JPH0213476B2 - - Google Patents
Info
- Publication number
- JPH0213476B2 JPH0213476B2 JP55128024A JP12802480A JPH0213476B2 JP H0213476 B2 JPH0213476 B2 JP H0213476B2 JP 55128024 A JP55128024 A JP 55128024A JP 12802480 A JP12802480 A JP 12802480A JP H0213476 B2 JPH0213476 B2 JP H0213476B2
- Authority
- JP
- Japan
- Prior art keywords
- holes
- catalyst
- epoxy resin
- substrate
- electroless
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007747 plating Methods 0.000 claims description 36
- 238000000034 method Methods 0.000 claims description 23
- 239000000758 substrate Substances 0.000 claims description 22
- 239000003822 epoxy resin Substances 0.000 claims description 17
- 229920000647 polyepoxide Polymers 0.000 claims description 17
- 239000003054 catalyst Substances 0.000 claims description 16
- 238000004519 manufacturing process Methods 0.000 claims description 16
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 claims description 14
- 239000000463 material Substances 0.000 claims description 12
- 229910052802 copper Inorganic materials 0.000 claims description 10
- 239000010949 copper Substances 0.000 claims description 10
- 229910052751 metal Inorganic materials 0.000 claims description 9
- 239000002184 metal Substances 0.000 claims description 9
- 230000003197 catalytic effect Effects 0.000 claims description 8
- 238000005553 drilling Methods 0.000 claims description 6
- 239000000853 adhesive Substances 0.000 claims description 4
- 230000001070 adhesive effect Effects 0.000 claims description 4
- 239000004593 Epoxy Substances 0.000 description 4
- KDLHZDBZIXYQEI-UHFFFAOYSA-N Palladium Chemical compound [Pd] KDLHZDBZIXYQEI-UHFFFAOYSA-N 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 4
- 239000011889 copper foil Substances 0.000 description 4
- 239000011521 glass Substances 0.000 description 4
- 238000010438 heat treatment Methods 0.000 description 4
- RAXXELZNTBOGNW-UHFFFAOYSA-N imidazole Natural products C1=CNC=N1 RAXXELZNTBOGNW-UHFFFAOYSA-N 0.000 description 4
- 238000007639 printing Methods 0.000 description 4
- 239000000126 substance Substances 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 3
- 238000000576 coating method Methods 0.000 description 3
- 238000007772 electroless plating Methods 0.000 description 3
- 238000005530 etching Methods 0.000 description 3
- 239000004744 fabric Substances 0.000 description 3
- 238000003825 pressing Methods 0.000 description 3
- 229920005989 resin Polymers 0.000 description 3
- 239000011347 resin Substances 0.000 description 3
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N Phenol Chemical compound OC1=CC=CC=C1 ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 239000011248 coating agent Substances 0.000 description 2
- QGBSISYHAICWAH-UHFFFAOYSA-N dicyandiamide Chemical compound NC(N)=NC#N QGBSISYHAICWAH-UHFFFAOYSA-N 0.000 description 2
- -1 imidazole compound Chemical class 0.000 description 2
- 238000010030 laminating Methods 0.000 description 2
- 229920003986 novolac Polymers 0.000 description 2
- 229910052763 palladium Inorganic materials 0.000 description 2
- YKTSYUJCYHOUJP-UHFFFAOYSA-N [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] Chemical compound [O--].[Al+3].[Al+3].[O-][Si]([O-])([O-])[O-] YKTSYUJCYHOUJP-UHFFFAOYSA-N 0.000 description 1
- 230000004913 activation Effects 0.000 description 1
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000011162 core material Substances 0.000 description 1
- 238000005520 cutting process Methods 0.000 description 1
- 230000007547 defect Effects 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000010292 electrical insulation Methods 0.000 description 1
- 150000002460 imidazoles Chemical class 0.000 description 1
- 239000011256 inorganic filler Substances 0.000 description 1
- 229910003475 inorganic filler Inorganic materials 0.000 description 1
- 238000003475 lamination Methods 0.000 description 1
- 239000002075 main ingredient Substances 0.000 description 1
- 239000000155 melt Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000001556 precipitation Methods 0.000 description 1
- 238000010019 resist printing Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Landscapes
- Production Of Multi-Layered Print Wiring Board (AREA)
- Printing Elements For Providing Electric Connections Between Printed Circuits (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12802480A JPS5753999A (ja) | 1980-09-17 | 1980-09-17 | Tasoinsatsuhaisenbannoseiho |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP12802480A JPS5753999A (ja) | 1980-09-17 | 1980-09-17 | Tasoinsatsuhaisenbannoseiho |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS5753999A JPS5753999A (ja) | 1982-03-31 |
JPH0213476B2 true JPH0213476B2 (ko) | 1990-04-04 |
Family
ID=14974596
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP12802480A Granted JPS5753999A (ja) | 1980-09-17 | 1980-09-17 | Tasoinsatsuhaisenbannoseiho |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5753999A (ko) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501424A (ko) * | 1973-03-14 | 1975-01-09 |
-
1980
- 1980-09-17 JP JP12802480A patent/JPS5753999A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS501424A (ko) * | 1973-03-14 | 1975-01-09 |
Also Published As
Publication number | Publication date |
---|---|
JPS5753999A (ja) | 1982-03-31 |
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