JPH02174238A - 半導体封止装置 - Google Patents

半導体封止装置

Info

Publication number
JPH02174238A
JPH02174238A JP32987688A JP32987688A JPH02174238A JP H02174238 A JPH02174238 A JP H02174238A JP 32987688 A JP32987688 A JP 32987688A JP 32987688 A JP32987688 A JP 32987688A JP H02174238 A JPH02174238 A JP H02174238A
Authority
JP
Japan
Prior art keywords
rotor
tablet
resin
mold
push
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP32987688A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0561777B2 (enExample
Inventor
Kazuhiko Kobayashi
一彦 小林
Hidetoshi Oya
秀俊 大屋
Ryoichi Arai
荒井　良一
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Yamada Manufacturing Co Ltd
Original Assignee
Yamada Seisakusho KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Yamada Seisakusho KK filed Critical Yamada Seisakusho KK
Priority to JP32987688A priority Critical patent/JPH02174238A/ja
Publication of JPH02174238A publication Critical patent/JPH02174238A/ja
Publication of JPH0561777B2 publication Critical patent/JPH0561777B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/17—Component parts, details or accessories; Auxiliary operations
    • B29C45/18—Feeding the material into the injection moulding apparatus, i.e. feeding the non-plastified material into the injection unit
    • B29C45/1808—Feeding measured doses
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/02—Transfer moulding, i.e. transferring the required volume of moulding material by a plunger from a "shot" cavity into a mould cavity
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B29—WORKING OF PLASTICS; WORKING OF SUBSTANCES IN A PLASTIC STATE IN GENERAL
    • B29C—SHAPING OR JOINING OF PLASTICS; SHAPING OF MATERIAL IN A PLASTIC STATE, NOT OTHERWISE PROVIDED FOR; AFTER-TREATMENT OF THE SHAPED PRODUCTS, e.g. REPAIRING
    • B29C45/00—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor
    • B29C45/14—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles
    • B29C45/14639—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components
    • B29C45/14655—Injection moulding, i.e. forcing the required volume of moulding material through a nozzle into a closed mould; Apparatus therefor incorporating preformed parts or layers, e.g. injection moulding around inserts or for coating articles for obtaining an insulating effect, e.g. for electrical components connected to or mounted on a carrier, e.g. lead frame

Landscapes

  • Engineering & Computer Science (AREA)
  • Manufacturing & Machinery (AREA)
  • Mechanical Engineering (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
JP32987688A 1988-12-27 1988-12-27 半導体封止装置 Granted JPH02174238A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP32987688A JPH02174238A (ja) 1988-12-27 1988-12-27 半導体封止装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP32987688A JPH02174238A (ja) 1988-12-27 1988-12-27 半導体封止装置

Publications (2)

Publication Number Publication Date
JPH02174238A true JPH02174238A (ja) 1990-07-05
JPH0561777B2 JPH0561777B2 (enExample) 1993-09-07

Family

ID=18226234

Family Applications (1)

Application Number Title Priority Date Filing Date
JP32987688A Granted JPH02174238A (ja) 1988-12-27 1988-12-27 半導体封止装置

Country Status (1)

Country Link
JP (1) JPH02174238A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0558238U (ja) * 1991-11-14 1993-08-03 金星エレクトロン株式会社 マルチプランジャー手動トランスファモールドダイ

Families Citing this family (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7763344B2 (en) 2006-04-17 2010-07-27 Laser Band, Llc Business form comprising a wristband with multiple imaging areas
US8904686B2 (en) 2008-02-05 2014-12-09 Laser Band, Llc Continuous strip of thermal wristband/label forms

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59179314A (ja) * 1983-03-31 1984-10-11 Toshiba Corp レジンモ−ルド装置
JPS6099535U (ja) * 1983-12-13 1985-07-06 長田　道男 半導体リ−ドフレ−ムと樹脂タブレツトの同時搬送供給装置
JPS60227426A (ja) * 1984-04-26 1985-11-12 Nec Kyushu Ltd 半導体樹脂封止装置におけるリ−ドフレ−ムと樹脂タブレツトの供給装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS59179314A (ja) * 1983-03-31 1984-10-11 Toshiba Corp レジンモ−ルド装置
JPS6099535U (ja) * 1983-12-13 1985-07-06 長田　道男 半導体リ−ドフレ−ムと樹脂タブレツトの同時搬送供給装置
JPS60227426A (ja) * 1984-04-26 1985-11-12 Nec Kyushu Ltd 半導体樹脂封止装置におけるリ−ドフレ−ムと樹脂タブレツトの供給装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0558238U (ja) * 1991-11-14 1993-08-03 金星エレクトロン株式会社 マルチプランジャー手動トランスファモールドダイ

Also Published As

Publication number Publication date
JPH0561777B2 (enExample) 1993-09-07

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