JPH0218219A - Feed method of electronic parts - Google Patents

Abstract

PURPOSE:To align large-sized electronic parts efficiently within a short time and supply them to a processing device easily by oscillating an alignment base plate, distributing the electronic parts into a long channel to align them, and then slanting the base plate. CONSTITUTION:An alignment base plate 11 is prepared, disposed horizontally, and loaded with chip capacitors 1 having a width W-1,.... The alignment base plate 11 is vibrated horizontally to distribute the chip capacitors 1 into long channels 12-1,.... The chip capacitors inserted and aligned in the long channels 12-1,... are slipped down into each one end side of the long channels 12-1,... by disposing a press plate 21 for preventing the bouncing out of the chip capacitors 1 on the alignment base plate 11 so that it does not cover the chip capacitors in each one end part of the alignment channels 12-1,... and slanting said alignment base plate 11.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention relates to an electronic component processing device such as a taping device for taping leadless electronic components or electronic component elements having a chip shape such as a square or round shape or a disk shape. The present invention relates to a method for supplying electronic components to a manufacturer.

[Prior Art] Generally, in the manufacturing process of electronic components such as capacitors, resistors, and inductors, and the product packaging process, electronic component elements and electronic components are aligned before being supplied to an electronic component processing device such as a taping device. .

Conventionally, when electronic components of this kind, for example chip capacitors l having a chip shape as shown in FIG. 6, are arranged and supplied to a taping device, an alignment substrate 2 as shown in FIG. 7 is used. is well known. This alignment board 2 is made of metal or resin, and has a rectangular alignment hole 3 on one main surface having a size that is approximately equal to the external size of the chip capacitor 1 and into which the chip capacitor 1 can fit. It is formed in a matrix shape. A chip capacitor l is placed on this alignment substrate 2,
When the alignment substrate 2 is vibrated in the horizontal direction, the chip capacitors 1 are inserted into the alignment holes 3 of the alignment substrate 2 and aligned. Then, the alignment substrate 2 with the chip capacitors 1 housed in each alignment hole 3 is set in a taping device (not shown), and each chip capacitor 1 is placed in the alignment hole 3. is picked up by a vacuum chuck, transported to the taping position, and wrapped with tape.

[Problems to be Solved by the Invention] As described above, the method of supplying chip capacitors l to a taping device using the alignment plate 2 in which the alignment holes 3 are formed in a matrix has the following problems. It had That is, when transferring a chip capacitor l, a large-sized chip capacitor l is placed on the alignment hole 3 of the alignment board 2 so that the length direction and the width direction of the chip capacitor l are aligned with the length direction and the width direction of the alignment hole 3, respectively. If they do not match, the money cannot be transferred to the alignment hole 3 of the alignment board 2.

In particular, as shown in FIG. 8, when the chip capacitor 1 whose lengthwise dimension is approximately equal to the widthwise dimension W is rotated 90 degrees with respect to the alignment hole 3 and fitted into the alignment hole 3 in this state,
Since the chip capacitor l cannot rotate in the direction shown by arrow A or A because its three end surfaces are engaged with the three inner walls of the alignment hole 3, the chip capacitor l is caused by the vibration of the alignment substrate 2 to I go outside. For this reason,
There were problems in that it took time to align the chip capacitors 1 and that the required transfer rate could not be obtained.

On the other hand, since the chip capacitors 1 arranged on the arrangement substrate 2 are arranged in a matrix on the arrangement substrate 2, in order to take out the chip capacitors 1, the arrangement substrate 2 or the vacuum chuck that sucks the chip capacitors 1 must be 2 axes (X
position control is required (axis, y-axis). Furthermore, since there may be so-called toothless alignment holes 3 in which the chip capacitor l is not inserted, a means for detecting toothless alignment is also required.

Therefore, there is a problem in that the mechanism for taking out the chip capacitors 1 from the alignment substrate 2 is also complicated and expensive.

An object of the present invention is to provide a method for supplying electronic components that can efficiently align large-sized electronic components in a short time and easily supply them to an electronic component processing apparatus.

[Means for Solving the Problems] Therefore, the present invention provides a method for supplying electronic components to an electronic component processing apparatus that aligns the electronic components and performs necessary processing on the electronic components, the method comprising: aligning the groove widths; Prepare an aligned substrate in which long grooves are arranged in parallel, the groove length being approximately equal to the minimum dimension of the main surface having the thickness direction of the electronic component as the normal direction, and the groove length being approximately equal to multiple times the maximum dimension of the main surface. After supplying the electronic components onto the alignment board and vibrating the alignment board to transfer and align the electronic components into the long grooves, the alignment board is placed such that one end of the long groove is lower than the other end. Tilt it so that
The present invention is characterized in that the electronic components sliding down the long grooves of the alignment substrate are sequentially taken out at each one end thereof and supplied to the electronic component processing apparatus.

[Operations and Effects of the Invention] When a part of the electronic component fits into the long groove of the alignment substrate, the entire electronic component fits into the long groove because there is nothing to prevent its movement or rotation in the longitudinal direction of the long groove. It can be rotated freely up to. Therefore, once a part of the electronic component fits into the long groove, the entire electronic component easily fits into the long groove. Furthermore, when the alignment substrate is tilted, the electronic components slide down the long grooves and reach one end of each of the long grooves. The electronic components are sequentially taken out and supplied to an electronic component processing device.

Thereby, electronic components of any size can be efficiently aligned and supplied to the electronic component processing apparatus in a short time, and the operating rate of the electronic component supply apparatus can also be increased.

Furthermore, since the electronic components are taken out from each end of the long groove, when taking out the electronic parts, the means for taking out the electronic parts such as an alignment board or a vacuum chuck is controlled by l-axis control to move one-dimensionally along each end of the long groove. That's fine. Furthermore, since all the electronic components in each alignment groove sequentially slide down to one end thereof, there is no need for means for detecting the presence or absence of electronic components when taking them out. Therefore, the mechanism for taking out electronic components is also very simple.

[Example] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

An embodiment of the method for supplying the chip capacitor l shown in FIG. 6 will be described below.

For supplying the chip capacitors 1, an alignment substrate 11 as shown in FIG. 1 is used. This alignment substrate 11 is also made of metal or resin, similar to the alignment substrate 2 explained with reference to FIG. The alignment substrate it has n long 1121.12-2. . . , 12-n are arranged in parallel so that their longitudinal center positions are, for example, at equal pitches P (see FIG. 5). The above length i? 1t1
2-i (i=1.2°..., n) groove width W-i (i=
I, 2, = -, n) is set to be approximately equal to the minimum dimension of the main surface having the thickness direction of the chip capacitors l to be aligned as the normal direction, that is, the width direction dimension W of the chip capacitors l shown in FIG. . In addition, the long groove 12-i
The groove length is the maximum dimension of the main surface of the chip capacitors 1 to be aligned, that is, the chip capacitor l in FIG.
Set approximately equal to multiple times the longitudinal dimension of.

- Prepare the alignment substrate 11 and arrange it horizontally, and place chip capacitors l having widths W-1, W-2, . . . W-n on it. Then, the alignment substrate 2 is vibrated in the horizontal direction, and the chip capacitors l are placed in the long grooves 12-1, 12-2, . ...Transfer to 12n. At this time, as shown in FIG. 2 for the first long groove 12-i of the alignment substrate 11, the chip capacitor l, which is partially fitted into the long groove 12-i, is attached to the remaining three sides excluding the - side. There is nothing to match. For this reason, the above chip capacitor 1
is arrow A I or arrow A3. It can be rotated freely in the direction shown, and the lengthwise dimension is the widthwise dimension W.
A chip capacitor l of a size close to that of , or a large size, can easily fit into the long groove 12-i and be aligned.

As described above, the long grooves 12-1.12 of the alignment substrate 11 are
-2. As shown in FIG. 3, the chip capacitors l fitted into the 12-n and aligned are arranged with a holding plate 21 on the alignment board 1.1 to prevent the chip capacitors l from protruding. The long grooves 12-1, 12-2.・,1
2-n to each end. By tilting the alignment substrate 11, the chip capacitors l form alignment grooves 12-1.
12-2...12-n, the alignment grooves 12-1, 12-2, . -, l 2-n From each other end, air is blown as shown by arrow A to forcibly move the chip capacitor l. Furthermore, by vibrating the alignment substrate and forcibly suppressing interference with the surroundings, it is possible to ensure that the alignment substrate slides down. Then, the chip capacitor l whose alignment grooves have been moved to one end of each of the lines 11-1, 12-2, . be done.

At this time, as shown in FIG.
2. . . , the center of each chip capacitor l located at one end side of each of n long grooves 12-1, 12-2.
−． If 12-n is set so that its center positions in the longitudinal direction are at equal pitches P, the air chuck of the taping device can be one-dimensionally moved along the above line relative to the alignment substrate 1l. All you need to do is control the position using pitch P.
Control of the air chuck or the alignment substrate 11 becomes very easy. Moreover, the chip capacitor I has a long groove 121.
12-2. ..., each time a chip capacitor 1 is taken out from one end of the chip capacitor 12-n, another chip capacitor 1 slides down into that position, so when taking out a chip capacitor l, a means for detecting the presence or absence of the chip capacitor l is required. do not.

Further, in the above embodiment, the long grooves 12-1, 122.12-
Various types of chip capacitors l can be supplied depending on the widths W-1, W-2, -, W-n of n.

Note that although the case where chip-shaped electronic components of different sizes are supplied has been described above, it goes without saying that in the case of chip-shaped electronic components of a constant size, it is sufficient to provide the same long grooves.

In addition to the chip capacitor 1, the present invention can also be applied to square or round chip components such as chip resistors and chip inductors, and leadless electronic components having a disc shape. In this case, the minimum dimension and maximum dimension of the main surface of the electronic component are equal, and the minimum dimension of the electronic component is defined by the diameter of the main surface.

[Brief explanation of drawings]

FIG. 1 is a perspective view of an alignment substrate used in the electronic component supply method according to the present invention, FIG. 2 is an explanatory diagram of the alignment of chip capacitors using the alignment substrate of FIG. 1, and FIG. A perspective view showing the state in which the presser plate is placed on the alignment board shown in Fig. 1 and tilted, Fig. 4 is a sectional view taken along the line IV-IV in Fig. 3, and Fig. 5 shows the arrangement shown in Fig. 1. 6 is a perspective view showing an example of a chip capacitor, FIG. 7 is a perspective view of an alignment board used in a conventional electronic component supply method, and FIG. 8 is a partial plan view including each end of the long groove of the substrate. FIG. 8 is an explanatory diagram of alignment of chip capacitors using the alignment substrate of FIG. 7; l... Chip capacitor, 11... Alignment board, 12
-1.12-2. −． 12-n-=long groove, 21... presser plate.

Claims (1)

[Claims] (1) A method for supplying electronic components to an electronic component processing apparatus that aligns electronic components and performs necessary processing on the electronic components, wherein the groove width has the thickness direction of the electronic components to be aligned as the normal direction. Prepare an aligned substrate in which long grooves that are approximately equal to the minimum dimension of the main surface and whose groove lengths are approximately equal to multiple times the maximum dimension of the main surface are arranged in parallel, and electronic components are supplied onto this aligned substrate. After vibrating the electronic components and aligning them in the long grooves, the alignment substrate is tilted so that one end of each of the long grooves is lower than the other end;
A method for supplying electronic components, characterized in that electronic components sliding down in the long grooves of the alignment substrate are sequentially taken out at each of the ends thereof and supplied to the electronic component processing apparatus.