JPH02140839U - - Google Patents
Info
- Publication number
- JPH02140839U JPH02140839U JP4933389U JP4933389U JPH02140839U JP H02140839 U JPH02140839 U JP H02140839U JP 4933389 U JP4933389 U JP 4933389U JP 4933389 U JP4933389 U JP 4933389U JP H02140839 U JPH02140839 U JP H02140839U
- Authority
- JP
- Japan
- Prior art keywords
- boat
- support
- operating rod
- core tube
- furnace core
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004065 semiconductor Substances 0.000 claims description 5
- 238000004519 manufacturing process Methods 0.000 claims description 3
- 238000001514 detection method Methods 0.000 claims description 2
- 235000012431 wafers Nutrition 0.000 claims 1
- 238000010586 diagram Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
Landscapes
- Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
Description
第１図は本考案に係る半導体製造装置の縦断正
面図、第２図は同じく異なる動作時の縦断正面図
、第３図は第２図と９０度異なる面での縦断側面
図、第４図は同じく変形例を示す縦断側面図であ
る。第５図は従来の半導体製造装置の縦断正面図
、第６図は同装置内の温度分布図である。
２……ヒータ、３……炉芯管、５……ボート、
６……半導体ウエーハ、７……操作棒、１０……
温度検出素子、１１……支持体、１４……ロツク
機構。
FIG. 1 is a longitudinal sectional front view of a semiconductor manufacturing apparatus according to the present invention, FIG. 2 is a longitudinal sectional front view during a different operation, FIG. 3 is a longitudinal sectional side view taken in a plane 90 degrees different from that in FIG. FIG. 3 is a longitudinal side view showing a modification as well. FIG. 5 is a longitudinal sectional front view of a conventional semiconductor manufacturing apparatus, and FIG. 6 is a temperature distribution diagram within the apparatus. 2... Heater, 3... Furnace tube, 5... Boat,
6...Semiconductor wafer, 7...Operation rod, 10...
Temperature detection element, 11... support body, 14... lock mechanism.
Claims (1)
して炉芯管に収納されるボートと、 前記ボートを炉芯管の内部に搬入し、かつ、搬
出する操作棒と、 支持体に備えられ、炉芯管内の温度を測定する
温度検出素子と、 上記操作棒と支持体とを上記ボート搬入時に連
結し、かつ、ボート収納後に解除して上記支持体
と操作棒とを分離する機構とを具備したことを特
徴とする半導体製造装置。[Claims for Utility Model Registration] A boat that holds a plurality of semiconductor wafers aligned at predetermined intervals and stored in a furnace core tube, and an operating rod that carries the boats into and out of the furnace core tube. , a temperature detection element that is provided on the support and measures the temperature inside the furnace core tube; and the operating rod and the support are connected when the boat is brought into the boat, and the support and the operating rod are disconnected after the boat is stored. A semiconductor manufacturing device characterized by comprising a mechanism for separating the.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4933389U JPH02140839U (en) | 1989-04-25 | 1989-04-25 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4933389U JPH02140839U (en) | 1989-04-25 | 1989-04-25 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02140839U true JPH02140839U (en) | 1990-11-26 |
Family
ID=31566928
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4933389U Pending JPH02140839U (en) | 1989-04-25 | 1989-04-25 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02140839U (en) |
-
1989
- 1989-04-25 JP JP4933389U patent/JPH02140839U/ja active Pending
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