JPH05226792A - Printed circuit board - Google Patents

Printed circuit board

Info

Publication number
JPH05226792A
JPH05226792A JP2667592A JP2667592A JPH05226792A JP H05226792 A JPH05226792 A JP H05226792A JP 2667592 A JP2667592 A JP 2667592A JP 2667592 A JP2667592 A JP 2667592A JP H05226792 A JPH05226792 A JP H05226792A
Authority
JP
Japan
Prior art keywords
circuit board
printed circuit
board
warpage
slits
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2667592A
Other languages
Japanese (ja)
Inventor
Yoshihiko Sakai
義彦 坂井
Original Assignee
Matsushita Electric Ind Co Ltd
松下電器産業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Matsushita Electric Ind Co Ltd, 松下電器産業株式会社 filed Critical Matsushita Electric Ind Co Ltd
Priority to JP2667592A priority Critical patent/JPH05226792A/en
Publication of JPH05226792A publication Critical patent/JPH05226792A/en
Application status is Granted legal-status Critical

Links

Classifications

    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00Printed circuits
    • H05K1/02Details
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/0097Processing two or more printed circuits simultaneously, e.g. made from a common substrate, or temporarily stacked circuit boards
    • HELECTRICITY
    • H05ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05KPRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00Apparatus or processes for manufacturing printed circuits
    • H05K3/30Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering

Abstract

PURPOSE:To suppress the degree of warpage of a printed circuit board after a reflow to a reduced level by forming a row of slits, in which a plurality of fine slits arranged substantially orthogonal to a lengthwise direction of the board are drilled, at areas of the board to be disregarded which extend in the lengthwise direction of the board. CONSTITUTION:Perforations 2 are defined on the surface of a printed circuit board 1. A circuit board section 3 acting as an area where electronic components are mounted and areas 4 of the circuit board to be disregarded are adjacently formed with the perforations 2 between them. Fine slits 5 are formed at substantially right angles to a direction in which the circuit board 1 is transferred between various types of assembly units containing a reflow process during a process for mounting components on the board 1. A plurality of slits are also formed along a transfer direction 6. Warpage of the board 1 exists between the slits 5, but it appears outside as a considerably small amount of warp. The total amount of warpage arising over the entirety length of the board is suppressed to a value which satisfies the standard for printed circuit boards.

Description

【発明の詳細な説明】 DETAILED DESCRIPTION OF THE INVENTION

【0001】 [0001]

【産業上の利用分野】本発明は、いわゆるリフロー装置を用いて電子部品を、表面実装するプリント回路基板に関するものである。 The present invention relates to an electronic component using the so-called reflow apparatus, and a printed circuit board for surface mounting.

【0002】 [0002]

【従来の技術】小型化、ポータブル化の要求が強くなってきた最近の民生用機器において、表面実装タイプと呼ばれる電子部品を、プリント回路基板に多用することにより、使用するプリント回路基板の面積を小さくする試みが最近行なわれている。 BACKGROUND ART miniaturization in recent consumer equipment of portable and request becoming stronger, the electronic component called a surface mount type, by intensive on a printed circuit board, the area of ​​the printed circuit board to be used attempts to reduce have been made recently.

【0003】このようなプリント回路基板への部品実装においてはリフローと呼ばれる、電子部品をプリント回路基板にはんだ付けする方法が主流となっているが、特にリフロー時の熱は電子部品実装装置に適用される許容規格値を超える反りをプリント回路基板に、生ずることがである。 [0003] In such mounting of components to a printed circuit board called reflow, a method of soldering the electronic components on the printed circuit board has become mainstream, particularly applied heat to an electronic component mounting apparatus of the reflow the printed circuit board warpage exceeding the allowable standard value is may result. 以下、従来のプリント回路基板について図4,図5を参照しながら説明する。 Hereinafter, FIG. 4 for a conventional printed circuit board will be described with reference to FIG.

【0004】図4に示すように、従来のプリント回路基板9は、その全体をミシン目10により電子部品を実装する領域の回路基板部分11と、捨て基板12の部分とに分けられる。 [0004] As shown in FIG. 4, a conventional printed circuit board 9, the circuit board portion 11 of the region for mounting electronic components by perforations 10 in its entirety, is divided into a portion of the discarded substrate 12. 部品実装工程でのプリント回路基板9は、電子部品実装装置で電子部品を実装する際に所定の位置にセットされるが、そのセット時、プリント回路基板9の反りを可能なかぎり小さくするように、プリント回路基板の長手方向の辺端を部品実装装置にクランプしている。 Printed circuit board 9 in the component mounting process, as it is set at a predetermined position when mounting the electronic component in the electronic component mounting apparatus, when the set is reduced as much as possible warping of the printed circuit board 9 , which clamp the longitudinal sides ends of the printed circuit board to the component mounting apparatus.
そのため部品実装工程中のプリント回路基板9はその長手方向が搬送方向13になる。 Therefore the printed circuit board 9 in the component mounting process is the longitudinal direction is the conveying direction 13.

【0005】プリント回路基板9をその長手方向である搬送方向13へ、リフロー装置に通過させると、反りに対する処理が適切ではないプリント回路基板9では、図5 [0005] The printed circuit board 9 in the conveying direction 13 is the longitudinal direction, when passing a reflow device, the printed circuit board 9 process for warpage is not appropriate, 5
に示すようにリフロー中の熱、プリント回路基板自身に有す癖等のために、反りのないプリント回路基板9が、 Heat in the reflow as shown in, for habit such Yusuke the printed circuit board itself, the printed circuit board 9 without warping,
プリント回路基板14のように反り量H 1を有するようになる。 It will have a warpage amount H 1 as a printed circuit board 14.

【0006】 [0006]

【発明が解決しようとする課題】上記のようなプリント回路基板に生ずる反り量H 1が、電子部品実装工程で使用される各種の電子部品実装装置に定められた、プリント回路基板の反り量規格を超えると、そのプリント回路基板には電子部品実装装置による電子部品の実装は不可能になる。 Warp amount H 1 generated in the printed circuit board as described above INVENTION SUMMARY is], defined in various electronic component mounting apparatus to be used in the electronic component mounting process, the printed circuit board warpage standard beyond, mounting of the electronic component becomes impossible due to the electronic component mounting apparatus to the printed circuit board.

【0007】本発明は、上記の問題点を簡易な構成によって解決したプリント回路基板の提供を目的とする。 [0007] The present invention has an object to provide a printed circuit board which can solve the above problems by a simple configuration.

【0008】 [0008]

【課題を解決するための手段】本発明は、リフローにより電子部品を表面実装するプリント回路基板において、 Means for Solving the Problems The present invention provides a printed circuit board for surface mounting of electronic components by reflow,
そのプリント回路基板の長手方向に有する捨て基板部分に、前記長手方向にほぼ直交する微細なスリットを多数穿設したスリット列を形成したことを特徴とする。 A substrate portion discarded with the longitudinal direction of the printed circuit board, characterized in that the formation of the slit matrix bored a large number of fine slits substantially perpendicular to the longitudinal direction.

【0009】 [0009]

【作用】本発明によれば、リフロー装置中の熱の影響を受けて、プリント回路基板の移動方向に連続した反りが発生しようとしても、捨て基板部分に配列された微細なスリットのために、上記、連続しようとする反りの力が断絶され、したがって反りの総合量が極めて低レベルに抑制されて、プリント回路基板の反り規格を満足させることになる。 According to the present invention, under the influence of heat during the reflow device, even if an attempt is continuous warping occurred in the moving direction of the printed circuit board, for arrayed fine slits to discard the substrate portion, above, warping of the force is disconnected to be continuous, thus comprehensively amount of warpage is suppressed extremely low level, so that to satisfy the printed circuit board warpage standards.

【0010】 [0010]

【実施例】図1は本発明の一実施例を示す斜視図で、1 DETAILED DESCRIPTION FIG. 1 is a perspective view showing an embodiment of the present invention, 1
はプリント回路基板であり、その面上にはミシン目2を有し、このミシン目2を境界として電子部品の実装領域の回路基板部分3と、捨て基板部分4とが形成されている。 Is a printed circuit board, its has perforations 2 on the surface, a circuit board portion 3 of the mounting region of the electronic components of the perforation 2 as a boundary, and the discarded substrate portion 4 is formed. 5は微細なスリットで、これは前記プリント回路基板1への部品実装工程時の、リフロー工程等を含む各種の実装装置間にプリント回路基板1を搬送させる搬送方向6に、ほぼ垂直に形成されて、多数のスリットが前記搬送方向6の方向に配列されている。 5 is a fine slit, which is the during the component mounting process on a printed circuit board 1, the transport direction 6 for transporting the printed circuit board 1 between the various mounting devices including reflow process or the like, is substantially vertically formed Te, a number of slits are arranged in the direction of the transport direction 6.

【0011】以上のように形成する本発明のプリント回路基板1は以下説明するように反りを低減させることができる。 [0011] The printed circuit board 1 of the present invention be formed as described above can reduce the warpage as described below.

【0012】なお、回路基板部分3に各種の表面実装タイプの電子部品を自動実装する場合、プリント回路基板は電子部品実装機の所定の位置にクランプするが、そのクランプ力が可及的にプリント回路基板を撓ませないようにするため、プリント回路基板はその長手方向の端辺がクランプされる。 [0012] In the case of automatic mounting of various surface mount type electronic component on a circuit board portion 3, the printed circuit board is clamped to a predetermined position of the electronic component mounting apparatus, the clamping force as much as possible printed to avoid flexing of the circuit board, the printed circuit board in the longitudinal direction of the end edges are clamped. 一方、電子部品実装機は構造上プリント回路基板をその長手方向に搬送する。 On the other hand, the electronic component mounting apparatus conveys the structure on the printed circuit board in the longitudinal direction. 言換えるとプリント回路基板の長手方向が搬送方向6になる。 Longitudinal direction of the printed circuit board is in the transport direction 6 In other words.

【0013】図2は本発明のプリント回路基板1の反りの低減を説明する図であり、リフローしないプリント回路基板1がリフロー装置を通って熱を受けて、反りを来したプリント回路基板7とを比較した側面図である。 [0013] Figure 2 is a diagram for explaining the reduction of warpage of the printed circuit board 1 of the present invention, by receiving heat printed circuit board 1 does not reflow through a reflow apparatus, the printed circuit board 7 has brought the warp it is a side view comparing. H
0はリフローで装置によって発生した反り量であり、この反り量は、電子部品実装に使用する各種の電子部品実装装置の、プリント回路基板に対する反り規格を満足する量である。 0 is a warpage generated by the device in the reflow, the warpage, the various electronic component mounting apparatus for use in an electronic component mounting is an amount that satisfies the warpage specifications for printed circuit board.

【0014】図3は、スリット5が図2のプリント回路基板7上で、プリント回路基板の反りに対して与えている影響を、スリット5がない場合のプリント回路基板8 [0014] Figure 3, the slit 5 on the printed circuit board 7 of Figure 2, the effect is given to warping of the printed circuit board, the printed circuit board in the absence of a slit 5 8
の仮想的な反りの状態と対比して示した概略図である。 It is a schematic diagram showing in comparison with the state of the virtual warping of.

【0015】上記構成を説明すると、回路基板部分3に電子部品を実装したプリント回路基板をリフロー装置に通すことにより、プリント回路基板は、H 0なる反り量を持つプリント回路基板7となる。 [0015] To explain the above-described configuration, by passing the printed circuit board mounted with electronic components on the circuit board portion 3 in the reflow apparatus, the printed circuit board is a printed circuit board 7 having an H 0 becomes warpage. これを捨て基板部分4上にスリット5を持たない場合のプリント回路基板8 Printed circuit board 8 when no slits 5 on the substrate portion 4 discarded this
の仮想的な反りの状態と、プリント回路基板7とを詳細に比べると、プリント回路基板8の連続的な反りが捨て基板部分4上のスリット5により、その連続性を断絶させられてしまい、プリント回路基板7の反りは、スリット5間で存在するものの、極めて小さい量の反りとしてしか外部に対して現れないことが判る。 And the state of the virtual warping of, compared to the printed circuit board 7 in more detail, by the slit 5 on the substrate portion 4 discarded continuous warping of the printed circuit board 8, will be allowed to break their continuity, warpage of the printed circuit board 7, although present in between the slits 5, it is seen that not appear to the outside only as warping of extremely small amounts. すなわる、本発明のプリント回路基板は、長手方向全体にわたり総合した反りの量が、電子部品実装工程における各種の電子部品実装装置に有するプリント回路基板に対する規格を十分クリアした値に抑えられる効果がある。 Sunawaru, printed circuit board of the present invention, the effect of the amount of total and warpage across the longitudinal direction, is suppressed to a value sufficiently clear standards for printed circuit board having various electronic component mounting apparatus of the electronic component mounting process there is.

【0016】 [0016]

【発明の効果】以上説明したように、本発明のプリント回路基板はプリント回路基板の捨て基板上に、電子部品の実装工程でのプリント回路基板の搬送方向となる長手方向と、ほぼ直交する微細なスリットを多数設けることにより、リフロー後のプリント回路基板の反りの量を極めて低いレベルに止めることが出来る。 As described above, according to the present invention, the printed circuit board is a printed circuit board of the discarded substrate of the present invention, a longitudinal direction that is the conveying direction of the printed circuit board in the mounting process of electronic components, fine substantially perpendicular a slit by providing a large number of can stop the amount of warpage of the printed circuit board after reflow to very low levels.

【図面の簡単な説明】 BRIEF DESCRIPTION OF THE DRAWINGS

【図1】本発明の一実施例のプリント回路基板を示す斜視図である。 1 is a perspective view of a printed circuit board of an embodiment of the present invention.

【図2】図1のプリント回路基板に発生する反りを示す図である。 2 is a diagram showing a warp occurring in the printed circuit board of FIG.

【図3】本発明のプリント回路基板のスリットの影響を示す図である。 Figure 3 shows the effect of a slit of a printed circuit board of the present invention.

【図4】従来のプリント回路基板を示す斜視図である。 4 is a perspective view showing a conventional printed circuit board.

【図5】図4の反りを示す図である。 FIG. 5 is a diagram showing the warp of FIG. 4.

【符号の説明】 DESCRIPTION OF SYMBOLS

1…プリント回路基板、 2…ミシン目、 3…回路基板部分、 4…捨て基板部分、 5…スリット、 6… 1 ... printed circuit board, 2 ... perforations, 3 ... circuit board portion, 4 ... discarded substrate portion 5 ... slit, 6 ...
搬送方向。 Transport direction.

Claims (1)

    【特許請求の範囲】 [The claims]
  1. 【請求項1】 リフローにより電子部品を表面実装するプリント回路基板において、そのプリント回路基板の長手方向に有する捨て基板部分に、前記長手方向にほぼ直交する微細なスリットを多数穿設したスリット列を形成したことを特徴とするプリント回路基板。 1. A printed circuit board for surface mounting of electronic components by reflow, the substrate portion discarded with the longitudinal direction of the printed circuit board, the slit matrix bored many substantially orthogonal fine slit in the longitudinal direction printed circuit board, characterized in that the formed.
JP2667592A 1992-02-13 1992-02-13 Printed circuit board Granted JPH05226792A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP2667592A JPH05226792A (en) 1992-02-13 1992-02-13 Printed circuit board

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP2667592A JPH05226792A (en) 1992-02-13 1992-02-13 Printed circuit board

Publications (1)

Publication Number Publication Date
JPH05226792A true JPH05226792A (en) 1993-09-03

Family

ID=12199975

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2667592A Granted JPH05226792A (en) 1992-02-13 1992-02-13 Printed circuit board

Country Status (1)

Country Link
JP (1) JPH05226792A (en)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222135B1 (en) 1997-10-30 2001-04-24 International Business Machines Corporation Circuit board for preventing solder failures
US7321099B2 (en) 2004-04-09 2008-01-22 Fujitsu Limited Component mounting substrate and structure

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6222135B1 (en) 1997-10-30 2001-04-24 International Business Machines Corporation Circuit board for preventing solder failures
US6684495B2 (en) 1997-10-30 2004-02-03 International Business Machines Corporation Method of making a circuit board not having solder failures
US7321099B2 (en) 2004-04-09 2008-01-22 Fujitsu Limited Component mounting substrate and structure

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