JPH0217697A - 高密度プリント回路板の製造方法 - Google Patents

高密度プリント回路板の製造方法

Info

Publication number
JPH0217697A
JPH0217697A JP16845488A JP16845488A JPH0217697A JP H0217697 A JPH0217697 A JP H0217697A JP 16845488 A JP16845488 A JP 16845488A JP 16845488 A JP16845488 A JP 16845488A JP H0217697 A JPH0217697 A JP H0217697A
Authority
JP
Japan
Prior art keywords
resist
electroless copper
copper plating
printed circuit
circuit board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP16845488A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0561795B2 (https=
Inventor
Shigeru Kubota
繁 久保田
Norimoto Moriwaki
森脇　紀元
Shohei Eto
江藤　昌平
Isao Kobayashi
功 小林
Hiroshi Hishiki
菱木　宏
Yuichi Ikeda
裕一 池田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP16845488A priority Critical patent/JPH0217697A/ja
Publication of JPH0217697A publication Critical patent/JPH0217697A/ja
Publication of JPH0561795B2 publication Critical patent/JPH0561795B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/40—Forming printed elements for providing electric connections to or between printed circuits
    • H05K3/42—Plated through-holes or plated via connections
    • H05K3/425—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern
    • H05K3/428—Plated through-holes or plated via connections characterised by the sequence of steps for plating the through-holes or via connections in relation to the conductive pattern initial plating of through-holes in substrates having a metal pattern

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
  • Chemically Coating (AREA)
JP16845488A 1988-07-05 1988-07-05 高密度プリント回路板の製造方法 Granted JPH0217697A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP16845488A JPH0217697A (ja) 1988-07-05 1988-07-05 高密度プリント回路板の製造方法

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP16845488A JPH0217697A (ja) 1988-07-05 1988-07-05 高密度プリント回路板の製造方法

Publications (2)

Publication Number Publication Date
JPH0217697A true JPH0217697A (ja) 1990-01-22
JPH0561795B2 JPH0561795B2 (https=) 1993-09-07

Family

ID=15868408

Family Applications (1)

Application Number Title Priority Date Filing Date
JP16845488A Granted JPH0217697A (ja) 1988-07-05 1988-07-05 高密度プリント回路板の製造方法

Country Status (1)

Country Link
JP (1) JPH0217697A (https=)

Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936246A (ja) * 1975-12-19 1984-02-28 バイエル・アクチエンゲゼルシヤフト 樹脂組成物
JPS59125726A (ja) * 1983-01-06 1984-07-20 Mitsubishi Rayon Co Ltd 光重合性樹脂組成物
JPS62295487A (ja) * 1986-06-16 1987-12-22 株式会社日立製作所 プリント回路板の製造方法
JPS6392089A (ja) * 1986-10-06 1988-04-22 イビデン株式会社 プリント配線板及びその製造方法
JPS6481299A (en) * 1987-09-22 1989-03-27 Hitachi Ltd Manufacture of surface-mounting printed circuit board

Patent Citations (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5936246A (ja) * 1975-12-19 1984-02-28 バイエル・アクチエンゲゼルシヤフト 樹脂組成物
JPS59125726A (ja) * 1983-01-06 1984-07-20 Mitsubishi Rayon Co Ltd 光重合性樹脂組成物
JPS62295487A (ja) * 1986-06-16 1987-12-22 株式会社日立製作所 プリント回路板の製造方法
JPS6392089A (ja) * 1986-10-06 1988-04-22 イビデン株式会社 プリント配線板及びその製造方法
JPS6481299A (en) * 1987-09-22 1989-03-27 Hitachi Ltd Manufacture of surface-mounting printed circuit board

Also Published As

Publication number Publication date
JPH0561795B2 (https=) 1993-09-07

Similar Documents

Publication Publication Date Title
TWI496521B (zh) Printed wiring board and manufacturing method thereof
EP0428870B1 (en) Photosensitive resin composition for forming conductor patterns and multilayer circuit boards using same
WO2005120142A1 (ja) 多層配線板及びその製造方法
JP2026021499A (ja) プリント配線板の製造方法、プリント配線板、シード層の製造方法、シード層及び半導体パッケージ
EP0947124B1 (en) A method for adding layers to a pwb which yields high levels of copper to dielectric adhesion
EP0735809A2 (en) Photodefinable dielectric composition useful in the manufacture of printed circuits
TW202218492A (zh) 製造線路板之方法及線路板
TW200407057A (en) Method for the manufacture of printed circuit boards with integral plated resistors
US6680440B1 (en) Circuitized structures produced by the methods of electroless plating
CN1500119A (zh) 正向光界定多聚羧酸酚醛和热固化树脂组合物
JPH09331140A (ja) プリント配線板の製造方法
KR100199539B1 (ko) 다층인쇄회로판을제조하는방법_
JPH06260763A (ja) 多層配線基板の製造方法
JPH0217697A (ja) 高密度プリント回路板の製造方法
JP3637613B2 (ja) 多層配線板の製造方法
JP3593351B2 (ja) 多層配線基板の製造方法
JP4759883B2 (ja) 絶縁樹脂組成物及びこれを用いた多層配線板の製造方法
JPH0217698A (ja) 高密度プリント回路板の製造方法
KR102955017B1 (ko) 절연층 제조방법, 절연층, 다층인쇄회로기판 제조 방법 및 다층인쇄회로기판
JP3773567B2 (ja) プリント配線板の製造方法
JPH03278591A (ja) 高密度プリント回路板の製造方法
JP4978820B2 (ja) 高密度プリント配線板の製造方法。
KR20230022669A (ko) 절연층 제조방법, 절연층, 다층인쇄회로기판 제조 방법 및 다층인쇄회로기판
JPH02251197A (ja) 高密度プリント回路板の製造方法
JPH0766560A (ja) ブラインドホールを有する多層プリント配線板の製造方法

Legal Events

Date Code Title Description
FPAY Renewal fee payment (event date is renewal date of database)

Free format text: PAYMENT UNTIL: 20080907

Year of fee payment: 15

EXPY Cancellation because of completion of term