JP2005268304A - Device and method for forming ball for bonding - Google Patents

Abstract

<P>PROBLEM TO BE SOLVED: To provide a device and method for forming a ball for bonding that enable bonding of stable quality. <P>SOLUTION: It is decided whether a formed ball is good from process data of at least one of a discharging current and a discharging voltage to enable high-precision stable decision, as compared with a decision on the formed ball which is made by extracting a momentary discharging current or discharging voltage. <P>COPYRIGHT: (C)2005,JPO&NCIPI

Description

  The present invention is for a bonder in which a high voltage is applied between a tip of a wire fed from a capillary tip and a discharge electrode to cause a discharge, and the tip of the wire is melted by the energy of the discharge to form a ball. The present invention relates to a ball forming apparatus and a bonder ball forming method.

An example of a ball forming apparatus to which a conventional ball forming method is applied is shown in FIG.
As shown in FIG. 8, the conventional ball forming apparatus integrates the output from the discharge voltage partial pressure detector 5, the discharge current detector 4, the discharge voltage division detector 5 and the discharge current detector 4 as discharge energy. An integrator 44, a voltage comparator 45 that compares the calculated discharge energy with a reference value, and a timer reset signal generator 47. CL is a clear signal.

The conventional ball forming apparatus having such a configuration operates as follows.
The microcomputer (arithmetic circuit) 48 calculates discharge energy necessary for forming a predetermined ball based on the ball diameter data input from the keyboard execution switch 49, and uses the calculated discharge energy as a reference value for the voltage comparator 45. On the other hand, the voltage and current at the time of discharge are detected, the value of the detected discharge voltage and the value of the discharge current are multiplied by the multiplier 43, and the multiplied value is integrated by the integrator 44 to The energy is obtained and the integrated value is input to the voltage comparator 45 and compared with the reference value. When the energy at the time of discharge reaches the reference value, the discharge is stopped and a ball of a predetermined size is obtained. It forms (for example, refer patent document 1).

In addition, as the ball forming apparatus, a wire bonding apparatus (for example, refer to Patent Document 2) that performs discard bonding when a defective ball is generated, or a change in discharge voltage or a discharge voltage after a predetermined time has elapsed from the start of discharge. The wire bonding apparatus (for example, refer to Patent Document 3) that compares the value with the reference value and compares the voltage value at the end of the discharge with the reference value, measures the integrated value of the discharge voltage value or the discharge power, and compares it with the reference value. Even if an unstable operation occurs during the discharge process, if the integrated value of the discharge power is within the range, a ball of a desired size is generated, so it can be judged as a non-defective product (if the discharge energy is the same, the ball A wire bonding apparatus that compares a voltage value at the end of discharge with a reference value and a semiconductor manufacturing method using the apparatus (for example, see Patent Document 4). It is below.
JP 2000-174054 A Japanese Patent Laid-Open No. 6-5651 JP-A-6-333971 JP-A-11-307576

By the way, the invention described in Patent Document 1 described above calculates the discharge energy necessary for a predetermined ball size, stops the discharge when the calculated discharge energy reaches the reference value of the comparator, and sets the predetermined energy. However, there is a problem that the quality of the ball varies. The reason for this is that when the distance between the wire at the tip of the capillary and the spark rod is different from the set value, or when the wire is dirty or dust is attached to the discharge electrode, the discharge process changes and the ball is formed. This is because the temperatures of the balls differ, and ball quality, for example, variations in hardness and crystal structure occur, affecting the bonding quality.
In addition, the inventions described in Patent Documents 2 to 4 compare the discharge value at the start of discharge, at the end of discharge, or the integrated value, but do not consider changes in the discharge process, and the determination of non-defective products becomes insufficient. There is a possibility that bonding with stable quality cannot be performed.
Therefore, an object of the present invention is to provide a bonder ball forming apparatus and a bonder ball forming method capable of performing bonding with stable quality.

  In order to solve the above-mentioned problems, the invention according to claim 1 causes a discharge by applying a high voltage between the tip of the wire fed from the tip of the capillary and the discharge electrode, and the energy of the discharge causes the discharge of the wire. A ball forming apparatus for a bonder for forming a ball by melting a tip portion, current detection means for detecting process data of a discharge current flowing between the wire and the discharge electrode, the wire and the discharge electrode, Voltage detecting means for detecting the process data of the discharge voltage applied between the first and second determination means, and first determination means for determining the quality of the formed ball from the process data of at least one of the discharge current and the discharge voltage. It is characterized by that.

  According to the first aspect of the present invention, by determining the quality of the formed ball from the process data of at least one of the discharge current and the discharge voltage, a certain instantaneous discharge current or discharge voltage is extracted and the formed ball It is possible to make a highly accurate and stable determination as compared with the case of determining pass / fail.

  According to the second aspect of the present invention, a high voltage is applied between the tip of the wire fed from the tip of the capillary and the discharge electrode to cause a discharge, and the tip of the wire is melted by the energy of the discharge so that the ball is A bonder ball forming apparatus for forming a current detection means for detecting a process waveform of a discharge current flowing between the wire and the discharge electrode, and a discharge voltage applied between the wire and the discharge electrode. Voltage detecting means for detecting the process waveform, and second determining means for judging the quality of the formed ball from the process waveform of at least one of the discharge current and the discharge voltage.

  According to the third aspect of the present invention, a high voltage is applied between the tip of the wire fed from the tip of the capillary and the discharge electrode to cause discharge, and the tip of the wire is melted by the energy of the discharge so that the ball is A bonder ball forming apparatus for forming a current detection means for detecting a process waveform of a discharge current flowing between the wire and the discharge electrode, and a discharge voltage applied between the wire and the discharge electrode. The voltage detection means for detecting the process waveform of the above, the process waveform of at least one of the discharge current and the discharge voltage and a reference discharge process waveform are compared, and the quality of the formed ball is determined from the comparison data of the comparison means And a third determining means for determining.

  The invention according to claim 4 causes a discharge by applying a high voltage between the tip of the wire fed from the tip of the capillary and the discharge electrode, and melts the tip of the wire by the energy of the discharge, thereby A bonder ball forming apparatus for forming a current detection means for detecting process data of a discharge current flowing between the wire and the discharge electrode, and a discharge voltage applied between the wire and the discharge electrode. The voltage detection means for detecting the process data, the process data from the current detection means and the process data obtained from the voltage detection means are multiplied to calculate the discharge power, and the process data of the reference discharge power is obtained. And a fourth determination means for determining whether the formed ball is good or bad.

  According to the fifth aspect of the present invention, a high voltage is applied between the tip of the wire fed from the tip of the capillary and the discharge electrode to cause discharge, and the tip of the wire is melted by the energy of the discharge so that the ball is A bonder ball forming method to be formed, comprising: detecting a process data of a discharge current flowing between the wire and the discharge electrode; and a process of a discharge voltage applied between the wire and the discharge electrode. A step of detecting data, and a step of determining the quality of the formed ball from the process data of at least one of the discharge current and the discharge voltage.

  According to the sixth aspect of the present invention, a high voltage is applied between the tip of the wire fed from the tip of the capillary and the discharge electrode to cause discharge, and the tip of the wire is melted by the energy of the discharge so that the ball is A bonder ball forming method, comprising: detecting a process waveform of a discharge current flowing between the wire and the discharge electrode; and a process of a discharge voltage applied between the wire and the discharge electrode And a step of detecting a waveform, and a step of determining the quality of the formed ball from at least one process waveform of the discharge current and the discharge voltage.

  According to the seventh aspect of the present invention, a high voltage is applied between the tip of the wire fed from the tip of the capillary and the discharge electrode to cause a discharge, and the tip of the wire is melted by the energy of the discharge so that the ball is A bonder ball forming method, comprising: detecting a process waveform of a discharge current flowing between the wire and the discharge electrode; and a process of a discharge voltage applied between the wire and the discharge electrode A step of detecting a waveform, a step of comparing at least one process waveform of the discharge current and the discharge voltage with a reference discharge process waveform, and determining the quality of the formed ball from the comparison data of the comparison means; It is provided with.

  According to the eighth aspect of the invention, a high voltage is applied between the tip of the wire fed from the tip of the capillary and the discharge electrode to cause a discharge, and the tip of the wire is melted by the energy of the discharge so that the ball is A bonder ball forming method to be formed, comprising: detecting a process data of a discharge current flowing between the wire and the discharge electrode; and a process of a discharge voltage applied between the wire and the discharge electrode. The process of detecting data, the process data from the current detection means and the process data obtained from the voltage detection means are multiplied to calculate the discharge power, and the process data of the reference discharge power is compared and formed And a step of determining whether the ball is good or bad.

  According to the present invention, the quality of a ball formed by extracting a certain instantaneous discharge current or discharge voltage is determined by determining the quality of the formed ball from the process data of at least one of the discharge current and the discharge voltage. Compared to the case, a highly accurate and stable determination can be performed.

  The ball forming apparatus for bonding according to the present invention causes a discharge by applying a high voltage between the tip of the wire delivered from the tip of the capillary and the discharge electrode, and melts the tip of the wire by the discharge energy. A bonding ball forming apparatus for forming a voltage detecting means for measuring a discharge voltage between a wire and a discharge electrode, a current detecting means for measuring a discharge current flowing between the wire and a spark rod, and a voltage The power detection means for calculating the discharge power by multiplying the output of the detection means and the output of the current detection means, the discharge voltage output data from the voltage detection means or the discharge current output data or the discharge power output data from the current detection means and the discharge Unlike the discharge reference data, it is used to determine the quality of ball formation by comparison means that compares with the reference data. Not performed bonded to the bonding pad is a product if the ball inferior quality are formed. In addition, the ball determined to be defective by the bonding ball forming apparatus according to the present invention is disposed at a position other than the bonding pad of the product, for example, a dummy pad at an unnecessary position as a finished product or a bonding pad disposed on the bonding apparatus. The object of the present invention can be achieved by performing abandonment bonding automatically at a place to form a normal ball and then performing continuous bonding from a normal bonding pad position.

Next, the best mode for carrying out the invention will be described in detail with reference to the drawings.
(First embodiment)
FIG. 1 is a block diagram showing a first embodiment of a bonder ball forming apparatus to which a bonder ball forming method of the present invention is applied.
Referring to FIG. 1, a bonder ball forming apparatus according to the present invention includes a DC high voltage power source 1 that generates a high voltage, a constant current switch 2 that controls discharge by a discharge start trigger signal (Tr), and a discharge current. Discharge is performed through the discharge stabilizer 3 for stabilization, the discharge electrode 18 for discharging the wire 17 inserted into the capillary 16 as a bonding tool via the clamper 15, the DC high-voltage power supply 1, the wire 17 and the clamper 15. A discharge current detector 4 for measuring a discharge current, a discharge voltage division detector 5 for detecting a value of a DC high voltage applied between the wire 17 and the discharge electrode 18, and a ball having a desired size are produced. A microcomputer 10 for setting a discharge condition at the time, and a current setter 11 for setting a current value for the constant current switch 2 based on the discharge condition set by the microcomputer 10 The comparison data setting unit 9 for setting the reference discharge current data and the reference discharge voltage data under the discharge conditions set by the microcomputer 10, the output voltage from the discharge current detector 4, and the output voltage from the discharge voltage division detector 5 It comprises a voltage comparison pass / fail judgment unit 8 that compares the reference discharge data stored in the comparison data setter 9 and judges the quality of the discharge.

  The negative terminal (−) of the DC high-voltage power supply 1 applies a negative voltage to the discharge electrode 18 via the constant current switch 2 and the discharge stabilizer 3. The constant current switch 2 is connected to a mechanism for executing switching control of a switch circuit built in the constant current switch 2 so that a discharge start trigger signal Tr as a discharge start signal is applied. Thus, while the switch circuit is “ON”, the constant current switch 2 controls the constant current to flow between the discharge electrode 18 and the wire 17. Further, the constant current switch 2 is connected to a current setting device 11 for setting a current flowing in the discharge path between the wire 17 sent to the tip of the capillary 16 and the discharge electrode 18. The value is set by a command from the microcomputer 10. The comparison data setter 9 stores reference discharge current data and reference discharge voltage data for the discharge conditions specified by the microcomputer 10. The voltage comparison pass / fail judgment unit 8 compares the discharge current data flowing in the discharge path between the wire 17 sent to the tip of the capillary 16 and the discharge electrode 18 with the reference discharge current data set in the comparison data setter 9. At the same time, the discharge voltage data applied to the discharge path between the wire 17 sent to the tip of the capillary 16 and the discharge electrode 18 is compared with the reference discharge voltage data set in the comparison data setter 9, and the reference discharge current is compared. A threshold value with a predetermined width is set for the data and the reference discharge voltage data, and when one or both of the actual discharge current data and the discharge voltage data exceed the threshold value, it is determined as defective discharge, and the micro A signal is transmitted to the computer 10. When the microcomputer 10 receives the defective discharge signal, the microcomputer 10 temporarily stops the bonding operation and controls to discard the bonding operation.

Next, the overall operation of the present embodiment will be described in detail with reference to the discharge current waveforms of FIGS.
FIG. 2 is a diagram showing discharge data in the bonder ball forming apparatus shown in FIG.
In FIG. 2, the horizontal axis represents time, and the vertical axis represents voltage (discharge trigger, discharge voltage, defective discharge signal) and current (discharge current).

  As shown in FIG. 1, a discharge current detector 4 is provided as a current detection means for detecting a discharge current flowing between a wire 17 located at the tip of a capillary 16 as a bonding tool and a discharge electrode 18. The discharge current detector 4 is provided with a low resistance between the clamper 15 and the + (plus) electrode of the DC high-voltage power supply 1, and the voltage value generated at both ends of the low resistance as a discharge current flows as the discharge current. To detect. That is, the voltage value proportional to the magnitude of the discharge current is detected by the discharge current detector 4. The detected voltage value as the discharge current value is input to the input terminal of the voltage comparison pass / fail judgment unit 8.

  Furthermore, a discharge voltage division detector 5 is provided as voltage detection means for detecting a DC high voltage applied between the wire 17 located at the tip of the capillary 16 as a bonding tool and the discharge electrode 18. The discharge voltage division detector 5 is composed of a voltage dividing circuit composed of a high resistance and a low resistance, and detects a voltage value at both ends of the low resistance as a discharge voltage. The voltage comparison pass / fail judgment unit 8 compares the output voltage data from the discharge current detector 4 and the output voltage data from the discharge voltage division detector 5 with the output voltage data from the comparison data setter 9 to detect the discharge current. When the output voltage data from the detector 4 is out of the range of the reference discharge current data set by the comparison waveform setter 9, or the output voltage data from the discharge voltage division detector 5 is set by the comparison waveform setter 9 When the reference discharge voltage data is out of the range of the reference data, or when both the discharge current data and the discharge voltage data are out of the range of the reference data, a discharge failure signal is transmitted to the microcomputer 10. In the comparison data setter 9, normal discharge current data and discharge voltage data for forming a desired ball are set from the microcomputer 10.

The operation of the apparatus having the above configuration will be described below with reference to the graph shown in FIG.
As discharge data when forming a desired ball, reference discharge current data and discharge voltage data are read from the microcomputer 10 and set in the comparison data setting unit 9 with a variation width determined to be normal ( FIG. 2—denoted by reference numerals 51, 52, 53, 57, 58, 59).

  As shown in FIG. 1, when the wire 17 and the discharge electrode 18 are separated from each other by a predetermined distance S, the constant current switch 2 is supplied from an external control means, for example, a computer (not shown) for controlling the entire bonding operation. Is applied with a discharge start trigger signal Tr, and discharge is started between the discharge electrode 18 and the wire 17 (indicated by reference numeral 50 in FIG. 2).

  Since the discharge current does not flow immediately after the start of discharge, the constant current switch 2 applies a high voltage between the wire 17 and the discharge electrode 18 (indicated by reference numeral 54 in FIG. 2), and the wire 17 and the discharge electrode 18 The insulation between the two is destroyed, and after the insulation breakdown, control is performed so as to become a constant current (indicated by reference numeral 55 in FIG. 2). When this discharge is started, the voltage as the discharge current detected by the discharge current detector 4 and the discharge voltage applied between the wire 17 and the discharge electrode 18 are determined from the discharge voltage division detector 5 as a voltage comparison pass / fail judgment. Is output to the input terminal of the device 8.

  The voltage comparison pass / fail judgment unit 8 outputs the reference discharge current data (indicated by reference numeral 51 in FIG. 2) output from the comparison data setting unit 9 and the output from the discharge current detector 15 (indicated by reference numeral 54 in FIG. 2). At the same time as the comparison with the data, the reference discharge voltage data (indicated by reference numeral 57 in FIG. 2) and the discharge voltage division detector 5 (indicated by reference numeral 54 in FIG. 2) output from the comparison data setting unit 9. Make a comparison. The voltage comparison pass / fail judgment unit 8 is configured by an upper limit value (indicated by reference numeral 52 in FIG. 2) of discharge current data set by the microcomputer 10 and a lower limit value (indicated by reference numeral 53 in FIG. 2) of discharge current data. When the output voltage data from the discharge current detector 4 is not included in the normal discharge determination width (indicated by reference numeral 54 in FIG. 2), or the upper limit value of the discharge voltage data set by the microcomputer 10 (see FIG. 2-indicated by reference numeral 58) and when the output voltage data from the discharge voltage division detector 5 is not included in the normal discharge determination width of the discharge voltage data lower limit (indicated by reference numeral 59 in FIG. 2). (Indicated by reference numeral 54 in FIG. 2) Or, when both the discharge current data and the discharge voltage data are out of the range of the reference discharge data, the voltage comparison pass / fail judgment unit 8 causes the microcomputer 10 to perform a defective discharge. No. (shown in Figure 2 reference numeral 56.) By sending a control not to perform bonding operation.

When a discharge failure occurs, when the failure discharge is transmitted from the microcomputer 10 to, for example, a computer (not shown) that controls the entire bonding operation, the defective ball is thrown to the designated bonding pad and bonding is automatically performed. After that, discharging is performed again, and when it is determined that the ball has been normally formed, normal bonding is automatically resumed.
Here, the position where the abandonment bonding is performed may be performed on the lead frame which is a product so as not to affect the subsequent process. Alternatively, a bonding pad for exclusive use of discarded bonding may be installed and discarded for bonding. Furthermore, when defective discharge occurs continuously, dirt on the wire, dirt on the clamp part, damage on the discharge electrode, and the like may be considered.

When the distance S between the wire at the tip of the capillary and the discharge electrode is different from the normal value, the rise time and maximum value of the discharge voltage and discharge current are different from the normal value. If dust is attached to the wire at the tip of the capillary or is dirty, the energy from the discharge is transferred to the dust or dirt, so not all of the set discharge energy is supplied to the wire. The process, for example, the discharge current waveform and the discharge voltage waveform are different from the normal time.
Further, since the melting temperature of the wire is changed by changing the discharge energy transfer due to the different discharge processes, the quality of the ball, for example, the hardness and the crystal structure is varied, which affects the bonding quality.

Next, the effect of this embodiment will be described.
The present embodiment is configured to compare the actual discharge current data with the reference normal discharge current data, and at the same time, compare the actual discharge voltage data with the reference normal discharge voltage data. Therefore, it can be determined whether or not the ball is formed by normal discharge. In addition, since only balls formed by normal discharge are bonded, a product with stable quality can be manufactured. Further, since the abandoned bonding is automatically performed, the operation of forming a normal ball by the operator is eliminated, so that the operating rate of the apparatus can be improved.

(Second Embodiment)
Next, a second embodiment of the present invention will be described with reference to the drawings.
FIG. 3 is a block diagram showing a second embodiment of a bonder ball forming apparatus to which the bonder ball forming method of the present invention is applied. FIG. 4 is a diagram showing discharge data in the bonder ball forming apparatus shown in FIG.

In FIG. 4, the horizontal axis indicates time, and the vertical axis indicates voltage (discharge trigger, discharge voltage, defective discharge signal) and current (discharge current).
In the bonder ball forming apparatus of the present invention, the discharge voltage division detector 5 is deleted from the first embodiment, the discharge current data discharged through the DC high voltage power source 1, the wire 17, and the clamper 15 and the microcomputer 10 are used. Compared with the set reference discharge current data (see FIG. 3 and FIG. 4), it is configured to determine the quality of the formed ball, and the overall operation is also determined from the first embodiment with the discharge voltage division detector. Detailed description is omitted for the operation in which 5 is deleted.

The effect of this embodiment will be described.
In the second embodiment, since only the comparison between the actual discharge current data and the reference normal discharge current data is performed, the ball formed by the discharge is compared with the first embodiment. However, since the configuration is reduced, the cost can be reduced.

(Third embodiment)
Next, a third embodiment of the present invention will be described with reference to the drawings.
FIG. 5 is a block diagram showing a third embodiment of the present invention. FIG. 6 is a diagram showing discharge data in the bonder ball forming apparatus shown in FIG.
In FIG. 6, the horizontal axis indicates time, and the vertical axis indicates voltage (discharge trigger, discharge voltage, defective discharge signal) and current (discharge current).

  In the third embodiment of the present invention, the discharge current detector 4 is eliminated from the first embodiment of the present invention, and the wire 17 positioned at the tip of the capillary 16 as a bonding tool and the discharge electrode 18 are removed. The configuration is such that the quality of the formed ball is determined by comparing the DC high voltage data applied to the reference voltage data and the reference discharge voltage data set by the microcomputer 10 (see FIGS. 5 and 6). Detailed description is omitted because of the operation in which the discharge current detector 4 is omitted from the first embodiment.

The effect of this embodiment will be described.
In the third embodiment, since only the comparison between the actual discharge voltage data and the reference normal discharge voltage data is performed, the ball formed by the discharge compared to the first embodiment. However, since the configuration is reduced, the cost can be reduced.

(Fourth embodiment)
Next, a fourth embodiment of the present invention will be described with reference to the drawings.
FIG. 7 is a diagram showing discharge data in the fourth embodiment of the bonder ball forming apparatus of the present invention.
In FIG. 7, the horizontal axis represents time, and the vertical axis represents voltage (discharge trigger, discharge voltage, defective discharge signal) and current (discharge current).
The configuration of the fourth embodiment of the present invention is the same as that of the first embodiment of the present invention, but reference discharge power data is set from the microcomputer 10 in the comparison data setting unit 9. The voltage comparison pass / fail judgment unit 8 is applied between the output from the discharge current detector 4 for measuring the discharge current discharged through the DC high voltage power source 1, the wire 17 and the clamper 15, and the wire 17 and the discharge electrode 18. In this configuration, the discharge power is calculated by multiplying the output from the discharge voltage division detector 5 that detects the DC high voltage data, and is compared with the reference discharge power data set in the comparison data setter 9.

  When the discharge is started, the voltage comparison pass / fail judgment unit 8 multiplies the reference discharge power data (indicated by reference numeral 60 in FIG. 7) output from the comparison data setting unit 9, the actual discharge current data, and the discharge voltage data. Comparison is made with the calculated discharge power data (indicated by reference numeral 63 in FIG. 7), and the upper limit value (indicated by reference numeral 61 in FIG. 7) of the discharge power data set from the microcomputer 10 and the discharge power data. When the actual discharge power data is not included in the normal discharge determination range of the lower limit value (indicated by reference numeral 62 in FIG. 7) (indicated by reference numeral 63 in FIG. 7), the voltage comparison pass / fail determination unit 8 is a microcomputer. A defective discharge signal (indicated by reference numeral 56 in FIG. 7) is transmitted to 10 so as not to perform the bonding operation.

Next, the effect of this embodiment will be described.
In the fourth embodiment, by measuring the actual discharge power data, it is possible to determine the quality of the formed ball by observing the discharge process that is not clarified by measuring only the discharge current data or only the discharge voltage data. .
In addition to comparing the entire current waveform, voltage waveform, and power waveform during discharge with reference data, part of the discharge process data, for example, the delay time of the rise of each waveform or the slope of the change Alternatively, the maximum value or the like may be compared with the reference data.

(The invention's effect)
The first effect is that only products with stable quality can be manufactured.
The reason is to bond only stable quality balls by measuring the discharge process during ball formation.
The second effect is that the occurrence of non-sticking caused by the bonding apparatus can be reduced.
The reason is that non-sticking caused by the ball can be reduced by bonding only a ball of stable quality.
The third effect is that the operating rate of the apparatus can be improved.
The reason for this is that when a defective ball is formed, it is possible to eliminate the process of forming a normal ball by an operator by automatically disposing and bonding the device to temporarily stop the apparatus.

  The present invention can be applied to a bump bonder apparatus in which bonding is performed by forming a ball by discharging at the tip of a wire. The present invention can also be applied to a wire bonding apparatus that discharges at the tip of a wire to form a ball, performs first bonding, and directly connects the wire to the second bonding position.

1 is a block diagram showing a first embodiment of a bonder ball forming apparatus to which a bonder ball forming method of the present invention is applied. It is a figure which shows the discharge data in the ball formation apparatus for bonders shown in FIG. It is a block diagram which shows 2nd Embodiment of the ball formation apparatus for bonders which applied the ball formation method for bonders of this invention. It is a figure which shows the discharge data in the ball formation apparatus for bonders shown in FIG. It is a block diagram which shows the 3rd Embodiment of this invention. It is a figure which shows the discharge data in the ball formation apparatus for bonders shown in FIG. FIG. 7 is a diagram showing discharge data in the fourth embodiment of the bonder ball forming apparatus of the present invention. It is a figure which shows an example of the ball | bowl formation apparatus to which the conventional ball | bowl formation method is applied.

Explanation of symbols

DESCRIPTION OF SYMBOLS 1 DC high voltage power supply 2 Constant current switch 3 Discharge ballast 4 Discharge current detector 5 Discharge voltage division detector 8 Voltage comparison pass / fail judgment device 9 Comparison data setting device 10 Microcomputer 11 Current setting device 15, 36 Clamper 16, 38 Capillary 17, 37 Wire 18, 35 Discharge electrode 31 DC high voltage power supply 32 Constant current switch 33 Discharge ballast 34 Timer synchronization 39 Discharge ballast 40 Current value setting signal generator 41 Discharge voltage division detector 42 Discharge current detector 43 Multiplier 44 Integrator 45 Voltage comparator 46 Comparison level setter 47 Timer reset signal generator 48 Microcomputer (arithmetic circuit)
49 Keyboard execution switch 50 Discharge start trigger 51 Reference discharge current data 52 Discharge current upper limit data 53 Discharge current lower limit data 54 Discharge voltage data 55 Discharge current data 56 Pass / fail judgment signal 57 Reference discharge voltage data 58 Discharge voltage upper limit data 59 Discharge voltage lower limit data 60 Reference discharge power data 61 Discharge power upper limit data 62 Discharge power lower limit data 63 Discharge power data

Claims (8)

A bonder ball forming device that causes a discharge by applying a high voltage between the tip of the wire fed from the capillary tip and the discharge electrode, and melts the tip of the wire by the energy of the discharge to form a ball. There,
Current detection means for detecting process data of a discharge current flowing between the wire and the discharge electrode;
Voltage detection means for detecting process data of a discharge voltage applied between the wire and the discharge electrode;
A bonder ball forming apparatus, comprising: a first determination unit configured to determine the quality of a formed ball from process data of at least one of the discharge current and the discharge voltage. A bonder ball forming device that causes a discharge by applying a high voltage between the tip of the wire fed from the capillary tip and the discharge electrode, and melts the tip of the wire by the energy of the discharge to form a ball. There,
Current detection means for detecting a process waveform of a discharge current flowing between the wire and the discharge electrode;
Voltage detection means for detecting a process waveform of a discharge voltage applied between the wire and the discharge electrode;
A bonder ball forming apparatus comprising: a second determination unit configured to determine the quality of a formed ball from at least one process waveform of the discharge current and the discharge voltage. A bonder ball forming device that causes a discharge by applying a high voltage between the tip of the wire fed from the capillary tip and the discharge electrode, and melts the tip of the wire by the energy of the discharge to form a ball. There,
Current detection means for detecting a process waveform of a discharge current flowing between the wire and the discharge electrode;
Voltage detection means for detecting a process waveform of a discharge voltage applied between the wire and the discharge electrode;
A third determination means for comparing the process waveform of at least one of the discharge current and the discharge voltage with a reference discharge process waveform and determining the quality of the formed ball from the comparison data of the comparison means; A bonder ball forming apparatus. A bonder ball forming device that causes a discharge by applying a high voltage between the tip of the wire fed from the capillary tip and the discharge electrode, and melts the tip of the wire by the energy of the discharge to form a ball. There,
Current detection means for detecting process data of a discharge current flowing between the wire and the discharge electrode;
Voltage detection means for detecting process data of a discharge voltage applied between the wire and the discharge electrode;
The discharge power is calculated by multiplying the process data from the current detection means and the process data obtained from the voltage detection means, and the process data of the reference discharge power is compared to determine the quality of the formed ball. A bonder ball forming apparatus comprising: a fourth determination unit. A bonder ball forming method in which a discharge is caused by applying a high voltage between the tip of the wire fed from the capillary tip and the discharge electrode, and the tip of the wire is melted by the energy of the discharge to form a ball. There,
Detecting process data of a discharge current flowing between the wire and the discharge electrode;
Detecting process data of a discharge voltage applied between the wire and the discharge electrode;
A bond ball forming method comprising: determining whether or not the formed ball is good from at least one process data of the discharge current and the discharge voltage. A bonder ball forming method in which a discharge is caused by applying a high voltage between the tip of the wire fed from the capillary tip and the discharge electrode, and the tip of the wire is melted by the energy of the discharge to form a ball. There,
Detecting a process waveform of a discharge current flowing between the wire and the discharge electrode;
Detecting a process waveform of a discharge voltage applied between the wire and the discharge electrode;
A bond ball forming method, comprising: determining a quality of a formed ball from a process waveform of at least one of the discharge current and the discharge voltage. A bonder ball forming method in which a discharge is caused by applying a high voltage between the tip of the wire fed from the capillary tip and the discharge electrode, and the tip of the wire is melted by the energy of the discharge to form a ball. There,
Detecting a process waveform of a discharge current flowing between the wire and the discharge electrode;
Detecting a process waveform of a discharge voltage applied between the wire and the discharge electrode;
A step of comparing a process waveform of at least one of the discharge current and the discharge voltage with a reference discharge process waveform, and determining whether the formed ball is good or bad from comparison data of the comparison unit. Bonder ball forming method. A bonder ball forming method in which a discharge is caused by applying a high voltage between the tip of the wire fed from the capillary tip and the discharge electrode, and the tip of the wire is melted by the energy of the discharge to form a ball. There,
Detecting process data of a discharge current flowing between the wire and the discharge electrode;
Detecting process data of a discharge voltage applied between the wire and the discharge electrode;
The discharge power is calculated by multiplying the process data from the current detection means and the process data obtained from the voltage detection means, and the process data of the reference discharge power is compared to determine the quality of the formed ball. A bonder ball forming method comprising the steps of:

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