JPH0215321Y2 - - Google Patents

Info

Publication number
JPH0215321Y2
JPH0215321Y2 JP1982116344U JP11634482U JPH0215321Y2 JP H0215321 Y2 JPH0215321 Y2 JP H0215321Y2 JP 1982116344 U JP1982116344 U JP 1982116344U JP 11634482 U JP11634482 U JP 11634482U JP H0215321 Y2 JPH0215321 Y2 JP H0215321Y2
Authority
JP
Japan
Prior art keywords
bumps
bump
mounting board
element substrate
mounting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1982116344U
Other languages
English (en)
Japanese (ja)
Other versions
JPS5920633U (ja
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP1982116344U priority Critical patent/JPS5920633U/ja
Publication of JPS5920633U publication Critical patent/JPS5920633U/ja
Application granted granted Critical
Publication of JPH0215321Y2 publication Critical patent/JPH0215321Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H10W72/07227—
    • H10W72/07251—
    • H10W72/20—
    • H10W72/331—
    • H10W72/332—
    • H10W72/856—

Landscapes

  • Wire Bonding (AREA)
JP1982116344U 1982-07-30 1982-07-30 バンプ接合型半導体装置 Granted JPS5920633U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982116344U JPS5920633U (ja) 1982-07-30 1982-07-30 バンプ接合型半導体装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982116344U JPS5920633U (ja) 1982-07-30 1982-07-30 バンプ接合型半導体装置

Publications (2)

Publication Number Publication Date
JPS5920633U JPS5920633U (ja) 1984-02-08
JPH0215321Y2 true JPH0215321Y2 (esLanguage) 1990-04-25

Family

ID=30268230

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982116344U Granted JPS5920633U (ja) 1982-07-30 1982-07-30 バンプ接合型半導体装置

Country Status (1)

Country Link
JP (1) JPS5920633U (esLanguage)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0312217A1 (en) * 1987-09-30 1989-04-19 AT&T Corp. Integrated circuit chip assembly

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4895774A (esLanguage) * 1972-03-17 1973-12-07
JPS51147255A (en) * 1975-06-13 1976-12-17 Hitachi Ltd Semiconductor device

Also Published As

Publication number Publication date
JPS5920633U (ja) 1984-02-08

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