JP3269702B2 - Lead frame positioning method and transport method in semiconductor device manufacturing - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a lead frame positioning method for transporting a lead frame in a semiconductor device manufacturing process.

In recent years, with the diversification of semiconductor devices such as ICs and LSIs, the types of lead frames used have been diversified. Therefore, in the manufacturing process of the semiconductor device, versatility of a method of transporting various kinds of lead frames while ensuring positional accuracy is required.

[0003]

2. Description of the Related Art Conventionally, in a process of manufacturing a semiconductor device, for example, in a process of imprinting on a package, after a plurality of packagings are performed on a lead frame, the lead frame is transported to a stamping position. Sealing is performed.

FIG. 4 is an explanatory view of a packaged lead frame. In the lead frame 11 in FIG. 4, a plurality of QFP (Quad Flat Package) patterns are formed on a metal conductor in the form of a tape. That is, although not shown in the drawing, after mounting a semiconductor chip on the stage and performing wire bonding, the packages 12 are respectively formed by resin molding as shown in FIG.

[0005] After the lead frame 11 on which a plurality of packages 12 are formed is conveyed to a marking position by a transfer device and stamped, unnecessary portions of the lead frame 11 are cut and removed, and lead terminals are bent. It is something to be done.

Here, FIG. 5 is an explanatory view of the lead frame transport of FIG. FIG. 5A is a schematic side view, and FIG.
(B) is a schematic plan view. FIGS. 5A and 5B show a case where the lead frame 11 is transported by a belt on both sides of the lead frame 11.

That is, one side of the lead frame 11 is driven to be fed by the upper belt 13a and the lower belt 13b.

The upper belt 13a (14a) and the lower belt 13b (14b) are rotationally driven by bearings 15a, 15b rotated by a stepping motor (not shown), and are provided between the upper bearings 16a, 16a and the lower bearings 16b, 16b. The lead frame 11 is transported in the gap.

[0009] By the way, with the diversification of semiconductor devices,
When the width d (FIG. 4) of the lead frame 11 changes, the upper belts 13a, 14a (lower belts 13b, 14b)
This is dealt with by changing the pitch P between them.

[0010]

However, when the lead frames 11 having different widths are conveyed as described above, an exchange unit is required to change the pitch P, and there is no jig for positioning correction. Therefore, the position of the lead frame (11) to be conveyed varies.

Therefore, in order to correspond to a variety of different sizes in the lead frame 11, it is necessary to prepare a dedicated transfer device, which increases the cost. There is a problem that it takes time for adjustment.

SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and has as its object to provide a positioning method for automatically positioning and transporting lead frames of different sizes.

[0013]

The object of the present invention is to provide a method for positioning a lead frame when a lead frame is transported in the manufacture of a semiconductor device, wherein a clamper is moved in the width direction according to the width of the lead frame supplied. This problem is solved by clamping both sides of the lead frame from the upper and lower surfaces by the clamper and holding the lead frame from the width direction at the time of the clamping.

[0014]

As described above, the clamper is moved in the width direction in accordance with the width of the lead frame, and both sides of the lead frame are clamped from the upper and lower surfaces to be held in the width direction.

Thus, even if lead frames of different sizes (widths) are used, it is possible to automatically position and transport the lead frames without the need for unit replacement or the like.

[0016]

FIG. 1 is a block diagram showing an embodiment of the present invention.
FIG. 1 shows an embodiment for positioning a lead frame. The lead frame is shown as having a predetermined number of packages formed thereon as shown in FIG.
The structure of the lead frame is the same as that of FIG. 4, and the same reference numerals are used.

FIGS. 1A to 1C show a lead frame 1.
1 shows a clamper that positions and holds the positioner 1.

In FIG. 1A, the clamper 21
The two first holding bodies 22a and 22b
The engaging screws 24a and 23b are engaged at predetermined intervals with adjusting screws 24 which are threaded in the forward and reverse directions, respectively. The adjusting screw 24 is rotated by a stepping motor (not shown), and the first holders 22a and 22b open and close in the directions opposite to the arrows in accordance with the rotation direction.

The first holders 22a and 22b include:
The second holders 25a and 25b are rotatably attached to the respective holders, and the second holders 25a and 25b are opened and closed by, for example, a solenoid valve (not shown).

On the other hand, as shown in FIGS. 1B and 1C,
The first holding members 22a and 22b have guide plates 2 respectively.
6a, 26b, 27a, 27b
8a so as to be rotatable. Bearings 30 are attached to the tips of the guide plates 26a, 26b, 27a, 27b by pins 29, respectively, and the bearings 30 and the guide plates 26a, 26b, 27a, 27b are linked. In this case, the bearing 30 is opened and closed by the second
, And is rotated together with the guide plates 26a, 26b, 27a, 27b about the shaft 28a as a fulcrum.

In such a clamper 21, the stepping motor rotates first in accordance with the width (width of the lead frame 11) supplied thereto and in accordance with the data (the number of pulses) from the motor driver, and the first holders 22a and 22b are rotated. Is moved in any arrow direction. At this time, the second holders 25a, 25
b is opened by the solenoid valve.

Then, both sides of the lead frame 11 are
The first holders 22a and 22b are opened and closed at positions where the first holders 22a and 22b are hung. Therefore, when the second holding member is closed by the solenoid valve, the bearing 30 is closed.
With the guide plates 26a, 26b, 27
a and 27b rotate around the width 28a as a fulcrum to pinch and fix the lead frame 11 in the width direction, and clamp the lead frame 11 from the upper and lower surfaces by the second holding plates 25a and 25b and the first holding plates 22a and 22b. .

That is, even the lead frames 11 having different width sizes can be automatically held and fixed for positioning, and the adjustment time for unit replacement or the like can be greatly reduced.

Further, since the edge of the lead frame 11 is fixed, the lead frame 11 is corrected, so that the lead frame 11 can be used even if it has a slight shape defect, the yield is improved, the number of production units, and the production cost are reduced. Loss can be reduced.

Next, FIG. 2 shows a configuration diagram of an application example of the present invention. FIG. 2 shows a processing device 31 for performing a seal in a semiconductor device manufacturing process.

In a processing apparatus 31 shown in FIG. 2, a predetermined number of lead frames 11 each having the above-described package 12 are stored in a stacker 32 serving as a supply unit. Be raised. The lead frame 11 is sucked by the vacuum 35 and fixedly positioned on the above-described clamper 21 installed on the XY table 35 which is a moving table.

The fixed positioning of the lead frame 11 by the clamper 21 is performed as shown in FIG. Also, X
The Y table 35 moves on a rail 36, and conveys the lead frame 11 positioned by the clamper 21 to a marking position. At this time, the package 12 of the lead frame 11 positioned by the imaging unit 37 is recognized by image processing, and the roll brush 38
The dust is removed by a.

When the package 12 is transported to the marking position, the laser marking section 39 performs marking on the upper surface of the package 12 with laser light. At this time, the cleaning is performed while the dust is sucked by the suction duct 40. When the stamping process is completed, the dust is removed by the roll brush 38b, the stamped state is confirmed by the camera 41, and the ionizer 4 is removed.
2 removes ions generated on the package 12.

Then, the lead frame 11 is conveyed to the position of the take-out section 43, and the lead frame 11 taken out by the take-out section 43 is discharged onto a stacker 44 as a discharge section.
It is stored inside.

According to the processing apparatus 31 described above, since the transport is carried out while being positioned and fixed by the clamper 21 shown in FIG. 1, the lead frames 11 having different undulations, shapes and sizes are provided.
However, the sealing process can be performed reliably and quickly.

Next, FIG. 3 is an explanatory diagram of another application example of FIG. FIG. 3A shows two XY tables 35 a and 35.
The case where b is used is shown. That is, two XY
Tables 35a and 35b are rails 36a and 36, respectively.
b, and a clamp base plate 40 is provided on the XY table 35a (XY table 3).
5b), the clamper 21 is mounted on the XY table 35b on the clamp base plate 40 (the clamper 21 is also mounted on the XY table 35a).

Then, as shown in FIG. 3B, the XY tables 35a and 35b are sequentially moved with respect to the marking position A, and the lead frame 11 to be processed is transported as shown in FIG.

Thus, loss of the index time can be prevented.

In the above embodiment, the lead frame 11
Although the sealing process is performed when transferring the lead frame, the positioning method using the clamper 21 can be applied when the lead frame 11 (regardless of the package formation) is transferred in the semiconductor device manufacturing process. In addition, a transport method using an XY table can be applied.

[0035]

As described above, according to the present invention, the clamper is moved in the width direction in accordance with the width of the lead frame, and both sides of the lead frame are clamped from the upper and lower surfaces, and clamped from the width direction. It is possible to automatically position lead frames of different sizes, thereby improving the yield in manufacturing semiconductor devices and reducing costs.

[Brief description of the drawings]

FIG. 1 is a configuration diagram of an embodiment of the present invention.

FIG. 2 is a configuration diagram of an application example of the present invention.

FIG. 3 is an explanatory diagram of another application example of FIG. 2;

FIG. 4 is an explanatory view of a packaged lead frame.

FIG. 5 is an explanatory diagram of the lead frame conveyance of FIG. 4;

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 11 Lead frame 12 Package 21 Clamper 22a, 22b First holding body 23a, 23b Nut 24 Adjusting screw 25a, 25b Second holding body 26a, 26b, 27a, 27b Guide plate 28 Spring 28a Shaft 29 Pin 30 Bearing 31 Processing device 35, 35a, 35b XY table 39 Laser marking part

Continuation of the front page (56) References JP-A-3-24539 (JP, A) JP-A-57-172731 (JP, A) JP-A-4-56334 (JP, U) (58) Fields investigated (Int .Cl. ⁷ , DB name) H01L 21/50

Claims (4)

(57) [Claims] 1. A lead frame positioning method for transporting a lead frame (11) in the manufacture of a semiconductor device, comprising: moving a clamper in a width direction according to a width of the lead frame (11) supplied; (21) A lead frame positioning method, wherein both sides of the lead frame (11) are clamped from upper and lower surfaces, and the lead frame (11) is clamped in the width direction during the clamping. 2. A lead frame transport method for transporting a lead frame (11) on which a predetermined pattern is formed in manufacturing a semiconductor device to a predetermined position, wherein a step of picking up the lead frame (11) from a supply unit (32). The clamper (21) is moved in the width direction in accordance with the width of the lead frame (11) picked up, and both sides of the lead frame (11) are clamped by the clamper (21) from upper and lower surfaces. A step of clamping the lead frame (11) from the width direction of the lead frame (11) and placing it on a predetermined moving table (35, 35a, 35b) during clamping; and moving the moving table (35, 35a, 35b) to a predetermined processing position. After the transporting step and the predetermined processing of the lead frame (11), the moving tables (35, 35a, 35b) are ejected. Lead frame transport method and transported to part (44), characterized in that it comprises a step of discharging the lead frame (11). 3. The lead frame (11) is provided with a predetermined number of packages (12), and the packages (1) are formed by the moving tables (35, 35a, 35b).
2. The lead frame conveying method according to claim 2, wherein the lead frame is conveyed to a position where a stamping process is performed. 4. A plurality of said moving tables (35a, 35a).
5. The method according to claim 3, wherein b) sequentially transports the different lead frames to the predetermined processing position.