JPS5681942A - Ball formation in wire bonder - Google Patents

Ball formation in wire bonder

Info

Publication number
JPS5681942A
JPS5681942A JP13442579A JP13442579A JPS5681942A JP S5681942 A JPS5681942 A JP S5681942A JP 13442579 A JP13442579 A JP 13442579A JP 13442579 A JP13442579 A JP 13442579A JP S5681942 A JPS5681942 A JP S5681942A
Authority
JP
Japan
Prior art keywords
wire
current
tip
regular
ball
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP13442579A
Other languages
Japanese (ja)
Other versions
JPS5917977B2 (en
Inventor
Nobuhito Yamazaki
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Shinkawa Ltd
Original Assignee
Shinkawa Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Shinkawa Ltd filed Critical Shinkawa Ltd
Priority to JP54134425A priority Critical patent/JPS5917977B2/en
Publication of JPS5681942A publication Critical patent/JPS5681942A/en
Publication of JPS5917977B2 publication Critical patent/JPS5917977B2/en
Expired legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies
    • H01L24/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/78268—Discharge electrode
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/7825—Means for applying energy, e.g. heating means
    • H01L2224/783—Means for applying energy, e.g. heating means by means of pressure
    • H01L2224/78301—Capillary
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/74—Apparatus for manufacturing arrangements for connecting or disconnecting semiconductor or solid-state bodies and for methods related thereto
    • H01L2224/78—Apparatus for connecting with wire connectors
    • H01L2224/786—Means for supplying the connector to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/85009—Pre-treatment of the connector or the bonding area
    • H01L2224/8503—Reshaping, e.g. forming the ball or the wedge of the wire connector
    • H01L2224/85035—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball"
    • H01L2224/85045—Reshaping, e.g. forming the ball or the wedge of the wire connector by heating means, e.g. "free-air-ball" using a corona discharge, e.g. electronic flame off [EFO]
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/85—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector
    • H01L2224/851—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a wire connector the connector being supplied to the parts to be connected in the bonding apparatus
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To elevate the rate of operation of a wire bonder by a method wherein even if an interval between the tip of a bonding wire and the electrode of the bonding torch becomes to be large, a regular ball is formed. CONSTITUTION:When the gap between the tip of the wire 2 and the electrode 8 of the electric torch bocomes large, the current in a conductor 10 is reduced. Misdischarge is detected 11 and is amplified 12, and when it is decided 13 that the current is smaller than the regular ball forming current, a signal is generated to drive the power source 9, and a voltage higher than the egular voltage is supplied again. Terefore, even if the gap is larger than the prescribed value, a regular ball is formed. When the regular current does not flow in the conductor 10 after said process, it is decided 13 for the first time as the faulty ball formation, or when the wire 2 is not fed to the tip of the capillary 4 on account of cutting off of the wire 2, the current does not flow and the machine is made to stop without delay.
JP54134425A 1979-10-18 1979-10-18 Ball forming method in wire bonder Expired JPS5917977B2 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP54134425A JPS5917977B2 (en) 1979-10-18 1979-10-18 Ball forming method in wire bonder

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP54134425A JPS5917977B2 (en) 1979-10-18 1979-10-18 Ball forming method in wire bonder

Publications (2)

Publication Number Publication Date
JPS5681942A true JPS5681942A (en) 1981-07-04
JPS5917977B2 JPS5917977B2 (en) 1984-04-24

Family

ID=15128074

Family Applications (1)

Application Number Title Priority Date Filing Date
JP54134425A Expired JPS5917977B2 (en) 1979-10-18 1979-10-18 Ball forming method in wire bonder

Country Status (1)

Country Link
JP (1) JPS5917977B2 (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6098635A (en) * 1983-11-04 1985-06-01 Shinkawa Ltd Wire bonding method
JPS60125734U (en) * 1984-01-31 1985-08-24 関西日本電気株式会社 Ponding equipment
JP2005268304A (en) * 2004-03-16 2005-09-29 Nec Corp Device and method for forming ball for bonding

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS6098635A (en) * 1983-11-04 1985-06-01 Shinkawa Ltd Wire bonding method
JPH0219626B2 (en) * 1983-11-04 1990-05-02 Shinkawa Kk
JPS60125734U (en) * 1984-01-31 1985-08-24 関西日本電気株式会社 Ponding equipment
JP2005268304A (en) * 2004-03-16 2005-09-29 Nec Corp Device and method for forming ball for bonding

Also Published As

Publication number Publication date
JPS5917977B2 (en) 1984-04-24

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