JPH02133986A - Manufacture of resin sealed module - Google Patents

Abstract

PURPOSE:To obtain a highly reliable module which can be produced easily by soldering an external lead of a lead frame to the outside of a resin by covering the periphery with resin as well as soldering an external terminal of an electrical parts to the circuit of a lead frame. CONSTITUTION:An electrical parts 1 such as a semiconductor device, a chip resistor, a resin fuse body, etc., is mounted to a lead frame 40 and an external terminal 1a of the electrical parts is soldered to a circuit 2 at the specified position. Furthermore, a resin 5 airtigntly covers the periphery of the electrical parts 1 which is soldered to the circuit 2 and the periphery of the lead frame 40 and an external lead 3 of the lead frame is allowed to protrude to the outside of the resin 5. Then.,if signal current and power supply current are allowed to flow the external lead 3 which protrudes to the outside of the resin 5, signal current or power supply current flow to the circuit 2 of the lead frame within the resin 5 which continues to the external lead 3 and is transmitted to the electrical parts 1 Within the resin 5 through the external terminal 1a. Then, the electrical parts 1 within the resin 5 is activated and the module functions a specified electrical function. Thus, the module production can be simplified and a highly reliable module can be formed.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention is characterized in that an electric circuit having a predetermined electrical function is sealed inside a resin, and an external lead is extended from the electric circuit to the outside of the resin. , relates to a resin-sealed module (hereinafter simply referred to as a module) and a method for manufacturing the module.

[Prior Art] Conventionally, as the above-mentioned module, electrical components such as a semiconductor device, a chip resistor, and a resin heating element are mounted on a multilayered ceramic substrate on which a circuit made of tungsten metallization or the like is formed. There is a module in which external terminals of the components are connected to the circuits of the ceramic substrate, the ceramic substrate and the electric components are surrounded by resin, and external leads are extended from the circuits of the ceramic substrate outside the resin. .

[Problems to be Solved by the Invention] However, the above module requires a great deal of effort and large-scale equipment to form a multilayered ceramic substrate on which a circuit made of tungsten metallization and the like is formed.

In addition, the tungsten metallization that forms the circuit of the ceramic substrate has a high resistivity, and in order to form the circuit into a circuit that transmits a large current, the width and thickness must be significantly increased or thickened. Due to this necessity, there is a limit to the increase in the electrical capacity of the above-mentioned module.

Furthermore, in the above module, the area around the ceramic substrate and the electrical components mounted on the substrate is coated with epoxy resin, phenol resin, etc. using powder coating based on a fluidized dipping method that requires complicated processes and large-scale equipment. It was necessary to cover it with a resin such as, and the manufacturing thereof required a great deal of effort and time.

Furthermore, because the ceramic substrate and resin have significantly different thermal expansion coefficients, cracks tend to occur in the resin surrounding the ceramic substrate and electrical components, making it difficult to manufacture highly reliable modules. Ta.

An object of the present invention is to provide a highly reliable module that solves the above problems, allows easy increase in electrical capacity, and is easy to manufacture, and a manufacturing method for manufacturing the module.

[Means for Solving the Problems] In order to achieve the above object, the module of the present invention has an external terminal 1a of an electric component, as shown in FIGS. 1(a) and 1(b). The electrical component 1 is mounted on a lead frame 40 consisting of a circuit 2 to be connected and an external lead 3 continuous thereto, and the external terminal 1a of the electrical component is soldered to the circuit 2 of the lead frame. 1 and the surrounding lead frame 40 are covered with a resin 5, and the external leads 3 of the lead frame are made to protrude outside the resin 5.

In the module of the present invention, the external terminal 1a of the electrical component may be connected to the circuit 2 of the lead frame using a conductive adhesive instead of soldering.

Further, it is preferable to use a lead frame whose surface is plated for soldering or corrosion prevention as the lead frame 40 of the module of the present invention.

As shown in the manufacturing process diagram in FIG. 2, the first module manufacturing method of the present invention involves a series of steps that form a circuit 2 connecting an external terminal 1a of an electrical component and an external lead 3 continuous to the circuit 2. Solder 6 on a part of the continuous lead frame 4
After attaching the electrical components 1 to the lead frame 4,
is mounted, and the external terminal 1a of the electrical component is soldered to the circuit 2 of the lead frame using the solder 6,
After that, a part of the lead frame 4 is cut and removed,
After giving the lead frame 4 a degree of freedom in deformation, the electrical component 1 and the surrounding area of the lead frame 4 are covered with a resin 5, and the periphery of the external lead 3 of the lead frame is protruded outside the resin 5. At the same time, a part of the lead frame 4 protruding to the outside of the resin 5 is cut and removed, so that the plurality of external leads 3 of the lead frame 4 are separated and independent.

The manufacturing method of the second module of the present invention, as shown in the manufacturing process diagram in FIG. After attaching the solder paste 6a to a part of the continuous lead frame 4, the electrical component 1 is mounted on the lead frame 4, and the solder paste 6a is attached to a part of the continuous lead frame 4.
Solder paste 6 is prepared by preheating a to a temperature lower than its melting point.
The external terminal 1a of the electrical component is temporarily connected to the circuit 2 of the lead frame using the solder paste 6a having a weak adhesive force, and then one part of the lead frame 4 is connected to the circuit 2 of the lead frame. After cutting and removing the lead frame 4 to give it flexibility in deformation, the external terminal 1a of the electrical component is soldered to the circuit 2 of the lead frame using the solder paste 6a, and then,
The periphery of the electrical component 1 and the lead frame 4 around it is covered with a resin 5, and the periphery of the external lead 3 of the lead frame protrudes outside the resin 5, and the lead frame 4 that protrudes outside the resin 5. It is characterized in that a plurality of external leads 3 of the lead frame 4 are separated and independent by cutting and removing a portion.

As shown in FIG. 4, the third module manufacturing method of the present invention includes a lead frame forming a circuit 2 connecting an external terminal 1a of an electric component and an external lead 3 continuous thereto. 4, a part of which is cut and removed to form a plurality of lead frame pieces 4a+4b, 4
c + 4 d After attaching the solder 6 to a part of the L-divided lead frame 4 which has a degree of freedom of deformation, the electrical component l is mounted on the lead frame 4, and the external terminal 1a of the electrical component is attached. is soldered to the circuit 2 of the lead frame using the solder 6, and then the area around the electrical component 1 and the lead frame 4 is soldered with resin 5.
The periphery of the external leads 3 of the lead frame 4 is covered with resin 5 to protrude outside the resin 5, and the part of the lead frame 4 that is protruded outside the resin 5 is cut and removed to remove the plurality of external leads of the lead frame 4. It is characterized by making 3 separate and independent.

In addition, in the manufacturing method of the said 11th 2nd and 3rd module of this invention, it may replace with the solder 6 or the solder paste 6a, and may use a conductive adhesive.

Further, in the first, second and third module manufacturing methods of the present invention, a part of the lead frame 4 is provided with solder 6.
Alternatively, it is preferable that the surface of the lead frame 4 be plated for soldering or corrosion prevention before adhering the solder paste 6a or the conductive adhesive.

[Operation] According to the module of the present invention having the above configuration, a semiconductor device,
A substrate on which an electrical component 1 such as a chip resistor or a resin fuse body is mounted, and a circuit 2 that connects the external terminal 1a of the electrical component can be easily formed using the easily manufactured lead frame 40.

Also, an external terminal 1 of an electrical component sealed inside the resin 5
An external lead 3 extending from the circuit 2 connected to the circuit 2 to the outside of the resin 5 can be formed using a part of the lead frame 40, and the external lead 3 is separately connected to the circuit 2 by brazing or the like. No work is required.

Furthermore, a circuit 2 that connects the external terminal 1a of the electric component,
Since the lead farm 40 is formed by punching a metal plate with low resistivity and has a relatively wide cross-sectional area,
The circuit 2 described above can be easily formed into a circuit that can transmit a large current without greatly increasing its width or thickness.

Furthermore, the lead frame 40 and the resin 5 surrounding the lead frame have a relatively small difference in coefficient of thermal expansion, and cracks can be prevented from forming in the resin 5 surrounding the lead frame 40.

Furthermore, if a lead frame whose surface is plated is used as the lead frame 40, the external terminal 1 of the electrical component
A can be reliably soldered to the circuit 2 of the lead frame, and the surface of the lead frame 40 can be prevented from corroding.

In the first module manufacturing method of the present invention, after connecting the external terminal 1a of the electrical component to the circuit 2 of the lead frame using solder 6 or a conductive adhesive, a part of the lead frame 4 is cut and removed. This allows the lead frame 4 to have a degree of freedom in deformation. Therefore, when a part of the lead frame 4 is cut and removed, the lead frame 4 is appropriately tilted or twisted and deformed, and when the external terminal 1a of the electrical component is connected to the circuit 2 of the lead frame, the electrical Based on the difference in thermal expansion coefficients accumulated between the component 1 and the lead frame 4 (excessive thermal stress is reduced or removed), the electrical component 1 and the lead frame 4 are The bonding state between the external terminal 1a of the electrical component and the lead frame 4 will not become unstable due to the excessive thermal stress being accumulated between them.

In addition, if the module being manufactured is subjected to thermal history, such as when covering the electrical component l and the surrounding lead frame 4 with resin 5 after cutting and removing a part of the lead frame 4, In order to reduce the thermal stress accumulated between the electrical component 1 and the lead frame 4, the lead frame 4, which has the above-mentioned degree of freedom of deformation, is deformed by tilting or twisting as appropriate. Therefore, if the module being manufactured is subjected to thermal history after cutting and removing a part of the lead frame 4, there will be an excessive This prevents thermal stress from accumulating and causing the joint state between the external terminal 1a of the electrical component and the lead frame 4 to become unstable, and the electrical component 1 from being destroyed.

In the second module manufacturing method of the present invention, the external terminal 1a of the electrical component can be slightly moved to the circuit 2 of the lead frame using a solder paste 6a or conductive adhesive with a weak adhesive force preheated to a low temperature. It is temporarily connected in a state. Therefore, when the above-mentioned temporary connection is made, the external terminal la of the electrical component is connected so as to reduce the thermal stress accumulated between the electrical component I and the lead frame 4 due to the difference in coefficient of thermal expansion between the two. There is slight movement in the front, back, left and right with respect to the temporarily connected lead frame circuit 2. Therefore, excessive thermal stress is not accumulated between the electrical component 1 and the lead frame 4 during the temporary connection.

Moreover, after the above-mentioned temporary connection, a part of the lead frame 4 is cut and removed to give the lead frame 4 a degree of freedom in deformation. Therefore, after that, the external terminal 1a of the electrical component
When connected to the circuit 2 of the lead frame using solder paste 6a or conductive adhesive, thermal stress accumulated between the electrical component 1 and the lead frame 4 due to the difference in coefficient of thermal expansion between the two. The lead frame 4 is appropriately tilted or twisted and deformed so as to reduce the amount of damage. Therefore, when the above connection is made, excessive thermal stress is accumulated between the electrical component 1 and the lead frame 4 due to the difference in coefficient of thermal expansion between the two, and the external terminal la of the electrical component and the lead frame 4 are The bonded state will not become unstable and the electrical component 1 will not be destroyed.

Moreover, the lead frame 4 after the connection is partially cut and removed, so that it has a degree of freedom in deformation. Therefore, if the module being manufactured is subjected to thermal history when the electrical component 1 and the surrounding lead frame 4 are subsequently covered with resin 5, the electrical component 1 and the lead frame 4 may The lead frame 4 is appropriately tilted or twisted to deform so as to reduce the thermal stress based on the difference in thermal expansion coefficients between the two. Therefore, when the module being manufactured is subjected to thermal history after the above connection, excessive thermal stress is accumulated between the electrical component 1 and the lead frame 4, and the external terminal 1a of the electrical component and the lead frame 4 There is no possibility that the bonded state with the electrical component will become unstable or that the electrical component l will be destroyed.

Furthermore, in the second module manufacturing method of the present invention, the external terminal 1a of the electrical component is connected to the circuit 2 of the lead frame.
Since a part of the lead frame 4 is cut and removed after being temporarily connected to the lead frame 4, the lead frame 4 remains connected and supported by the electrical component l even after the lead frame 4 is partially cut and removed. Thus, the lead frame 4 is not separated into a plurality of lead frame pieces, and the lead frame 4 can be easily handled during module manufacture.

In the third module manufacturing method of the present invention, a part of the continuous lead frame 4 is cut and removed to form a plurality of lead frame pieces 4a, 4b.

An external terminal 1a of an electrical component is connected to a circuit 2 of a horizontal frame divided into 4c and 4d and having a degree of freedom of deformation using solder 6 or a conductive adhesive. Therefore, when the above connection is made, the plurality of lead frame pieces 4a, 4b,
The lead frame 4 consisting of 4c and 4d is appropriately tilted or twisted and deformed. Therefore, when the above connection is made, excessive thermal stress is accumulated between the electrical component 1 and the lead frame 4 due to the difference in thermal expansion coefficient between the two, and the external terminal 1a of the electrical component and the lead frame 4 are This prevents the bonding state from becoming unstable and prevents electrical components from being destroyed.

Further, the lead frame 4 is separated from the beginning into a plurality of lead frame pieces 4a, 4b, 4c, and 4d, so that the lead frame 4 has a degree of freedom in deformation.

Therefore, if the module being manufactured is subjected to thermal history, such as when covering the electrical component 1 and the surrounding lead frame 4 with resin 5 after the above connection, the electrical component 1
Based on the difference in thermal expansion coefficient accumulated between the lead frame 4 and the lead frame 4, the lead frame 4 is appropriately tilted or twisted and deformed to reduce the thermal stress. Later, when the module being manufactured is subjected to thermal history, excessive thermal stress is accumulated between the electrical component 1 and the lead frame 4, and the bonding state between the external terminal 1a of the electrical component and the lead frame 4 is deteriorated. There is no possibility of instability or destruction of the electrical component 1.

Furthermore, in the first, second, and third module manufacturing methods of the present invention, the surface of the lead frame 4 may be By plating the external terminals 1a of the electrical components to the lead frame 4, it is possible to reliably solder the external terminals 1a to the lead frame 4, and to prevent the surface of the lead frame 4 from corroding.

[Example] Next, embodiments of the present invention will be described with reference to the drawings.

FIGS. 1(a) and 1(b) show a preferred embodiment of the module of the present invention, and in detail, a partially cutaway front view and a side view of the module are shown. The embodiment shown in the above figure will be described below.

In the figure, 40 is a single type lead frame consisting of a module circuit 2 and an external lead 3 continuous thereto.

The lead frame 40 is formed by press punching or etching a metal plate made of iron-nickel alloy, copper alloy, or the like.

In addition, this lead frame 40 is made from a series of regular lead frames, such as an outer frame of the lead frame, a support bar, and a dam bar for resin sealing (not shown in the example in the figure) that are unnecessary to form a module. ) etc. are separated and removed.

Note that it is preferable that the surface of the lead frame 40 be plated with gold or the like. This is to ensure that external terminals 1a of electrical components, which will be described later, are soldered to the lead frame 40 and to prevent corrosion of the surface of the lead frame 40.

At a predetermined position on this lead frame 40, a semiconductor device,
Electrical components 1 such as a chip resistor and a resin fuse are respectively mounted.

Then, the external terminal 1a of the electrical component, that is, the electrode pad exposed to the outside of the semiconductor device, or the pad exposed at both ends of the chip resistor, resin fuse body, etc., is connected to the circuit 2 at a predetermined position of the lead frame. It's soldering.

Further, the electrical component 1 soldered to the circuit 2 of the lead frame and the lead frame 40 around it are hermetically covered with a resin 5 such as phenol resin or epoxy resin.

The external leads 3 of the lead frame are made to protrude outside the resin 5.

The modules shown in Figures m1 (a) and (b) are configured as described above.

Next, its effect will be explained.

A signal current and a power supply current are passed through the external lead 3 protruding from the resin 5.

Then, the above-mentioned signal current and power supply current flow through the circuit 2 of the lead frame inside the resin 5 that is continuous with the outer filtration board 3, and pass through the external terminal 1a to the electric component l inside the resin 5 connected to the circuit 2. , the above-mentioned signal current and power supply current are transmitted. Electrical components 1 inside the resin 5 are operated by the signal current and power supply current, and the module performs a predetermined electrical function.

Next, a method for manufacturing the first module of the present invention will be explained. FIG. 2 shows a manufacturing process diagram of the manufacturing method. Hereinafter, the manufacturing method will be explained according to the process diagram.

As shown in FIGS. 5(a) and 5(b), a lead frame 4 having a predetermined shape that forms the circuit 2 of the module to be obtained and the external leads 3 continuous thereto is formed by press punching or etching. ,Form.

Here, in order to facilitate its handling, the lead frame 4 is formed in a continuous shape without being separated into two or more pieces.

Next, as shown in FIGS. 6(a) and 6(b), solder 6 in the form of a paste or the like is attached to a part of the bonded frame 4 marked F by screen printing or the like.

Next, as shown in FIGS. 7(a) and 7(b), semiconductor devices, chip resistors, resin fuse bodies, etc. for forming a module are placed at predetermined positions on the frame 4. electrical components 1 are mounted respectively.

Then, the external terminal 1a of the electrical component is soldered to a predetermined position of the circuit 2 of the lead frame using the solder 6 attached to a part of the lead frame 4.

Thereafter, as shown in FIGS. 8(a) and 8(b), a portion of the lead frame 4 is cut and removed to give the lead frame 4 a degree of freedom in deformation.

Then, the lead frame 4 is appropriately tilted or twisted and deformed, and when the external terminal 1a of the electrical component is soldered to the circuit 2 of the lead frame, the lead frame 4 accumulates between the electrical component 1 and the lead frame 4. Excessive thermal stress due to the difference in thermal expansion coefficient between the two is reduced or eliminated.

Here, when cutting and removing a part of the lead frame 4, it is necessary to cut and remove a part of the lead frame 4 without impairing the functions of the lead frame portion that forms the circuit 2 and external leads 3 of the module. Needless to say, there is.

In addition, punch holes (not shown) may be provided on a part of the surface of the lead frame 4, or
A stress buffer (stress buffer mechanism) is provided in a part of the lead frame 4 by forming a part of the lead frame in a zigzag shape, so that when the external terminal 1a of the electrical component is soldered to the circuit 2 of the lead frame, Electrical parts l and lead frame 4
If the stress 7 It's convenient to be able to do it.

Thereafter, as shown in FIGS. 9(a) and 9(b), the electrical component 1 and the surrounding lead frame 4 are airtightly covered with a resin 5 such as phenol resin or epoxy resin. 5. Protrude the area around the external leads 3 of the lead frame to the outside.

Then, since the lead frame 4 before being covered with the resin 5 has been partially cut and removed and has a degree of freedom in deformation, the resin 5 is applied around the electrical component l and the lead frame 4. The lead frame 4 is tilted or twisted as appropriate so as to reduce the thermal stress accumulated between the electrical component 1 and the lead frame 4 even if the module being manufactured is subjected to thermal history during covering. This prevents excessive thermal stress from being deformed and accumulating between the electrical component 1 and the lead frame 4.

Then, as shown in FIGS. 1(a) and (b), the resin 5
A part of the lead frame 4 protruding to the outside is cut and separated to separate and separate the plurality of external leads 3 of the lead frame 4.

As a result, a highly reliable module of the present invention as shown in FIGS. 1(a) and 1(b) is obtained.

The manufacturing method of the first module, the manufacturing process diagram of which is shown in FIG. 2, consists of the steps described above.

Next, a method for manufacturing the second module of the present invention will be explained. FIG. 3 shows a manufacturing process diagram of the manufacturing method. Hereinafter, the manufacturing method will be explained according to the process diagram.

5(a), (b) and FIG. 6(a), (b), which are similar to those used in the manufacturing method of the first module described above.
A lead frame 4 forming a circuit 2 for connecting an external terminal 1a of an electric component and an external portion 3 continuous thereto, as shown in FIG. A continuous lead frame 4 is provided.

Then, at a predetermined position on the lead frame 4, as shown in FIG.
As shown in a) and (b), electrical components l forming a module are mounted.

Next, the solder paste 6a attached to a part of the lead frame 4 is preheated to a temperature lower than its melting point, for example, around 150° C. for about 2 hours, so that the solder paste 6a has a weak adhesive force. Then, using the solder paste 6a having weak adhesive strength, as shown in FIGS. Temporarily connect to.

Here, the solder paste 6a is the solder 6 mixed with resin-based flux, etc., and is in paste form, and when heated to a temperature lower than its melting point, for example, around 150°C, the solder paste 6a inside it is etc. evaporate into a semi-cured state, resulting in weak adhesive strength.

Then, when the external terminals 1a of the electrical components are temporarily connected to the circuits 2 at predetermined positions of the continuous lead frame 4 using the solder paste 6a with weak adhesive strength, the electrical components 1 and the lead frame 4 The external terminal 1a of the electrical component moves slightly back and forth and left and right with respect to the circuit 2 of the lead frame, so as to reduce the thermal stress accumulated between the two due to the difference in thermal expansion coefficient between the two. Excessive thermal stress is prevented from being accumulated between the lead frame 1 and the lead frame 4.

Next, as shown in FIGS. 8(a) and 8(b), a part of the lead frame 4 is cut and removed, and the lead frame 4 is
to have a degree of freedom in deformation.

Here, after temporarily connecting the external terminal 1a of the electrical component to the circuit 2 at a predetermined position on the lead frame 4, a part of the lead frame 4 is cut and removed as described above. When removed, lead frame 4
This is to avoid separating the lead frame into more than one lead frame piece, which would make the subsequent handling of the lead frame 4 troublesome.

Thereafter, the external terminal 1a of the electrical component is firmly soldered to the circuit 2 at a predetermined position of the lead frame 4 using the solder paste 6a having a strong adhesive force and heated to a temperature above its melting point of 183° C. or the like.

Then, as shown in FIGS. 8(a) and 8(b), a part of the lead frame 4 is cut and removed to give the lead frame 4 a degree of freedom in deformation, so that the external terminal of the electrical component When 1a is soldered to the circuit 2 at a predetermined position on the lead frame 4, the lead frame 4 is tilted or twisted as appropriate to reduce the thermal stress accumulated between the electrical component 1 and the lead frame 4. and transform it into electrical parts.
Excessive thermal stress is prevented from being accumulated between the lead frame 4 and the lead frame 4.

Thereafter, as shown in FIGS. 9(a) and 9(b), the periphery of the electrical component 1 and the lead frame 4 around it is coated with a resin layer in the same manner as in the method for manufacturing the first module described above.
Cover the resin 5 with external leads 3 of the lead frame.
The periphery of the lead frame 4 is made to protrude, and a part of the lead frame 4 that is made to protrude outside the resin 5 is cut and removed, as shown in FIG. 1(a).
As shown in (b), the plurality of external leads 3 of the lead frame 4 are separated and made independent.

Then, the lead frame 4 before being covered with the resin 5 has been partially cut and removed and has a degree of freedom in deformation, so when covering the area around the electrical component l and the lead frame 4, etc. When the module being manufactured is subjected to thermal history, the lead frame 4 is deformed by tilting or twisting as appropriate so as to reduce the thermal stress accumulated between the electrical component l and the IJ-board frame 4. This prevents excessive thermal stress from being accumulated between the electrical component 1 and the lead frame 4.

As a result, a highly reliable module of the present invention as shown in FIGS. 1(a) and 1(b) is obtained.

The second module manufacturing method, the manufacturing process diagram of which is shown in FIG. 3, consists of the steps described above.

Next, a method for manufacturing the third module of the present invention will be explained. FIG. 4 shows a manufacturing process diagram of the manufacturing method. Hereinafter, the manufacturing method will be explained according to the process diagram.

A lead frame 4 forming a circuit 2 for connecting an external terminal 1a of an electric component and an external lead 3 continuous thereto, similar to that used in the first and second manufacturing methods described above,
As shown in FIGS. 10(a) and 10(b), a plurality of lead frame pieces 4a, 4b, 4c are formed by cutting and removing a portion thereof.
Lead frame 4 with freedom of deformation divided into 4d
will be established. Then, each of the lead frame pieces 4a, 4b, 4c, and 4d of the lead frame is placed in the recess 7a of the jig 7, and each of the plurality of lead frame pieces 4a, 4b,
4c and 4d are arranged in a plane or the like with a certain positional relationship.

Next, as shown in FIGS. 10(a) and 10(b), the lead frame pieces 4a, 4b, 4c arranged in a planar shape,
, 4cl, paste-like solder 6 is attached to a portion of the 4cl by screen printing or the like.

Note that the solder 6 is applied to each lead frame piece 4a, 4b, 4d before placing the lead frame pieces 4a, 4b, 4c, and 4d in the recess 7a of the jig and arranging them.
, 4c, and 4d may be attached in advance.

Next, electrical components 1 forming a module are mounted at predetermined positions on the lead frame 4 arranged in a planar shape.

Then, the external terminal la of the electrical component is soldered to the circuit 2 at a predetermined position on the lead frame 4 using the solder 6 attached to a part of the lead frame 4.

Then, the lead frame 4 is separated into a plurality of lead frame pieces 4.
a Divide into 4b, 4c, and 4d to form lead frame 4
has a degree of freedom in deformation, so when the external terminal 1a of the electrical component is soldered to the circuit 2 at a predetermined position on the lead frame 4, the The plurality of lead frame pieces 4a, 4 are arranged so as to reduce thermal stress due to the difference in thermal expansion coefficient between them.
b.

This prevents excessive thermal stress from being accumulated between the electrical component 1 and the lead frame 4 due to the lead frame 4 made up of the lead frame 4 c and 4 d being appropriately tilted or twisted and deformed.

Next, the lead frame 4 on which the electrical component 1 is mounted is taken out from the inside of the recess 7a of the jig, and the manufacturing method shown in FIGS. b
), the periphery of the electrical component l and the lead frame 4 around it is covered with resin 5, and the periphery of the external lead 3 of the lead frame protrudes outside the resin 5. By cutting and removing a portion of the lead frame 4, the plurality of external leads 3 of the lead frame 4 are separated and independent, as shown in FIGS. 1(a) and 1(b).

Then, since the lead frame 4 before being covered with the resin 5 has been partially cut and removed and has a degree of freedom in deformation, the periphery of the electrical component 1 and the lead frame 4 is covered with the resin 5. In order to reduce the thermal stress accumulated between the electrical component l and the lead frame 4 when the module being manufactured is subjected to thermal history during manufacturing, the lead frame 4 is tilted or twisted as appropriate. This prevents excessive thermal stress from being deformed and accumulating between the electrical component l and the lead frame 4.

As a result, a highly reliable module of the present invention as shown in FIGS. 1(a) and 1(b) is obtained.

The third module manufacturing method, the manufacturing process diagram of which is shown in FIG. 4, consists of the steps described above.

Note that in the first, second, and third module manufacturing methods described above, before attaching the solder 6 or solder paste 6a to a part of the lead frame 4, plating such as gold plating is applied to the surface of the lead frame 4. By doing so, the external terminal 1a of the electrical component can be reliably soldered to the circuit 2 of the lead frame, and the surface of the lead frame 4 can be accurately prevented from corroding.

In addition, in the first, second, and third module manufacturing methods described above, instead of the solder 6 or the solder paste 6a,
The external terminal 1a of the electrical component may be temporarily or firmly connected to the circuit 2 of the lead frame using a conductive adhesive. That is, solder 6 is applied to a part of lead frame 4.
Alternatively, instead of the solder paste 6a, a conductive adhesive is attached, and the conductive adhesive is preheated to a temperature lower than its melting point for a predetermined period of time to have a weak adhesive force. Temporarily connect the external terminal 1a of the electrical component to the circuit 2 of the lead frame using adhesive force, conductive adhesive,
By heating MJ above its melting point, the external terminal 1 of the electrical component is formed.
A may be firmly connected to the circuit 2 of the lead frame using the conductive adhesive described above.

Furthermore, in the method for manufacturing the second and third modules of No. 11 described above, when the periphery of the electrical component 1 and the lead frame 4 around it is covered with the resin 5, as shown in FIGS.
As shown in , the area around the joint between the external terminal 1a of the electrical component and the lead frame 4 is bonded using a botting method or the like.
After covering with a protective resin 8 having a coefficient of thermal expansion between that of the resin 5 and the lead frame 4, the electric component 1 and its surrounding lead frame 4 are covered with the resin 5, and then the protective resin 8 can be covered with the resin 5. The bonding state between the external terminal la of the electrical component and the lead frame 4 can be strengthened using the resin 8, and the resin 5 is difficult to adhere to directly and air is easily trapped between the external terminal 1a of the electrical component and the lead frame 4. The periphery of the joint between the electrical component 1 and the lead frame 4 can be accurately and airtightly covered with the resin 5 via the protective resin 8, and the difference in thermal expansion coefficient between the electrical component 1 and the lead frame 4 can be reduced by the protective resin 8. This is good because it can be absorbed by the resin 8 and accurately prevent cracks from forming in the resin 5.

It goes without saying that the module and the method for manufacturing the eleventh second and third modules of the present invention can also be used for dual-type and quad-type modules and methods for manufacturing the modules.

[Effects of the Invention] As explained above, according to the module of the present invention, a circuit board for mounting electrical components, a circuit for connecting external terminals of electrical components, and external leads can be formed using a lead frame that is easy to manufacture. . Furthermore, when manufacturing the module, there is no need to connect external leads to the circuit by brazing or the like. Further, the periphery of the electrical component and its surrounding lead frame can be easily covered with resin by a transfer method, an injection molding method, etc., which are conventionally widely used in the same way as resin-sealed semiconductor devices.

Therefore, manufacturing of the module can be greatly simplified and speeded up.

Furthermore, since the circuit for connecting the external terminals of the electrical components is formed using a lead frame made of a metal plate with low resistivity and a relatively wide cross-sectional area, it is possible to easily form a module that can withstand large currents.

Furthermore, since there is a relatively small difference in thermal expansion coefficient between the lead frame and the resin, it is possible to prevent cracks from occurring in the resin that covers the electrical parts and the surrounding lead frame.
A highly reliable module can be formed.

Furthermore, the lead frame is thinner and lighter than a ceramic substrate with a multilayer structure, so it is possible to form a thinner (and lighter) module.

According to the first module manufacturing method of the present invention, after cutting and removing a part of the lead frame, excessive thermal stress remains accumulated between the electrical components and the lead frame, and the electrical The bonding state between the external terminal of the component and the lead frame will not become unstable. Additionally, if the module being manufactured is subjected to thermal history after cutting and removing part of the lead frame, excessive thermal stress may accumulate between the electrical components and the lead frame, causing the external terminals of the electrical components to A highly reliable module can be formed without unstable bonding with the lead frame or damage to electrical components.

According to the second module manufacturing method of the present invention, excessive thermal stress is generated between the electrical component and the lead frame when the external terminal of the electrical component is temporarily connected or connected to the circuit of the lead frame. Accumulation will not cause the bond between the external terminal of the electrical component and the lead frame to become unstable, or the electrical component will be destroyed. Additionally, if the module being manufactured is subjected to thermal history after the external terminals of the electrical components are connected to the circuits of the lead frame, excessive thermal stress may accumulate between the electrical components and the lead frame, causing the electrical components to A highly reliable module can be formed without the bonding state between the external terminal and the lead frame becoming unstable or the electrical components being destroyed.

Furthermore, even after a part of the lead frame is cut and removed, the lead frame remains connected and supported by the electrical components, preventing it from separating into multiple lead frame pieces, making it easy to use during module manufacturing. Lead frames can be handled easily.

According to the third module manufacturing method of the present invention, when the external terminal of the electrical component is connected to the circuit of the lead frame,
This prevents excessive thermal stress from accumulating between the electrical component and the lead frame, resulting in unstable bonding between the external terminal of the electrical component and the lead frame, and from destroying the electrical component. In addition, if the module being manufactured is subjected to thermal history after the above connections are made, excessive thermal stress may accumulate between the electrical components and the lead frame, resulting in poor bonding between the external terminals of the electrical components and the lead frame. It is possible to form highly reliable modules without causing instability or destruction of electrical components.

Further, according to the second and third module manufacturing methods of the present invention, excessive thermal stress is not applied to the electrical components from the lead frame during module manufacturing, so that the electrical components used for forming the module are not susceptible to fragile electrical components. Electrical components with increased density can be used.

[Brief explanation of drawings]

FIGS. 1(a) and (b) are a partially broken pressure surface view and a side view of the resin-sealed module of the present invention, and FIG. 2 is a manufacturing process diagram of the first method of manufacturing the resin-sealed module of the present invention. , FIG. 3 is a manufacturing process diagram of the second resin-sealed module manufacturing method of the present invention, FIG. 4 is a manufacturing process diagram of the third resin-sealed module manufacturing method of the present invention, and FIG. ), (b) and Figure 6 (
a). (b) and FIG. 7(a), (b) and FIG. 8(a). (b), FIG. 9(a), (b), and FIG. 1O(a). (b) and FIGS. 11(a) and 11(b) are respectively a front view and a side view showing the manufacturing process of a resin-sealed module of the present invention using the method of manufacturing a resin-sealed module of the present invention. It is the AA sectional view. 1...Electrical component, 1a...External terminal, 2...Circuit, 3...External lead, 4.40...Lead frame, 5...Resin, 6...Solder, 6a...Solder paste. Patent applicant Shinko Electric Industry Co., Ltd.

Claims (8)

[Claims] 1. The electrical component is mounted on a lead frame consisting of a circuit that connects the external terminal of the electrical component and an external lead continuous to the circuit, and the external terminal of the electrical component is soldered to the circuit of the lead frame, and the electrical component is soldered to the circuit of the lead frame. A resin-sealed module in which the periphery of the lead frame and the surrounding lead frame are covered with resin, and the external leads of the lead frame are made to protrude outside the resin. 2. 2. The resin-sealed module according to claim 1, wherein the external terminals of the electrical components are connected to the circuit of the lead frame using a conductive adhesive instead of soldering. 3. 3. The resin-sealed module according to claim 1, wherein the lead frame has a surface plated for soldering or corrosion prevention. 4. After adhering solder to a part of a series of continuous lead frames that form a circuit that connects the external terminals of electrical components and external leads continuous to the circuits, the electrical components are mounted on the lead frame and the electrical components are connected. The external terminals of the component are soldered to the circuit of the lead frame using the solder, and then a part of the lead frame is cut and removed to give the lead frame flexibility in deformation, and then the electrical component is soldered. and the surrounding areas of the lead frame are covered with resin, and the periphery of the external leads of the lead frame protrudes outside the resin, and a part of the lead frame that protrudes outside the resin is cut and removed. A method for manufacturing a resin-sealed module, characterized in that a plurality of external leads of a frame are separated and independent. 5. After applying solder paste to a part of a series of continuous lead frames that form a circuit connecting external terminals of electrical components and external leads continuous to the circuit, the electrical components are mounted on the lead frame, and the above-mentioned By preheating the solder paste to a temperature lower than its melting point to give the solder paste a weak adhesive force, the external terminal of the electrical component is temporarily connected to the circuit of the lead frame using the solder paste with the weak adhesive force. Then, after cutting and removing a part of the lead frame to give the lead frame flexibility in deformation, the external terminals of the electrical components are soldered to the circuit of the lead frame using the solder paste. Then, the electrical component and the surrounding area of the lead frame are covered with a resin, and the area around the external leads of the lead frame protrudes outside the resin, and the part of the lead frame that protrudes outside the resin is covered with resin. A method of manufacturing a resin-sealed module, which comprises cutting and removing the plurality of external leads of the lead frame to separate and make them independent. 6. A lead frame that forms a circuit that connects external terminals of electrical components and external leads that are continuous with the circuit, and that has a degree of freedom in deformation by cutting and removing a portion of the lead frame and dividing it into multiple lead frame pieces. After attaching solder to a part of the lead frame, an electrical component is mounted on the lead frame, and the external terminal of the electrical component is soldered to the circuit of the lead frame using the solder. The periphery of the lead frame and its surroundings are covered with resin, and the periphery of the external leads of the lead frame protrudes outside the resin, and the part of the lead frame that protrudes outside the resin is cut and removed. A method for manufacturing a resin-sealed module, characterized in that a plurality of external leads of a frame are separated and independent. 7. 7. The method of manufacturing a resin-sealed module according to claim 4, wherein a conductive adhesive is used in place of the solder or solder paste. 8. Claim 4, 5, 6, or 7, wherein the surface of the lead frame is plated for soldering or corrosion prevention before adhering solder, solder paste, or conductive adhesive to a part of the lead frame. A method for manufacturing a resin-sealed module.