JPH0215864B2 - - Google Patents
Info
- Publication number
- JPH0215864B2 JPH0215864B2 JP58218207A JP21820783A JPH0215864B2 JP H0215864 B2 JPH0215864 B2 JP H0215864B2 JP 58218207 A JP58218207 A JP 58218207A JP 21820783 A JP21820783 A JP 21820783A JP H0215864 B2 JPH0215864 B2 JP H0215864B2
- Authority
- JP
- Japan
- Prior art keywords
- group
- general formula
- polysiloxane
- heat
- ladder
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/075—Silicon-containing compounds
- G03F7/0757—Macromolecular compounds containing Si-O, Si-C or Si-N bonds
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Macromonomer-Based Addition Polymer (AREA)
- Silicon Polymers (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58218207A JPS60108840A (ja) | 1983-11-18 | 1983-11-18 | 感光性耐熱材料 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP58218207A JPS60108840A (ja) | 1983-11-18 | 1983-11-18 | 感光性耐熱材料 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60108840A JPS60108840A (ja) | 1985-06-14 |
JPH0215864B2 true JPH0215864B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-04-13 |
Family
ID=16716295
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP58218207A Granted JPS60108840A (ja) | 1983-11-18 | 1983-11-18 | 感光性耐熱材料 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60108840A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0549253U (ja) * | 1991-11-29 | 1993-06-29 | 三菱マテリアル株式会社 | 半導体ウェーハの研磨機 |
-
1983
- 1983-11-18 JP JP58218207A patent/JPS60108840A/ja active Granted
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0549253U (ja) * | 1991-11-29 | 1993-06-29 | 三菱マテリアル株式会社 | 半導体ウェーハの研磨機 |
Also Published As
Publication number | Publication date |
---|---|
JPS60108840A (ja) | 1985-06-14 |
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