JPH02174293A - Method of printing symbol mark - Google Patents
Method of printing symbol markInfo
- Publication number
- JPH02174293A JPH02174293A JP33016588A JP33016588A JPH02174293A JP H02174293 A JPH02174293 A JP H02174293A JP 33016588 A JP33016588 A JP 33016588A JP 33016588 A JP33016588 A JP 33016588A JP H02174293 A JPH02174293 A JP H02174293A
- Authority
- JP
- Japan
- Prior art keywords
- solder resist
- solder
- symbol mark
- printing
- symbol
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000007639 printing Methods 0.000 title claims abstract description 12
- 238000000034 method Methods 0.000 title claims description 8
- 229910000679 solder Inorganic materials 0.000 claims abstract description 35
- 229920005989 resin Polymers 0.000 claims abstract description 9
- 239000011347 resin Substances 0.000 claims abstract description 9
- YCKRFDGAMUMZLT-UHFFFAOYSA-N Fluorine atom Chemical compound [F] YCKRFDGAMUMZLT-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000011737 fluorine Substances 0.000 claims abstract description 7
- 229910052731 fluorine Inorganic materials 0.000 claims abstract description 7
- 230000015572 biosynthetic process Effects 0.000 claims abstract 2
- 229920001296 polysiloxane Polymers 0.000 claims description 3
- 239000000203 mixture Substances 0.000 abstract description 5
- 239000000758 substrate Substances 0.000 abstract description 5
- 238000000576 coating method Methods 0.000 abstract description 4
- 239000011248 coating agent Substances 0.000 abstract description 3
- 239000005871 repellent Substances 0.000 abstract description 3
- 230000004907 flux Effects 0.000 abstract description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 abstract 1
- VDRSDNINOSAWIV-UHFFFAOYSA-N [F].[Si] Chemical compound [F].[Si] VDRSDNINOSAWIV-UHFFFAOYSA-N 0.000 abstract 1
- 238000009413 insulation Methods 0.000 abstract 1
- 230000010354 integration Effects 0.000 abstract 1
- 229910052710 silicon Inorganic materials 0.000 abstract 1
- 239000010703 silicon Substances 0.000 abstract 1
- 229920005573 silicon-containing polymer Polymers 0.000 description 5
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 5
- -1 alkyl ether titanium oxide silicon oxide diphenyl disulfide Chemical class 0.000 description 4
- 238000009472 formulation Methods 0.000 description 4
- 239000002952 polymeric resin Substances 0.000 description 3
- IOJUPLGTWVMSFF-UHFFFAOYSA-N benzothiazole Chemical compound C1=CC=C2SC=NC2=C1 IOJUPLGTWVMSFF-UHFFFAOYSA-N 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 239000000049 pigment Substances 0.000 description 2
- KCTAWXVAICEBSD-UHFFFAOYSA-N prop-2-enoyloxy prop-2-eneperoxoate Chemical compound C=CC(=O)OOOC(=O)C=C KCTAWXVAICEBSD-UHFFFAOYSA-N 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- 239000004094 surface-active agent Substances 0.000 description 2
- ANRHNWWPFJCPAZ-UHFFFAOYSA-M thionine Chemical compound [Cl-].C1=CC(N)=CC2=[S+]C3=CC(N)=CC=C3N=C21 ANRHNWWPFJCPAZ-UHFFFAOYSA-M 0.000 description 2
- NIXOWILDQLNWCW-UHFFFAOYSA-M Acrylate Chemical compound [O-]C(=O)C=C NIXOWILDQLNWCW-UHFFFAOYSA-M 0.000 description 1
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 239000002202 Polyethylene glycol Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011889 copper foil Substances 0.000 description 1
- FVCOIAYSJZGECG-UHFFFAOYSA-N diethylhydroxylamine Chemical compound CCN(O)CC FVCOIAYSJZGECG-UHFFFAOYSA-N 0.000 description 1
- 238000007598 dipping method Methods 0.000 description 1
- 239000000463 material Substances 0.000 description 1
- 229920001223 polyethylene glycol Polymers 0.000 description 1
- 229920002635 polyurethane Polymers 0.000 description 1
- 239000004814 polyurethane Substances 0.000 description 1
- 230000002940 repellent Effects 0.000 description 1
- 238000007650 screen-printing Methods 0.000 description 1
- 229920002050 silicone resin Polymers 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/02—Details
- H05K1/0266—Marks, test patterns or identification means
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
- H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
- H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
- H05K3/3452—Solder masks
Landscapes
- Structure Of Printed Boards (AREA)
- Non-Metallic Protective Coatings For Printed Circuits (AREA)
Abstract
Description
【発明の詳細な説明】
皮業上夏肌朋分賢
本発明はプリント配線板の製造方法に関し、特にプリン
ト配線板上へのシンボルマークの印刷方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a printed wiring board, and more particularly to a method for printing a symbol mark on a printed wiring board.
従来曵肢酉
一般にプリント配線板は絶縁基板に所要の回路パターン
を導電体によって形成し、この回路パターンに対して所
要の電子部品を組込むことにより構成される。Conventionally, printed wiring boards are generally constructed by forming a required circuit pattern using a conductor on an insulating substrate, and incorporating required electronic components into this circuit pattern.
プリント配線板に対する電子部品の組込みは。Incorporating electronic components into printed wiring boards.
電子部品を実装した後に回路パターンを熔融半田槽に浸
漬して電子部品のリードと回路パターシを電気的機械的
に結合させる。この場合に、電子部品のリードと回路パ
ターンの接続ランドのみに半田が付着するように、熔融
半田槽浸漬前に他のプリント配線板全面にソルダーレジ
ストを施して不要部分の半田による橋絡を防止する。After mounting the electronic component, the circuit pattern is immersed in a molten solder bath to electrically and mechanically connect the electronic component lead and the circuit pattern. In this case, in order to ensure that the solder adheres only to the leads of the electronic components and the connecting lands of the circuit pattern, apply solder resist to the entire surface of the other printed wiring boards before dipping them in the molten solder bath to prevent bridging caused by solder in unnecessary areas. do.
通常はシンボルマーク等の印刷はプリント配線板上の所
要の被覆完成後に行う。Usually, symbol marks and the like are printed after the required coating on the printed wiring board is completed.
゛ しよ′と る
通常のソルダーレジスト材料を使用する場合は上述の過
程で充分であり、特に問題は生じないが出願人の特願昭
６２−６０８３７号“ソルダーレジスト用印刷インク”
に記載したインクを使用したソルダーレジストの場合は
インクの撥水性のためにシンボルマーク等の印刷をソル
ダーレジストの上に施した場合にマーク用のインクが球
状に凝集する傾向があり、鮮明な印刷が不可能になる。When using ordinary solder resist materials, the above-mentioned process is sufficient and no particular problem arises.
In the case of solder resist using the ink described in , due to the water repellency of the ink, when symbol marks, etc. are printed on the solder resist, the mark ink tends to aggregate into spherical shapes, making it difficult to print clearly. becomes impossible.
第２図は従来のシンボルマークを印刷したプリント配線
板を示し、絶縁基板１上に導電体１通常は銅箔によって
回路パターン２を形成する。回路パターン２上に半田付
は部分を残してソルダーレジスト３を被覆する。シンボ
ルマーク４はプリント配線板の製作のほぼ完成後にシル
クスクリーン印刷によって印刷する。ソルダーレジスト
が撥水性を有する場合は被ｒｉｔ３．４間の密着が悪く
、シンボルマークが不鮮明になる。FIG. 2 shows a conventional printed wiring board with a symbol mark printed thereon, in which a circuit pattern 2 is formed on an insulating substrate 1 by a conductor 1, usually a copper foil. The circuit pattern 2 is covered with a solder resist 3, leaving a soldering portion. The symbol mark 4 is printed by silk screen printing after the production of the printed wiring board is almost completed. If the solder resist has water repellency, the adhesion between the solder resists 3 and 4 will be poor and the symbol mark will become unclear.
本発明の目的は、上述のシリコン樹脂、弗素系樹脂を含
有したソルダーレジストを使用する場合に鮮明なシンボ
ルマーク印刷を可能にする方法を提供するにある。An object of the present invention is to provide a method that enables clear symbol mark printing when using a solder resist containing the above-mentioned silicone resin or fluorine-based resin.
！ ７−るための
本発明によるシンボルマークの印刷方法は、プリント配
線板のソルダーレジスト用印刷インクがシリコン及び／
又は弗素系樹脂を含有する場合にシンボルマークの印刷
をソルダーレジスト被膜形成よりも前に行う。! 7- The method for printing a symbol mark according to the present invention for printing a printed wiring board uses silicone and/or
Alternatively, if a fluorine-based resin is contained, the symbol mark is printed before the solder resist film is formed.
作里
本発明によって、ｉａ水性ソルダーレジストを使用して
もシンボルマークの印刷を鮮明に行うことができる。According to the present invention, a symbol mark can be clearly printed even if an IA water-based solder resist is used.
正−例。Correct - example.
本発明を例示とした実施例並びに図面について説明する
。Embodiments and drawings illustrating the present invention will be described.
上述の出願人の特願昭６２−６０８３７号によるソルダ
ーレジスト用印刷インクはプリント配線板を半田槽に浸
ン貴する場合にインクの有する撥水性によって半田の付
着を積極的に防止し、半田による不要部分の橋絡防止に
極めて有効である。このインクの配合例を以下に示す。The printing ink for solder resist according to Japanese Patent Application No. 62-60837 by the applicant mentioned above actively prevents the adhesion of solder when a printed wiring board is immersed in a solder tank due to the water repellency of the ink. It is extremely effective in preventing bridging of unnecessary parts. A formulation example of this ink is shown below.
九℃Ｊ［−１
エポキシアクリレート
ポリエチレニングリコールアク
ベンゾインアルキルエーテル
酸化チタン
酸化珪素
ジフエルジサルファイド
顔料（シアニングリーン）
２８重量部
リレート７２
２．０〃
０．４
ジエチルヒドロキシアミン
０．１
ジメチルシロキサン
２．０ 〃
シリコン系高分子樹脂
２〜５ 〃
配イＩ【−１
配合例３のシリコン系高分子樹脂に代えて弗素系界面活
性剤 ２〜５重量部九論にＬ
配合例Ｉ のシリコン系高分子樹脂に代えて弗素系界面
活性剤 ２〜５重量部（フロラードＦＣ
−１７００住友スリーエム側製）配イ［
エポキシアクリレート
ポリウレタンアクリレート
ベンゾイルメチルエーテル
炭酸カルシウム
酸化珪素
シアニングリーン
ベンゾチアゾール
ベゾフェノン
ジメチルシロキサン
シリコン系高分子手討脂
５０ 重量部
５０〃
４ 〃
３ 〃
０．４
０．０５ 〃
２．６
１．５〃
２〜５〃
上述のシリコン系弗素系樹脂の混合によってソルダーレ
ジスト被覆は撥水性となり、フラツクス又は半田をはじ
き、接続ランド等の電気的接続部分以外への半田の付着
を積極的に防止し９回路パターンの高密度化に伴う橋絡
現象の発生を防止することができる。9℃J [-1 Epoxy acrylate polyethylene glycol aquebenzoin alkyl ether titanium oxide silicon oxide diphenyl disulfide pigment (cyanine green) 28 parts by weight Lylate 72 2.0〃 0.4 Diethylhydroxyamine 0.1 Dimethylsiloxane 2. 0 Silicone polymer resin 2 to 5 Silicone polymer resin I [-1 2 to 5 parts by weight of fluorine surfactant in place of the silicone polymer resin in Formulation example 3 Silicone polymer in Formulation example I Fluorine surfactant 2 to 5 parts by weight (Florard FC) instead of molecular resin
-1700 manufactured by Sumitomo 3M) Epoxy acrylate polyurethane acrylate benzoyl methyl ether calcium carbonate silicon oxide cyanine green benzothiazole bezophenone dimethyl siloxane silicone polymer handmade resin 50 parts by weight 50 4 3 0.4 0 .05 〃 2.6 1.5 〃 2-5〃 By mixing the above-mentioned silicone-based fluorine-based resin, the solder resist coating becomes water repellent, repels flux or solder, and prevents soldering to areas other than electrical connection parts such as connection lands. It is possible to actively prevent the adhesion of 9-circuit patterns and prevent the bridging phenomenon caused by the high density of the 9-circuit pattern.
しかし、このソルダーレジストを使用した場合には半田
のみでなく他の被膜を上面に付着させない傾向が生じ、
特に各種シンボルマークの印刷の場合にインクの付着が
悪いためマークが不鮮明になる。However, when this solder resist is used, there is a tendency to prevent not only solder but also other films from adhering to the top surface.
Particularly when printing various symbol marks, the marks become unclear due to poor ink adhesion.
本発明による構成を第２図に示し、絶縁基板１上に回路
パターン２を構成した後に直にシンボルマーク４を印刷
し、その後にソルダーレジスト３を被覆する。通常はプ
リント配線板がほぼ完成した後にシンボルマークの印刷
を行うため本発明は全〈従来の技法とは異なる順序とな
る。勿論、ソルダーレジストは透明とする必要があり、
配合例に示す顔料ジアニングリーンは混入しない。The structure according to the present invention is shown in FIG. 2, in which a symbol mark 4 is printed immediately after a circuit pattern 2 is formed on an insulating substrate 1, and then a solder resist 3 is coated. Since the symbol mark is usually printed after the printed wiring board is almost completed, the present invention requires a different order than the conventional technique. Of course, the solder resist must be transparent,
The pigment dianine green shown in the formulation example is not mixed.
主肌生班来
本発明は通常の順序とは反対であるが、撥水性ソルダー
レジスト使用の場合のシンボルマーク印刷を鮮明に所期
の通りに行い得る。Although the present invention is contrary to the usual order, it is possible to print symbol marks clearly and as expected when using a water-repellent solder resist.
第１図は本発明の方法の実施を示すプリント配線板の一
部の拡大断面図、第２図は従来のプリント配線板の部分
拡大断面図である。
１６１．絶縁基板
２００８回路パターン
３０９．ソルダーレジスト
４２１．シンボルマーク
特許出願人 日本シイエムケイ株式会社第
第FIG. 1 is an enlarged cross-sectional view of a part of a printed wiring board showing implementation of the method of the present invention, and FIG. 2 is a partial enlarged cross-sectional view of a conventional printed wiring board. 161. Insulating substrate 2008 circuit pattern 309. Solder resist 421. Symbol mark patent applicant Japan CMK Co., Ltd. No.
Claims (1)
シリコン及び／又は弗素系樹脂を含有する場合に、 シンボルマークの印刷をソルダーレジスト被膜形成より
も前に行うことを特徴とするシンボルマークの印刷方法
。1. A method for printing a symbol mark, which is characterized in that when the printing ink for solder resist of a printed wiring board contains silicone and/or fluorine-based resin, printing of the symbol mark is performed before the formation of a solder resist film.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33016588A JPH02174293A (en) | 1988-12-27 | 1988-12-27 | Method of printing symbol mark |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33016588A JPH02174293A (en) | 1988-12-27 | 1988-12-27 | Method of printing symbol mark |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02174293A true JPH02174293A (en) | 1990-07-05 |
Family
ID=18229545
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33016588A Pending JPH02174293A (en) | 1988-12-27 | 1988-12-27 | Method of printing symbol mark |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02174293A (en) |
-
1988
- 1988-12-27 JP JP33016588A patent/JPH02174293A/en active Pending
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