JPH021862Y2 - - Google Patents
Info
- Publication number
- JPH021862Y2 JPH021862Y2 JP18727385U JP18727385U JPH021862Y2 JP H021862 Y2 JPH021862 Y2 JP H021862Y2 JP 18727385 U JP18727385 U JP 18727385U JP 18727385 U JP18727385 U JP 18727385U JP H021862 Y2 JPH021862 Y2 JP H021862Y2
- Authority
- JP
- Japan
- Prior art keywords
- resin
- lead
- semiconductor device
- sealed
- lead frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 239000004065 semiconductor Substances 0.000 claims description 37
- 239000008188 pellet Substances 0.000 claims description 13
- 230000000694 effects Effects 0.000 description 9
- 230000017525 heat dissipation Effects 0.000 description 9
- 239000011347 resin Substances 0.000 description 8
- 229920005989 resin Polymers 0.000 description 8
- 238000007789 sealing Methods 0.000 description 3
- 239000004020 conductor Substances 0.000 description 2
- 238000005520 cutting process Methods 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000003825 pressing Methods 0.000 description 2
- 238000005452 bending Methods 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000004080 punching Methods 0.000 description 1
- 230000002787 reinforcement Effects 0.000 description 1
- 230000003014 reinforcing effect Effects 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/0001—Technical content checked by a classifier
- H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
Landscapes
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18727385U JPH021862Y2 (US20100223739A1-20100909-C00005.png) | 1985-12-06 | 1985-12-06 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP18727385U JPH021862Y2 (US20100223739A1-20100909-C00005.png) | 1985-12-06 | 1985-12-06 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS6296857U JPS6296857U (US20100223739A1-20100909-C00005.png) | 1987-06-20 |
| JPH021862Y2 true JPH021862Y2 (US20100223739A1-20100909-C00005.png) | 1990-01-17 |
Family
ID=31137602
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP18727385U Expired JPH021862Y2 (US20100223739A1-20100909-C00005.png) | 1985-12-06 | 1985-12-06 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH021862Y2 (US20100223739A1-20100909-C00005.png) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4167715B1 (ja) * | 2007-08-13 | 2008-10-22 | オーナンバ株式会社 | ツインチップ搭載型ダイオード |
-
1985
- 1985-12-06 JP JP18727385U patent/JPH021862Y2/ja not_active Expired
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6296857U (US20100223739A1-20100909-C00005.png) | 1987-06-20 |
