JPH028114A - Supply method for electronic parts - Google Patents

Abstract

PURPOSE:To supply parts in each long groove after making them into a state of being aligned in a way of vibrating a substrate by installing each of these long grooves, set to groove width equal to the minimum size of a principal plane having a thickness direction of the electronic parts as the normal direction and having each groove length plurally doubled over the maximum size of the principal plane, in the aligning substrate in a parallel manner. CONSTITUTION:Each of long grooves 12-1-12-n for chip condensers 1 different in size each is formed in an aligning substrate 11. Groove widths W-1-W-n of these long grooves 12-1-12-n are made almost equal to the minimum size of a principal plane having a thickness direction of each of the chip condensers 1 as the normal direction, and each groove length is set to be plurally doubled over the maximum size of the principal plane of each chip condenser 1 being aligned. Each size of the chip condensers 1 are mounted on this aligning sub strate 11, and this substrate 11 is horizontally vibrated. With this vibration, these chip condensers 1 are distributed by size in each of these long grooves 12-1-12-n and fitted therein, and their alignment is performed in a short time, thus they are efficiently supplied.

Description

[Detailed Description of the Invention] [Industrial Application Field] The present invention is applicable to electronic component processing such as a taping device for processing leadless electronic components or elements of electronic components having a chip shape such as a round shape or a disc shape rather than a square shape. The present invention relates to a method for supplying electronic components to a device.

[Prior Art] Generally, in the manufacturing process of electronic components such as capacitors, resistors, and inductors, and the product packaging process, electronic component elements and electronic components are aligned before being supplied to an electronic component processing device such as a taping device. .

Conventionally, this type of electronic component, for example, a chip capacitor having a chip shape as shown in FIG. A well-known method is to use an alignment substrate 2 as shown in FIG. 5 to align and supply the tape to the taping device. This alignment substrate 2 is made of metal, glass, resin, etc., and has a rectangular alignment hole on one main surface having a size that is approximately equal to the external dimension of the chip capacitor 1 and into which the chip capacitor 1 can be inserted. 3 are formed in a matrix shape. When the chip capacitors 1 are placed on the alignment substrate 2 and the alignment substrate 2 is vibrated in the horizontal direction, the chip capacitors 1 are inserted into the alignment holes 3 of the alignment substrate 2 and aligned. Then, the alignment substrate 2 with the chip capacitors 1 accommodated in each alignment hole 3 is set in a taping device (not shown), and each chip capacitor 1 is sucked by a vacuum chuck, transported to a taping position, and wrapped with tape.

[Problems to be Solved by the Invention] By the way, as described above, the chip capacitors I are supplied to the taping device using the alignment plate 2 in which the alignment holes 3 are formed in a matrix. In other words, when transferring the chip capacitor l, the chip capacitor 1 is placed on the alignment hole 3 of the alignment board 2 so that the length direction and the width direction of the chip capacitor l are the same as the length of the alignment hole 3. If the length and width directions do not match, the chip capacitor cannot be transferred into the alignment hole 3 of the alignment board 2. In particular, as shown in FIG. 1 or 90 for alignment hole 3
When the chip capacitor I is fitted into the alignment hole 3 in a rotated state, its three end surfaces engage with the three inner walls of the alignment hole 3 and it cannot rotate in the direction shown by the arrow A1 or At, so the chip capacitor I is due to the vibration of the alignment board 2,
It comes out from alignment hole 3. Therefore, there was a problem in that it took time to align the chip capacitors 1.

An object of the present invention is to provide a method for supplying electronic components that can efficiently align large-sized electronic components in a short time and supply them to an electronic component processing apparatus.

[Means for Solving the Problems] Therefore, the present invention provides a method for supplying electronic components to an electronic component processing apparatus that aligns electronic components and performs necessary processing on the electronic components, the method comprising: Prepare an alignment substrate in which long grooves are arranged in parallel, with the thickness direction of the electronic component to be processed as the normal direction, which is approximately equal to the minimum dimension of the contributing main surface, and the groove length is approximately equal to multiple times the maximum dimension of the above-mentioned main surface. The present invention is characterized in that electronic components are supplied onto an alignment substrate, and the alignment substrate is vibrated to feed and align the electronic components into the long grooves.

[Operations and Effects of the Invention] When a part of the electronic component fits into the long groove of the alignment substrate, since there is nothing to prevent movement or rotation of the electronic component in the longitudinal direction of the long groove, the entire electronic component fits into the long groove. It can be rotated freely up to. Therefore, once a part of the electronic component fits into the long groove, the entire electronic component easily fits into the long groove. Thereby, electronic components of any size can be efficiently arranged in a short time and supplied to the electronic component processing apparatus, and the operating rate of the electronic component supply apparatus can be increased.

[Implementation month] Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.

An example of a method for supplying the chip capacitor 1 shown in FIG. 4 will be described below.

For supplying the chip capacitors (2), an alignment substrate 11 as shown in FIG. 1 is used. This alignment substrate 11 is also made of metal, glass, resin, or the like, like the alignment substrate 2 explained with reference to FIG.

The alignment substrate II has n long grooves 12 each having a concave cross section.
-1.12-2. . . , +2-n are arranged in parallel such that their longitudinal center positions are, for example, at equal pitches P (see FIG. 3).

Groove width W of the long groove 12-1 (i = 1, 2, -, n)
-i (i=1, 2..., n) is approximately equal to the minimum dimension of the main surface whose normal direction is the thickness direction of the chip capacitors 1 to be aligned, that is, the width direction dimension W in FIG. Set. Further, the groove length of the long groove 12-1 is set to be approximately equal to multiple times the maximum dimension of the principal surface of the chip capacitors 1 to be aligned, that is, the longitudinal dimension in FIG. 4.

The alignment substrate 11 is prepared and arranged horizontally, and on it are deep capacitors with widths of W-1, W-2, . . . , W-n! Place. Then, the alignment substrate 11 is vibrated in the horizontal direction, and the chip capacitors l are placed in the long grooves of the alignment substrate 11 +2-1.12-2. ..., transfer to 12-n. At this time, as shown in FIG. 2, the aligned substrate 1! The first long groove 1 of
As shown in FIG. 2-1, the chip capacitor 1, which is partially fitted into the DC groove +2-i, has nothing on the remaining three sides except for the negative side. For this reason, the above chip capacitor l is indicated by the arrow A, and the arrow Al! It is possible to freely rotate in the direction shown by , and even a large-sized chip capacitor l whose longitudinal dimension is close to the width dimension W can easily fit into the long groove 12-1 and be aligned.

As described above, the long grooves 12-1.12 of the alignment substrate [1]
-2. The chip capacitors l fitted into the long grooves 12-1.
The tape slides down to one end of the tape, and is sucked by an air chuck of, for example, a taping device (not shown) at this one end, and is transported to a required position.

At this time, as shown in Fig. 3, the long groove 12-1°12-
2. . . , 12-n, the center of each chip capacitor 1 located at one end side of the capacitors 1 coincides with the line indicated by the two-dot chain line, and one length M12-1.12-2.
If =12-n is set such that each center position in the longitudinal direction is at an equal pitch P, the air chuck of the taping device can one-dimensionally move along the line closing relative to the alignment substrate 11. It is only necessary to control the position using the pitch P, and as with an air chuck, the alignment substrate 11 can be controlled very easily.

In addition, in the above embodiment, the long groove 12-1.12-2.6+
According to the widths W-1, W-2, -, W-n of +, l 2-n, various types of chip capacitors l can be supplied.

Note that, although the case where chip-shaped electronic components of different sizes are supplied has been described above, it goes without saying that in the case of chip-shaped electronic components of a constant size, it is not necessary to provide the same length 1fit.

In addition to the chip capacitor 1, the present invention can be applied to square or round chip parts such as chip resistors and chip inductors, and leadless electronic parts having a disc shape. In this case, the minimum dimension and maximum dimension of the main surface of the electronic component are equal, and the minimum dimension of the electronic component is defined by the diameter of the main surface.

[Brief explanation of the drawing]

FIG. 1 is a perspective view of an alignment substrate used in the electronic component supply method according to the present invention, FIG. 2 is an explanatory diagram of the alignment of chip capacitors using the alignment substrate of FIG. 1, and FIG. FIG. 4 is a perspective view showing a row of chip capacitors; FIG. 5 is a perspective view of the alignment substrate used in the conventional electronic component supply method. , FIG. 6 is an explanatory diagram of the alignment of chip capacitors using the alignment substrate of FIG. 5. I... Chip capacitor, 11... Aligned substrate, 12
-1.12-2. ..., 12-n...long groove. Patent Applicant Murata Manufacturing Co., Ltd. Agent Patent Attorney Ao-Haku Hogai 1 person Figure 3 Figure 5 Figure 6

Claims (1)

[Claims] (1) A method for supplying electronic components to an electronic component processing apparatus that aligns electronic components and performs necessary processing on the electronic components, wherein the groove width has the thickness direction of the electronic components to be aligned as the normal direction. Prepare an aligned substrate in which long grooves that are approximately equal to the minimum dimension of the main surface and whose groove lengths are approximately equal to multiple times the maximum dimension of the main surface are arranged in parallel, and electronic components are supplied onto this aligned substrate. A method for supplying electronic components, characterized in that the electronic components are placed into the long grooves and aligned by vibrating the electronic components.