JPH0214384B2 - - Google Patents

Info

Publication number
JPH0214384B2
JPH0214384B2 JP4578686A JP4578686A JPH0214384B2 JP H0214384 B2 JPH0214384 B2 JP H0214384B2 JP 4578686 A JP4578686 A JP 4578686A JP 4578686 A JP4578686 A JP 4578686A JP H0214384 B2 JPH0214384 B2 JP H0214384B2
Authority
JP
Japan
Prior art keywords
adhesive sheet
radiation
adhesive
base material
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
Application number
JP4578686A
Other languages
English (en)
Japanese (ja)
Other versions
JPS62205180A (ja
Inventor
Kazuyoshi Ebe
Hiroaki Narita
Katsuhisa Taguchi
Yoshitaka Akeda
Takanori Saito
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
FSK Corp
Original Assignee
FSK Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by FSK Corp filed Critical FSK Corp
Priority to JP61045786A priority Critical patent/JPS62205180A/ja
Priority to DE19863639266 priority patent/DE3639266A1/de
Priority to US06/932,210 priority patent/US4756968A/en
Priority to PH34523A priority patent/PH23580A/en
Priority to MYPI86000164A priority patent/MY100214A/en
Priority to KR1019860010787A priority patent/KR910007086B1/ko
Priority to NL8603269A priority patent/NL191241C/xx
Priority to FR8618037A priority patent/FR2592390B1/fr
Priority to GB8630956A priority patent/GB2184741B/en
Publication of JPS62205180A publication Critical patent/JPS62205180A/ja
Priority to US07/111,849 priority patent/US4965127A/en
Priority to MYPI89000327A priority patent/MY104709A/en
Priority to GB8916855A priority patent/GB2221468B/en
Priority to GB8916857A priority patent/GB2221470B/en
Priority to GB8916856A priority patent/GB2221469B/en
Publication of JPH0214384B2 publication Critical patent/JPH0214384B2/ja
Priority to US07/549,496 priority patent/US5187007A/en
Priority to SG1146/92A priority patent/SG114692G/en
Priority to SG1143/92A priority patent/SG114392G/en
Priority to SG1145/92A priority patent/SG114592G/en
Priority to SG1144/92A priority patent/SG114492G/en
Priority to HK1054/92A priority patent/HK105492A/xx
Priority to HK1055/92A priority patent/HK105592A/xx
Priority to HK1057/92A priority patent/HK105792A/xx
Priority to HK1056/92A priority patent/HK105692A/xx
Priority to NL9302150A priority patent/NL193617C/nl
Priority to NL9302147A priority patent/NL9302147A/nl
Priority to NL9302148A priority patent/NL9302148A/nl
Priority to NL9302149A priority patent/NL9302149A/nl
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7402—Wafer tapes, e.g. grinding or dicing support tapes
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P72/00—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof
    • H10P72/70—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping
    • H10P72/74—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support
    • H10P72/7416—Handling or holding of wafers, substrates or devices during manufacture or treatment thereof for supporting or gripping using temporarily an auxiliary support used during dicing or grinding

Landscapes

  • Adhesive Tapes (AREA)
  • Dicing (AREA)
JP61045786A 1985-12-27 1986-03-03 粘着シ−ト Granted JPS62205180A (ja)

Priority Applications (27)

Application Number Priority Date Filing Date Title
JP61045786A JPS62205180A (ja) 1986-03-03 1986-03-03 粘着シ−ト
DE19863639266 DE3639266A1 (de) 1985-12-27 1986-11-17 Haftfolie
US06/932,210 US4756968A (en) 1985-12-27 1986-11-18 Adhesive sheets
PH34523A PH23580A (en) 1985-12-27 1986-11-24 Adhesive sheet
MYPI86000164A MY100214A (en) 1985-12-27 1986-12-02 Adhesive sheet
KR1019860010787A KR910007086B1 (ko) 1985-12-27 1986-12-15 점착시이트
NL8603269A NL191241C (nl) 1985-12-27 1986-12-23 Kleefvel voor halfgeleiders.
FR8618037A FR2592390B1 (fr) 1985-12-27 1986-12-23 Feuille adhesive utilisable notamment pour le decoupage de pastilles semiconductrices sous la forme de microplaquettes
GB8630956A GB2184741B (en) 1985-12-27 1986-12-29 Adhesive sheet suitable for use in the preparation of semiconductor chips
US07/111,849 US4965127A (en) 1985-12-27 1987-10-22 Adhesive sheets
MYPI89000327A MY104709A (en) 1985-12-27 1989-05-15 Adhesive sheet.
GB8916856A GB2221469B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
GB8916857A GB2221470B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for semiconductor wafer processing
GB8916855A GB2221468B (en) 1985-12-27 1989-07-24 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
US07/549,496 US5187007A (en) 1985-12-27 1990-06-29 Adhesive sheets
SG1146/92A SG114692G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
SG1143/92A SG114392G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
SG1145/92A SG114592G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for semiconductor wafer processing
SG1144/92A SG114492G (en) 1985-12-27 1992-11-02 Adhesive sheet suitable for use in the preparation of semiconductor chips
HK1056/92A HK105692A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
HK1057/92A HK105792A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in the preparation of semiconductor chips
HK1054/92A HK105492A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for semiconductor wafer processing
HK1055/92A HK105592A (en) 1985-12-27 1992-12-31 Adhesive sheet suitable for use in dicing semiconductor wafers into chips
NL9302150A NL193617C (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302147A NL9302147A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302148A NL9302148A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.
NL9302149A NL9302149A (nl) 1985-12-27 1993-12-09 Kleefvel voor halfgeleiders.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP61045786A JPS62205180A (ja) 1986-03-03 1986-03-03 粘着シ−ト

Publications (2)

Publication Number Publication Date
JPS62205180A JPS62205180A (ja) 1987-09-09
JPH0214384B2 true JPH0214384B2 (fa) 1990-04-06

Family

ID=12728961

Family Applications (1)

Application Number Title Priority Date Filing Date
JP61045786A Granted JPS62205180A (ja) 1985-12-27 1986-03-03 粘着シ−ト

Country Status (1)

Country Link
JP (1) JPS62205180A (fa)

Families Citing this family (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02107681A (ja) * 1988-10-18 1990-04-19 Tomoegawa Paper Co Ltd 光感受性粘着シート
JP4072927B2 (ja) * 1997-08-28 2008-04-09 リンテック株式会社 エネルギー線硬化型親水性粘着剤組成物およびその利用方法
KR101950051B1 (ko) * 2011-09-20 2019-02-19 닛토덴코 가부시키가이샤 전자 부품 절단용 가열 박리형 점착 시트 및 전자 부품 절단 방법
JP6686299B2 (ja) * 2014-05-22 2020-04-22 大日本印刷株式会社 積層体の製造方法及びそれに用いる接着シート
JP7260017B1 (ja) * 2022-01-31 2023-04-18 大日本印刷株式会社 半導体加工用粘着テープ
JPWO2023243510A1 (fa) * 2022-06-15 2023-12-21

Also Published As

Publication number Publication date
JPS62205180A (ja) 1987-09-09

Similar Documents

Publication Publication Date Title
US4965127A (en) Adhesive sheets
US5187007A (en) Adhesive sheets
JP2726350B2 (ja) ウェハ貼着用粘着シート
JPS6317981A (ja) 粘着シ−ト
JP2601956B2 (ja) 再剥離型粘着性ポリマー
JP3388674B2 (ja) エネルギー線硬化型感圧接着剤組成物およびその利用方法
JPH0215595B2 (fa)
DE10107337A1 (de) Haftkleberfolie zum Wafer-Kleben
JPH0156112B2 (fa)
JP2002235055A (ja) ダイシング用粘着シート
JP6522617B2 (ja) ダイシングシート、ダイシングシートの製造方法、およびモールドチップの製造方法
JP3299601B2 (ja) ウェハ貼着用粘着シート
JPH0214384B2 (fa)
GB2221469A (en) Adhesive sheet suitable for use in dicing semiconductor wafers into chips
JPH0258306B2 (fa)
JP2545170B2 (ja) ウェハ貼着用粘着シ―トおよびウェハダイシング方法
JP3073239B2 (ja) ウェハ貼着用粘着シート
JPH0251948B2 (fa)
JP2728333B2 (ja) ウェハ貼着用粘着シートおよびチップのピックアップ方法
KR20170130345A (ko) 다이싱 시트, 다이싱 시트의 제조 방법, 및 몰드 칩의 제조 방법
JPH1161065A (ja) 半導体ウエハ加工用粘着シート
JPS63205383A (ja) ウエハ貼着用粘着シ−ト
JPS63299246A (ja) ウェハ貼着用粘着シ−ト
JP3209544B2 (ja) ウェハ貼着用粘着シート
JPS63310132A (ja) ウエハ貼着用粘着シ−ト

Legal Events

Date Code Title Description
R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

R250 Receipt of annual fees

Free format text: JAPANESE INTERMEDIATE CODE: R250

EXPY Cancellation because of completion of term