JPH0214546A - 特にシリコンウェーハの水平転送装置 - Google Patents
特にシリコンウェーハの水平転送装置Info
- Publication number
- JPH0214546A JPH0214546A JP63324728A JP32472888A JPH0214546A JP H0214546 A JPH0214546 A JP H0214546A JP 63324728 A JP63324728 A JP 63324728A JP 32472888 A JP32472888 A JP 32472888A JP H0214546 A JPH0214546 A JP H0214546A
- Authority
- JP
- Japan
- Prior art keywords
- transfer
- rack
- arm
- wafer
- finger
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000012546 transfer Methods 0.000 title claims abstract description 48
- 229920001296 polysiloxane Polymers 0.000 claims description 4
- 229910052710 silicon Inorganic materials 0.000 claims description 4
- 239000010703 silicon Substances 0.000 claims description 4
- 238000012856 packing Methods 0.000 claims description 2
- 238000013519 translation Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 abstract description 36
- 238000012545 processing Methods 0.000 description 4
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 3
- 238000000034 method Methods 0.000 description 2
- 239000002245 particle Substances 0.000 description 2
- 239000004035 construction material Substances 0.000 description 1
- 238000011109 contamination Methods 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 230000002452 interceptive effect Effects 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 238000011017 operating method Methods 0.000 description 1
- 239000000126 substance Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67763—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading
- H01L21/67778—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations the wafers being stored in a carrier, involving loading and unloading involving loading and unloading of wafers
- H01L21/67781—Batch transfer of wafers
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
- Load-Engaging Elements For Cranes (AREA)
- Specific Conveyance Elements (AREA)
- Crystals, And After-Treatments Of Crystals (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| FR8718454 | 1987-12-22 | ||
| FR8718454A FR2624839B1 (fr) | 1987-12-22 | 1987-12-22 | Appareil pour le transfert horizontal de plaquettes de silicium notamment |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0214546A true JPH0214546A (ja) | 1990-01-18 |
Family
ID=9358503
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP63324728A Pending JPH0214546A (ja) | 1987-12-22 | 1988-12-22 | 特にシリコンウェーハの水平転送装置 |
Country Status (4)
Families Citing this family (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CH680317A5 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) * | 1990-03-05 | 1992-07-31 | Tet Techno Investment Trust | |
| DE4142671A1 (de) * | 1991-12-21 | 1993-06-24 | Wabco Westinghouse Fahrzeug | Einrichtung zur messung einer verformung eines bauteils |
| JPH0662542U (ja) * | 1993-01-29 | 1994-09-02 | 信越半導体株式会社 | ウエーハカセット |
| US5590996A (en) * | 1994-10-13 | 1997-01-07 | Semitherm | Wafer transfer apparatus |
| DE19535617A1 (de) * | 1995-09-25 | 1997-03-27 | Siemens Ag | System zum Transport von Testboards |
| DE19845504A1 (de) * | 1998-10-02 | 2000-04-20 | Wacker Siltronic Halbleitermat | Hordenaufnahmevorrichtung |
| FR3075771A1 (fr) * | 2017-12-21 | 2019-06-28 | Commissariat A L'energie Atomique Et Aux Energies Alternatives | Systeme de transfert de plusieurs plaques entre deux paniers |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4534695A (en) * | 1983-05-23 | 1985-08-13 | Eaton Corporation | Wafer transport system |
| US4536122A (en) * | 1983-08-22 | 1985-08-20 | Trilogy Computer Development Partners, Ltd. | Wafer transfer device |
| JPS636857A (ja) * | 1986-06-26 | 1988-01-12 | Fujitsu Ltd | ウエ−ハ移し替え装置 |
-
1987
- 1987-12-22 FR FR8718454A patent/FR2624839B1/fr not_active Expired - Fee Related
-
1988
- 1988-12-22 KR KR1019880017277A patent/KR890011020A/ko not_active Withdrawn
- 1988-12-22 DE DE3843369A patent/DE3843369A1/de active Granted
- 1988-12-22 JP JP63324728A patent/JPH0214546A/ja active Pending
Also Published As
| Publication number | Publication date |
|---|---|
| FR2624839A1 (fr) | 1989-06-23 |
| FR2624839B1 (fr) | 1990-06-01 |
| DE3843369A1 (de) | 1989-08-24 |
| DE3843369C2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1991-02-14 |
| KR890011020A (ko) | 1989-08-12 |
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