JPH0214145B2 - - Google Patents
Info
- Publication number
- JPH0214145B2 JPH0214145B2 JP61131643A JP13164386A JPH0214145B2 JP H0214145 B2 JPH0214145 B2 JP H0214145B2 JP 61131643 A JP61131643 A JP 61131643A JP 13164386 A JP13164386 A JP 13164386A JP H0214145 B2 JPH0214145 B2 JP H0214145B2
- Authority
- JP
- Japan
- Prior art keywords
- solder
- cylindrical
- removal device
- support member
- collection chamber
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 229910000679 solder Inorganic materials 0.000 claims description 138
- 238000010438 heat treatment Methods 0.000 claims description 11
- 230000020169 heat generation Effects 0.000 claims description 3
- 125000006850 spacer group Chemical group 0.000 description 12
- 238000007789 sealing Methods 0.000 description 10
- 238000002844 melting Methods 0.000 description 9
- 230000008018 melting Effects 0.000 description 9
- XEEYBQQBJWHFJM-UHFFFAOYSA-N Iron Chemical compound [Fe] XEEYBQQBJWHFJM-UHFFFAOYSA-N 0.000 description 6
- 229910001220 stainless steel Inorganic materials 0.000 description 5
- 239000010935 stainless steel Substances 0.000 description 5
- 229910052742 iron Inorganic materials 0.000 description 3
- 238000005476 soldering Methods 0.000 description 3
- 230000006835 compression Effects 0.000 description 2
- 238000007906 compression Methods 0.000 description 2
- 239000004020 conductor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 239000000463 material Substances 0.000 description 2
- 239000000919 ceramic Substances 0.000 description 1
- 238000001816 cooling Methods 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000004907 flux Effects 0.000 description 1
- 239000011888 foil Substances 0.000 description 1
- 239000011521 glass Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000007769 metal material Substances 0.000 description 1
- 238000000034 method Methods 0.000 description 1
- 230000002093 peripheral effect Effects 0.000 description 1
- 239000012858 resilient material Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
- 239000011800 void material Substances 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K13/00—Apparatus or processes specially adapted for manufacturing or adjusting assemblages of electric components
- H05K13/04—Mounting of components, e.g. of leadless components
- H05K13/0486—Replacement and removal of components
- H05K13/0491—Hand tools therefor
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K1/00—Soldering, e.g. brazing, or unsoldering
- B23K1/018—Unsoldering; Removal of melted solder or other residues
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
- B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
- B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
- B23K3/04—Heating appliances
- B23K3/047—Heating appliances electric
Landscapes
- Engineering & Computer Science (AREA)
- Mechanical Engineering (AREA)
- Manufacturing & Machinery (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Electric Connection Of Electric Components To Printed Circuits (AREA)
- Resistance Heating (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| US74270185A | 1985-06-07 | 1985-06-07 | |
| US742701 | 2000-12-20 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS623873A JPS623873A (ja) | 1987-01-09 |
| JPH0214145B2 true JPH0214145B2 (OSRAM) | 1990-04-06 |
Family
ID=24985876
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP61131643A Granted JPS623873A (ja) | 1985-06-07 | 1986-06-06 | インライン形半田吸引除去装置 |
Country Status (6)
| Country | Link |
|---|---|
| JP (1) | JPS623873A (OSRAM) |
| CA (1) | CA1273531A (OSRAM) |
| DE (1) | DE3619041A1 (OSRAM) |
| FR (1) | FR2583255B1 (OSRAM) |
| GB (1) | GB2176729B (OSRAM) |
| IT (1) | IT1212064B (OSRAM) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3842240A (en) * | 1971-09-17 | 1974-10-15 | Stanley Electric Co Ltd | Solder removing apparatus |
| US4225076A (en) * | 1978-08-18 | 1980-09-30 | Pace Incorporated | Desolderer and heater assembly for use therewith |
| DE2923968C2 (de) * | 1978-08-18 | 1986-04-10 | Pace Inc., Silver Spring, Md. | Entlötgerät |
| US4269343A (en) * | 1978-08-18 | 1981-05-26 | Pace Incorporated | Desolderer and heater assembly for use therewith |
| US4289953A (en) * | 1979-02-09 | 1981-09-15 | Scheu Jr William E | Electrically heated solder extractor |
| US4439667A (en) * | 1980-07-11 | 1984-03-27 | Pace Incorporated | Desoldering device and improved heater assembly therefor |
-
1986
- 1986-06-04 GB GB8613489A patent/GB2176729B/en not_active Expired
- 1986-06-06 DE DE19863619041 patent/DE3619041A1/de active Granted
- 1986-06-06 JP JP61131643A patent/JPS623873A/ja active Granted
- 1986-06-06 CA CA000511074A patent/CA1273531A/en not_active Expired - Fee Related
- 1986-06-06 FR FR868608190A patent/FR2583255B1/fr not_active Expired - Fee Related
- 1986-06-06 IT IT8648108A patent/IT1212064B/it active
Also Published As
| Publication number | Publication date |
|---|---|
| DE3619041C2 (OSRAM) | 1993-03-25 |
| DE3619041A1 (de) | 1987-01-08 |
| JPS623873A (ja) | 1987-01-09 |
| IT8648108A0 (it) | 1986-06-06 |
| IT1212064B (it) | 1989-11-08 |
| GB2176729A (en) | 1987-01-07 |
| GB8613489D0 (en) | 1986-07-09 |
| FR2583255B1 (fr) | 1990-02-16 |
| GB2176729B (en) | 1989-05-10 |
| CA1273531A (en) | 1990-09-04 |
| FR2583255A1 (fr) | 1986-12-12 |
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