JPH0214788B2 - - Google Patents
Info
- Publication number
- JPH0214788B2 JPH0214788B2 JP56041407A JP4140781A JPH0214788B2 JP H0214788 B2 JPH0214788 B2 JP H0214788B2 JP 56041407 A JP56041407 A JP 56041407A JP 4140781 A JP4140781 A JP 4140781A JP H0214788 B2 JPH0214788 B2 JP H0214788B2
- Authority
- JP
- Japan
- Prior art keywords
- oxide film
- region
- layer
- film
- impurity
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
- H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
- H10D84/80—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of at least one component covered by groups H10D12/00 or H10D30/00, e.g. integration of IGFETs
- H10D84/811—Combinations of field-effect devices and one or more diodes, capacitors or resistors
Landscapes
- Weting (AREA)
- Metal-Oxide And Bipolar Metal-Oxide Semiconductor Integrated Circuits (AREA)
- Electrodes Of Semiconductors (AREA)
- Semiconductor Integrated Circuits (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56041407A JPS57153462A (en) | 1981-03-18 | 1981-03-18 | Manufacture of semiconductor integrated circuit device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP56041407A JPS57153462A (en) | 1981-03-18 | 1981-03-18 | Manufacture of semiconductor integrated circuit device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS57153462A JPS57153462A (en) | 1982-09-22 |
| JPH0214788B2 true JPH0214788B2 (OSRAM) | 1990-04-10 |
Family
ID=12607501
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP56041407A Granted JPS57153462A (en) | 1981-03-18 | 1981-03-18 | Manufacture of semiconductor integrated circuit device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS57153462A (OSRAM) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03116588U (OSRAM) * | 1990-03-09 | 1991-12-03 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS6416645U (OSRAM) * | 1987-07-17 | 1989-01-27 |
-
1981
- 1981-03-18 JP JP56041407A patent/JPS57153462A/ja active Granted
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03116588U (OSRAM) * | 1990-03-09 | 1991-12-03 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS57153462A (en) | 1982-09-22 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JP2886494B2 (ja) | 集積回路チップの製造方法 | |
| JP2823572B2 (ja) | 集積回路の製造方法 | |
| JP3181695B2 (ja) | Soi基板を用いた半導体装置の製造方法 | |
| US5300797A (en) | Coplanar twin-well integrated circuit structure | |
| EP0135243B1 (en) | A method of producing a semiconductor structure on a substrate and a semiconductor device manufactured thereby | |
| US4675981A (en) | Method of making implanted device regions in a semiconductor using a master mask member | |
| JPH098321A (ja) | 半導体素子のトランジスター構造及びその製造方法 | |
| US5994190A (en) | Semiconductor device with impurity layer as channel stopper immediately under silicon oxide film | |
| JPH10229178A (ja) | 半導体装置の製造方法 | |
| JPH03163833A (ja) | 半導体装置およびその製造方法 | |
| JPH0214788B2 (OSRAM) | ||
| JP4180809B2 (ja) | 半導体装置の製造方法 | |
| JP3188132B2 (ja) | 半導体装置の製造方法 | |
| US5830796A (en) | Method of manufacturing a semiconductor device using trench isolation | |
| JPS59124142A (ja) | 半導体装置の製造方法 | |
| JPH07326753A (ja) | 半導体素子の製造方法 | |
| KR100266689B1 (ko) | 고전압 수평 확산 모스 트랜지스터 제조방법 | |
| JPH0479336A (ja) | 半導体装置の製造方法 | |
| KR960012262B1 (ko) | 모스(mos) 트랜지스터 제조방법 | |
| JPS60226169A (ja) | 半導体装置の製造方法 | |
| JPH05259446A (ja) | 半導体装置の製造方法 | |
| JPH01223741A (ja) | 半導体装置及びその製造方法 | |
| JPS63144543A (ja) | 半導体素子間分離領域の形成方法 | |
| KR19980046004A (ko) | 반도체 소자 및 그의 제조방법 | |
| JPH04242934A (ja) | 半導体装置の製造方法 |