JPH02146448U - - Google Patents
Info
- Publication number
- JPH02146448U JPH02146448U JP5660689U JP5660689U JPH02146448U JP H02146448 U JPH02146448 U JP H02146448U JP 5660689 U JP5660689 U JP 5660689U JP 5660689 U JP5660689 U JP 5660689U JP H02146448 U JPH02146448 U JP H02146448U
- Authority
- JP
- Japan
- Prior art keywords
- semiconductor package
- electrode lead
- attached
- protrusion
- insulating base
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 6
- 229910001111 Fine metal Inorganic materials 0.000 description 1
- NEIHULKJZQTQKJ-UHFFFAOYSA-N [Cu].[Ag] Chemical compound [Cu].[Ag] NEIHULKJZQTQKJ-UHFFFAOYSA-N 0.000 description 1
- 239000006023 eutectic alloy Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
Landscapes
- Lead Frames For Integrated Circuits (AREA)
Description
第１図は本考案の一実施例の縦断面図、第２図
は第１図の底面図、第３図は従来の半導体パツケ
ージの縦断面図、第４図は第３図の底面図である
。 １……半導体パツケージ（絶縁基体）、２……
電極引出しリード、３……銀銅共晶合金、４……
半導体素子、５……金属細線、６……位置合わせ
用凸部、７……接着用ガイド治具。
は第１図の底面図、第３図は従来の半導体パツケ
ージの縦断面図、第４図は第３図の底面図である
。 １……半導体パツケージ（絶縁基体）、２……
電極引出しリード、３……銀銅共晶合金、４……
半導体素子、５……金属細線、６……位置合わせ
用凸部、７……接着用ガイド治具。
Claims (1)
- 円形絶縁基体の半導体パツケージに電極引出し
リードを取付ける構造の半導体装置において、半
導体パツケージの電極引出しリードを取付ける部
分に取付け位置合わせ用の凸部を形成したことを
特徴とする半導体装置。
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5660689U JPH02146448U (ja) | 1989-05-16 | 1989-05-16 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP5660689U JPH02146448U (ja) | 1989-05-16 | 1989-05-16 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02146448U true JPH02146448U (ja) | 1990-12-12 |
Family
ID=31580584
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP5660689U Pending JPH02146448U (ja) | 1989-05-16 | 1989-05-16 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02146448U (ja) |
-
1989
- 1989-05-16 JP JP5660689U patent/JPH02146448U/ja active Pending