ID=16534264

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58207104A Granted JPS6098635A (ja) 1983-11-04 1983-11-04 ワイヤボンデイング方法

Country Status (1)

Country Link
JP (1) JPS6098635A (enExample)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681942A (en) * 1979-10-18 1981-07-04 Shinkawa Ltd Ball formation in wire bonder

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5681942A (en) * 1979-10-18 1981-07-04 Shinkawa Ltd Ball formation in wire bonder

Also Published As

Publication number Publication date
JPH0219626B2 (enExample) 1990-05-02

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