JPS60108840A - 感光性耐熱材料 - Google Patents

感光性耐熱材料

Info

Publication number
JPS60108840A
JPS60108840A JP58218207A JP21820783A JPS60108840A JP S60108840 A JPS60108840 A JP S60108840A JP 58218207 A JP58218207 A JP 58218207A JP 21820783 A JP21820783 A JP 21820783A JP S60108840 A JPS60108840 A JP S60108840A
Authority
JP
Japan
Prior art keywords
group
polysiloxane
organoladder
formula
compd
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58218207A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0215864B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html
Inventor
Hiroshi Adachi
足達 廣士
Osamu Hayashi
修 林
Kazuo Okabashi
岡橋 和郎
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58218207A priority Critical patent/JPS60108840A/ja
Publication of JPS60108840A publication Critical patent/JPS60108840A/ja
Publication of JPH0215864B2 publication Critical patent/JPH0215864B2/ja
Granted legal-status Critical Current

Links

Classifications

    • GPHYSICS
    • G03PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03FPHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/004Photosensitive materials
    • G03F7/075Silicon-containing compounds
    • G03F7/0757Macromolecular compounds containing Si-O, Si-C or Si-N bonds

Landscapes

  • Physics & Mathematics (AREA)
  • Spectroscopy & Molecular Physics (AREA)
  • General Physics & Mathematics (AREA)
  • Compositions Of Macromolecular Compounds (AREA)
  • Macromonomer-Based Addition Polymer (AREA)
  • Silicon Polymers (AREA)
JP58218207A 1983-11-18 1983-11-18 感光性耐熱材料 Granted JPS60108840A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58218207A JPS60108840A (ja) 1983-11-18 1983-11-18 感光性耐熱材料

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58218207A JPS60108840A (ja) 1983-11-18 1983-11-18 感光性耐熱材料

Publications (2)

Publication Number Publication Date
JPS60108840A true JPS60108840A (ja) 1985-06-14
JPH0215864B2 JPH0215864B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-04-13

Family

ID=16716295

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58218207A Granted JPS60108840A (ja) 1983-11-18 1983-11-18 感光性耐熱材料

Country Status (1)

Country Link
JP (1) JPS60108840A (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH0549253U (ja) * 1991-11-29 1993-06-29 三菱マテリアル株式会社 半導体ウェーハの研磨機

Also Published As

Publication number Publication date
JPH0215864B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) 1990-04-13

Similar Documents

Publication Publication Date Title
KR100286427B1 (ko) 감광성수지조성물및전자부품용보호막
JP3051821B2 (ja) 感光性樹脂組成物及びそれを用いるパターン化されたポリイミド皮膜の形成方法
US4661435A (en) Photosensitive polyamic acid derivative, compounds used in the manufacture of the derivative, method of manufacturing polyimide pattern on a substrate, and semiconductor device comprising a polyimide pattern obtained by using the said method
JPS60108841A (ja) 感光性耐熱材料
JP4811242B2 (ja) ポジ型感光性樹脂組成物、該ポジ型感光性樹脂組成物を用いた半導体装置及び表示素子
JP4250982B2 (ja) ポジ型感光性樹脂組成物、パターンの製造方法及び電子部品
JPS5849717A (ja) 光又は放射線硬化性ポリオルガノシロキサン組成物
EP0512692A1 (en) Photosensitive materials and process for making them
JPS60108840A (ja) 感光性耐熱材料
JPH1192660A (ja) 感光性樹脂組成物
JP3369344B2 (ja) 感光性樹脂組成物
US5573886A (en) Photosensitive resin composition comprising a polyimide precursor and method for making a polyimide film pattern from the same
JPS60108839A (ja) 感光性耐熱材料
JP2705432B2 (ja) メタクリル基含有ビス(4’−フタル酸無水物)シロキサン誘導体及びその製造方法
TW202231737A (zh) 樹脂組成物、固化膜、固化膜的製造方法、附多層膜之基板、附圖案之基板的製造方法、光敏性樹脂組成物、圖案固化膜的製造方法、聚合物的製造方法以及樹脂組成物的製造方法
JP2003252991A (ja) アクリルもしくはメタクリル官能性シリコーン変性ポリイミド樹脂、その製造方法および感光性樹脂組成物
JPS6260412B2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html)
JPS60254132A (ja) パタ−ン形成材料
EP0554040A2 (en) Photosensitive resin compositions, their preparation and use
JPS61279852A (ja) 感光性耐熱材料
JP2005173528A (ja) ポジ型感光性樹脂組成物、レリーフパターンの製造方法及び電子部品
JPS59213728A (ja) シリコ−ン化合物の製造法
KR100382795B1 (ko) 감광성폴리이미드조성물용가교조제화합물
JP2003026727A (ja) 重合性イミド単量体及びその製造方法、光硬化性組成物並びに半導体チップ
JPS5936135A (ja) 光硬化性ポリオルガノシロキサン