JP2654410B2 - Substrate manufacturing equipment - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION [Industrial Application Field] The present invention relates to a substrate manufacturing apparatus, and particularly to a method for transporting a substrate, positioning the substrate at a predetermined position for each process, and performing a process in the process. The present invention relates to a substrate manufacturing apparatus for performing printing on a substrate and mounting a chip.

[Conventional technology]

The substrate is transported and positioned at a predetermined position for each process,
A substrate manufacturing apparatus that prints on a substrate and mounts a chip by performing the processing in the process has been conventionally used.

The use of this type of substrate manufacturing apparatus makes it possible to manufacture substrates extremely efficiently, especially when mass-producing high-quality planned products.

However, in the manufacture of substrates, mass production of standard products is not always required, and relatively small production of various types of substrates is sometimes performed.

FIG. 23 is an explanatory diagram showing an outline of a line of this type of substrate manufacturing apparatus, where 101 is a supply rack, 102 is a substrate supply apparatus, and 103 is a supply line.
Is a loading device, 104 is a printing machine, 105 is an adhesive coating machine,
106 is chip mounter, 107 is QFP mounter, 108 is SO
P mounter (1), 109 is an SOP mounter (2), 110 is a reflow furnace, 111 is a storage rack, 112 is a mask shelf, and 113 is a table shelf. The arrow in the figure indicates the substrate transfer direction.

Next, the conventional substrate manufacturing apparatus will be described for each process of the line.

FIG. 13 is a perspective view for explaining replacement of a printing table, and this printing table is used for applying cream solder to a substrate. Each printing table is prepared according to the board standard, and when the board standard is changed,
The printing table 1 corresponding to the board of the standard is fixed on the upper surface 2a of the fixing section 2 of the apparatus.

A reference block 3 is fixed to the upper surface 2a so as to surround a position where the print table 1 is provided in advance. The print table 1 placed in the area surrounded by these reference blocks 3 can be horizontally adjusted on the upper surface 2a.

The substrate transported by the transport unit of the apparatus stops on the print table 1 so as to be placed on the print table 1. The substrate (not shown) is provided with a reference hole, and the printing table 1 is formed with a positioning hole 5 which is aligned with the reference hole.

Therefore, the printing table 1 is placed on the upper surface so that the positioning holes 5 coincide with the reference holes of the substrate transferred by the transfer unit.
Adjust the position on 2a and fix it to the moving table 2 with bolts 6. In this way, when the positioning is adjusted first, since the reference holes of the board 1 of the standard are provided in the same apparatus, the board is transported and mounted on the printing table 1 in the same manner after the second time. .

FIG. 14 is an explanatory view of a printing press, and FIG. 15 is an explanatory view of a printing mask attached to the printing press. A print mask 7 as shown in FIG. 15 is prepared for various substrates,
When changing the type of substrate, the print mask 7 is replaced. The print mask 7 is positioned and mounted by a positioning cylinder 8. This positioning is performed by matching with the land of the printed circuit board. Reference numeral 10 denotes a moving table which moves up and down with respect to the print mask 7, on which the substrate 11 is positioned as described above.

FIG. 16 is a perspective view for explaining a change in the width of the transport rail corresponding to the type of the substrate, and an adjustment guide body 13 is fixed to the apparatus main body 12. The adjustment guide body 13 includes one of two transport rails in a direction perpendicular to the
15a is fixed via a fixed support plate 16 as a fixed support member. A movable support plate 17 as a movable support member is attached to the other transport rail 15b.
Is opposed to the fixed support plate 16, is guided by the guide rail 14 provided on the adjustment guide plate 13 so as to be able to approach and separate from the fixed support plate 16, and can be fixed to a desired position of the guide rail 14 with the thumb screw 15. ing.

When the type of the substrate 11 is changed,
The support 11 is supported between the transfer rails 15a and 15b, the transfer rail 15b is moved so as to be at an optimum width position, and the thumb screw 15 is fixed at that position to perform positioning.

FIG. 17 is a perspective view of a loading device for taking out a substrate transferred on the transfer rail from the transfer rail and mounting the substrate on a processing device in a predetermined process.
A cylinder 21 is provided so as to be movable up and down by a cylinder 114. A guide groove 21a is provided in the adjustment plate 21, and positioning screws 22a and 22b are movably fitted in the guide groove 21a.

A positioning pin 23a is fixed to an end of the positioning pin lever 23, and a guide groove is formed in a longitudinal direction of the positioning pin lever 23.
23b are formed. The positioning pin lever 23 is connected to the adjustment plate 21 at the guide groove 23b via the positioning screw 22a. A guide groove 25b is formed in the longitudinal direction of the suction pallet lever 25, and the suction pallet 25a is movably inserted into the guide groove 25b. twenty five
Is the guide groove 25b via the positioning screw 22b,
Connected to 21.

Then, the positioning pins 23a are inserted into the reference holes 26 of the board 11 that have been sent, and the suction pads 25a are adjusted in accordance with the positions where the holes for mounting the chips of the board 11 are not formed, and the suction pads 25a are adjusted. 25a is fixed to the guide groove 25b, and the positioning screws 22a and 22b are tightened to perform positioning. Therefore, loading can be performed on the substrates 11 of the same type in the positioning state.

FIGS. 18 (a) and 18 (b) are views for explaining the positioning of the transferred substrate and the positioning of the substrate to be sent to the next step, and the shaft is shifted along one side edge of the frame 27 which becomes the transfer rail.
28 are juxtaposed. This shaft 28 has a frame
A reference pin body 31 fixedly provided with a straight first pin 30 located inside 27 is fixed.

Further, a positioning pin body 33 having a straight second pin 32 positioned in the frame 27 at the tip thereof is fixed to the shaft 28.
Is slidably mounted at a desired position by a bolt 34 so as to be fixed.

On the other hand, reference holes are provided at the four corners of the substrate (not shown), and two of the holes are fitted with the first pin 30 and the second pin 32. Therefore, when changing the standard of the board 11, the positioning pin body 33 is moved and the positioning pin body 33 is fixed by the bolt 34 at a position where the reference hole of the board 11 and the second pin 32 are fitted. I do.
In this way, the first pin 30 and the second pin 32 perform positioning on the board of the standard.

FIG. 19 is a perspective view for explaining the positioning of the SOP mounter. A reference pin 31A having a first pin 30 fixed in the frame 35 at the tip is fixed to a frame 35 serving as a transport rail. is there.

A positioning pin body 33A having a guide groove 36 formed in the longitudinal direction is movably mounted on the frame 35, and the guide groove 3
The positioning pin 3 is secured by bolts 37
3A can be fixed to the frame 35 at a desired position.
A second pin 32 located in the frame 35 is fixedly provided at the tip of the positioning pin 33A.

Then, when changing the type of the base, the positioning pin 33A is moved and the positioning pin 33A is fixed by the bolt 37 at a position where the reference hole of the base and the second pin 32 are fitted.

FIG. 20 is a perspective view showing the mounting of chips (mounting parts) on a board, in which a support base 41 is fitted to transport rails 40a and 40b. The support base 41 has a large number of mounting holes 42 formed in a matrix, and support pins 43 that can be mounted in the mounting holes are prepared.

When mounting the chip on a substrate (not shown), the support pins 43 are mounted in the mounting holes 42 corresponding to the positions where the chips are not mounted on the substrate, and the substrate is stably held by the support pins 43. Implement the chip.

In this case, when mounting on both sides, the mounting position of the chip differs depending on each side.
Change the mounting position of 43.

FIG. 21 is a perspective view for explaining attachment of a stick containing mounted components to a component feeder.
45 has a fixed receiving portion 46 and a movable receiving portion 47. The movable receiving portion 47 adjusts the position of the movable receiving portion 47 by loosening the screw 48, and the movable receiving portion 47 can be fixed to the position by the screw 48.

On the other hand, the status
50 has different lengths depending on each maker, even if it accommodates the same mounted components. Therefore, the position of the movable receiving portion 47 is adjusted according to the length of the stake 50, and the movable receiving portion 47 is fixed to a suitable position with the screw 48.

FIG. 22 is a perspective view showing replacement of a parts cassette containing mounted components, and a board transferred on the transfer table 51.
In contrast to the parts 11, parts cassettes 52a to 52f are interchangeably mounted on the mounter 53.

Each of the parts cassettes 52a to 52f contains a unique mounting part, so that for a board of a certain standard,
The arrangement order of the parts cassettes 52a to 52f is set according to the type of chips (mounting parts) mounted on the board and the mounting order. When the type of the board is changed, the arrangement of the parts cassettes is set accordingly.

As described above, in the conventional substrate manufacturing apparatus, the substrate is conveyed, positioned at a predetermined position in each process, and the process is performed in that process. I have.

[Problems to be solved by the invention]

By the way, in the above-described technique, in the positioning of FIG. 18, the position where the second pin 32 matches the boarding hole of the boarding car is searched by moving the positioning pin bodies 33 and 33A, and the bolt 3
A rather complicated operation of tightening the positioning pins 33 and 33A by tightening the pins 4 and 37 must be performed. Also, when mounting the chip shown in FIG. 20, the support of the board is performed by searching for the non-mounting position of the chip on the board and mounting the support pin 43 in the mounting hole.
The work of mounting the base 42 was extremely complicated especially in the case of double-sided mounting.

The present invention has been made in view of the problems of the related art, and an object of the present invention is to provide a substrate manufacturing apparatus capable of performing an adjustment operation corresponding to a change in the standard of a substrate quickly with a simple operation. .

[Means for solving the problem]

The objective is to transport the substrate by a pair of transport rails,
In a substrate manufacturing apparatus for mounting a chip on the substrate by positioning at a predetermined position for each step and performing the processing in that step, a fixed support member supporting one of the pair of transport rails, Facing the support member,
A moving support member that supports the other of the pair of transport rails, and an adjustment guide body that has the fixed support member fixed and a guide rail that guides the movable support member to the fixed support member so as to be able to approach and separate from the fixed support member; A corner is provided on the guide rail at one corner, and a rectangular width adjustment gauge rotatable around the axis is provided, and the width adjustment gauge is arranged so that one side thereof and the guide rail are at right angles. And the other side of the width adjustment gauge is brought into contact with the end of the moving support member.

[Action]

According to the above means, one side of the width adjustment gauge is set so as to be perpendicular to the guide rail, and the set side of the width alignment gauge is brought into contact with an end side of the moving support plate, thereby forming a pair of conveyances. Since the distance between the rails is uniquely determined, the width of the pair of transport rails can be quickly changed in four ways, and an adjustment operation corresponding to the change in the board standard can be quickly performed by a simple operation.

〔Example〕

 Hereinafter, an embodiment of the present invention will be described with reference to the drawings.

The first is a perspective view for explaining the replacement of the print table in the embodiment. In the embodiment, the positioning hole 5 of the print table 1 is made to coincide with the reference hole of the substrate conveyed to a position close to and facing the print table 1. Position of the print table 1 as described above. Then, at this position, the printing table 1
The reference block 3A is fixed to the upper surface 2a of the moving table 2 at that position.

The distance l between the center of the positioning hole 5 and the side surface of the reference block 3A is set to be constant for each standardized substrate, and a hole is provided on the substrate at a position corresponding to the positioning hole 5. .

Reference block fixed on top surface 2a as described above
The opposite side of the printing table 1 is pressed against the side of 3A by toggle clamps 55a and 55b, and the upper surface 2a is pressed.
The print table 1 is positioned above. If this adjustment is performed in the minimum number of steps, all substrates transported by the transport unit for substrates of the same standard are positioned and mounted on the print table 1.

Thus, according to the embodiment, the print table 1 is
The positioning can be performed on the upper surface 2a of the moving table 2 by a simple and quick operation.

FIG. 2 and FIG. 3 are partial perspective views for explaining the replacement of the print mask in the embodiment.
Guide grooves 56 and 57 in the direction and the Y direction
Blocks 60 and 61 formed with holes are attached, and a positioning hand hole 62 is formed in the center of the block 61.

On the other hand, a positioning cylinder 64 having a positioning bar 63 inserted into the positioning hole 62 is fixed to the apparatus main body.

It is necessary to position the print mask 7 held between the cylinders 8 in FIG. 14 with respect to the substrate 11 on the moving table 2 as described in the conventional example.
The positioning bar 63 is inserted through the positioning hole 62 while moving and adjusting the block bodies 60 and 61 that are movable with respect to
Blocks 60 and 61 are fixed by tightening the print mask by 5,66. In this manner, the printing mask 7 is reliably positioned by the positioning bar 63 with respect to the substrate 11 disposed at a predetermined position on the moving table 2.
High quality printing is performed efficiently.

The positioning operation according to the embodiment is greatly simplified as compared with the conventional printing mask positioning operation described with reference to FIG.

FIG. 4 (a) is a perspective view for explaining a change in the width of the conveying rail of the embodiment, and uses a clamp lever 70 instead of the thumb screw 15 of the conventional example already described with reference to FIG.
The shaft 72 of the 14 rectangular alignment gauges 71 is provided upright.
The four sides of the width alignment gauge 17 have a length corresponding to the interval to be set between the transport rails 15a and 15b according to the size of the substrate to be changed.

In the embodiment, as shown in (A) to (D) of FIG. 4 (b), the width adjusting gauge 17 is rotated around the shaft 72, and the width corresponding to the interval to be set between the transport rails 15a and 15b is set. Fitting gauge 1
7 is set so that one side is perpendicular to the guide rail 14, the lock of the clamp lever 70 is released, and one side of the width alignment gauge 17 is set so that it is perpendicular to the guide rail 14, and the clamp Unlock the lever 7 and
By making the end side of the movable support plate 17 contact the set side of the width alignment gauge 17, the interval between the transport rails 15a and 15b is uniquely determined.By locking the clamp lever 70 in this state, The widths of the transport rails 15a and 15b can be quickly changed to four types (A) to (D) in FIG. 4 (b).

FIG. 5 is a perspective view of the loading device of the embodiment,
An adjusting plate 21A is attached to the end of the arm 20, and a guide groove 73 is formed in the adjusting plate 21A in the Y direction. A U-shaped suction pad lever 75 is connected to the guide groove 73 via a screw 74. At the end of the suction pad lever 75, a suction pad 76 is attached. The adjustment plate 21A has Y
Stoppers 77 and 78 at the ends in the direction are fixed. A reference block 78 for positioning the substrate 11 in the Y direction is fixed to the transport rail, and the X direction of the substrate 11 is fixed by inserting reference pins 80 into the reference holes of the substrate 11. ing.

In the embodiment, the reference pin 80 fixes the Y direction,
The X direction is aligned with the reference block 78, the screws 74 are loosened with respect to the substrate 11 positioned and fixed on the transport rail, and the suction pad lever 75 is moved in the X direction along the guide groove 73,
A suction position where a mounting hole is not vacant is searched, and the suction pad 76 is suctioned at that position to perform loading.

In this way, the loading position can be more easily searched and the suction pad 76 can be suctioned to perform the loading than the conventional loading device described with reference to FIG.

6 and 7 are perspective views for explaining the positioning of the conveyed substrate in the embodiment for sending the substrate to the next step. In FIG. 6, the positioning pin body 33A is different from FIG. The shaft 28 is fitted with a shaft 28 having a built-in bearing so that the shaft 28 is movable and can be stopped at a desired position. The positioning pin body 33A has an inner wall made of oil-less metal and is movably attached to the shaft 28. Further, the second pin 32A
Is a tapered pin, and the inner wall of the reference hole of the substrate and the second pin 32
Positioning can be performed simply by contacting one wall of A. Further, the first pin 30A is also a saver pin.

FIG. 7 differs from FIG. 19 which has already been described, in that a block 83 fixed to the frame 35 with reference pins 84 in accordance with the standard of the substrate.
The positioning pin body 33B is fixed to the block 83. For this reason, block 83 is
By simply fixing the base, the base can be easily positioned with high accuracy.

In this manner, in the embodiment, the positioning of the conveyed substrate for sending it to the next step is performed easily and quickly as compared with the related art.

FIG. 8 is a perspective view showing the mounting of the chip on the board in the embodiment, in which the support base 4 is attached to the transport rails 40a and 40b.
1 is fitted, and a plurality of rectangular-shaped electrostatic sponges 85 can be freely arranged on the support base 41 in accordance with the standard of the substrate.

Therefore, in the embodiment, the number of electrostatic sponges 85 corresponding to the standard of the substrate is provided on the support base 41, and the substrate is mounted on the electrostatic sponge 85 to mount the chip. When mounting the chip, the board is located on the electrostatic sponge 85, so even if the mounting location on each side is different, the board can be mounted in a stable state without changing the arrangement of the support pins as in the past. Done.

The support base 41 is located on the lower surface of the transfer rails 40a and 40b when the board is not transferred, and when the board is transferred onto the support base 41 by the transfer rails 40a and 40b, the support base 41 is raised. And pressed by the electrostatic sponge 85. Also, the substrate is transported along the grooves of the transport rails 40a and 40b, but since the width of the groove is set to be larger than the thickness of the substrate, there was a backlash between the groove and the substrate in the conventional one. In the embodiment, there is no play when pressed by the electrostatic sponge 85.

FIG. 9 and FIG. 10 are perspective views for explaining the attachment of the stick containing the mounted components in the embodiment to the component supply device. As already described with reference to FIG. 21, there is a slight difference in the length of the stake 50 containing the same parts depending on the manufacturer. Then, there is an allowable range for this variation, and in the embodiment, stoppers 87a and 87b are provided before and after the movable receiving portion 47 within the allowable range, and the movable receiving portion 47 is brought into contact with either one of these stoppers. The replacement of the stake 50 can be easily performed.

11 and 12 are perspective views showing the replacement of the parts cassettes in the embodiment. Eight kinds of parts cassettes 52a to 52h are provided for the unit 90 in the order corresponding to the respective standard boards. Prepare the arrangement in advance.
When the standard of the board is changed, a unit having a part cassette of the arrangement corresponding to the board is exchanged, so that the change of the standard can be quickly and without errors.

〔The invention's effect〕

As described above, according to the present invention, one side of the width alignment gauge is set so as to be perpendicular to the guide rail, and the end side of the moving support plate is brought into contact with the set side of the width alignment gauge. As a result, the interval between the pair of transport rails is uniquely determined, so that the width of the pair of transport rails can be quickly changed to four types, and an adjustment operation corresponding to a change in the board standard can be quickly performed with a simple operation. Is possible.

[Brief description of the drawings]

1 to 12 are views for explaining an embodiment of the present invention. FIG. 1 is a perspective view for explaining the replacement of a printing table, and FIGS. 2 and 3 are for explaining the replacement of a printing mask. 4 (a) and 4 (b) are perspective views and explanatory views, respectively, for explaining a change in the width of the transport rail, FIG. 5 is a perspective view of a loading device, and FIGS. 6 and 7 are transport views. FIG. 8 is a perspective view for explaining positioning for sending a substrate to a next process, FIG. 8 is a perspective view showing mounting of a chip on the substrate, and FIG. 9 and FIG. FIGS. 11 and 12 are perspective views showing the replacement of parts cassettes. FIGS. 13 to 23 are views for explaining a conventional board manufacturing apparatus, and FIG. FIG. 14 is a perspective view for explaining table replacement, FIG. 14 is a view for explaining printing mask replacement, and FIG. Illustration of the printing mask, 16
Figure is a perspective view for explaining the change of the width of the transport rail, FIG. 17 is a perspective view of the loading device, FIG. 18 and FIG. 19 are perspective views for explaining the positioning for sending to the next step that has been transported, FIG. 20 is a perspective view showing the mounting of the chip on the board,
FIG. 21 is a perspective view for explaining the attachment of the stake to the component feeder, FIG. 22 is a perspective view showing the replacement of the parts cassette, and FIG. 23 is an explanatory diagram showing the outline of the line. 27 ... frame, 28 ... shaft, 30 ... first pin, 31 ...
… Reference pin body, second pin, 33A …… Positioning pin body, 4
0a, 40b …… Transport rail, 41 …… Support base, 85 ……
Electrostatic sponge.

Claims (1)

(57) [Claims] 1. A substrate manufacturing apparatus for mounting a chip on a substrate by transporting the substrate by a pair of transport rails, positioning the substrate at a predetermined position in each process, and performing processing in the process. A fixed support member that supports one of the pair of transfer rails, a fixed support member that supports the other of the pair of transfer rails, and a fixed support member that supports the other of the pair of transfer rails. A guide rail having a guide rail for guiding the guide rail so as to be able to approach and separate from the fixed support member; and a rectangular width alignment gauge having a shaft erected on the guide rail at one corner and rotatable about this shaft. The width adjustment gauge is disposed so that one side thereof and the guide rail are at a right angle, and the other side of the width adjustment gauge is brought into contact with the end of the moving support member. Substrate manufacturing apparatus characterized in that the.