JPH02131547U - - Google Patents
Info
- Publication number
- JPH02131547U JPH02131547U JP3698589U JP3698589U JPH02131547U JP H02131547 U JPH02131547 U JP H02131547U JP 3698589 U JP3698589 U JP 3698589U JP 3698589 U JP3698589 U JP 3698589U JP H02131547 U JPH02131547 U JP H02131547U
- Authority
- JP
- Japan
- Prior art keywords
- gas
- sputtering
- pipes
- target
- space
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000004544 sputter deposition Methods 0.000 claims description 9
- 239000000758 substrate Substances 0.000 claims description 2
- 238000010586 diagram Methods 0.000 description 4
- 239000010408 film Substances 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
Landscapes
- Physical Vapour Deposition (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3698589U JPH02131547U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-29 | 1989-03-29 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP3698589U JPH02131547U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-29 | 1989-03-29 |
Publications (1)
Publication Number | Publication Date |
---|---|
JPH02131547U true JPH02131547U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1990-11-01 |
Family
ID=31543696
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP3698589U Pending JPH02131547U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1989-03-29 | 1989-03-29 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPH02131547U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10212575A (ja) * | 1997-01-29 | 1998-08-11 | Sony Corp | スパッタリング装置 |
JP2001107228A (ja) * | 1999-10-07 | 2001-04-17 | Anelva Corp | 反応性スパッタリング装置 |
JP2007039712A (ja) * | 2005-08-01 | 2007-02-15 | Ulvac Japan Ltd | スパッタリング装置、成膜方法 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6137964A (ja) * | 1984-07-30 | 1986-02-22 | Matsushita Electric Ind Co Ltd | スパツタリング装置 |
JPS6396270A (ja) * | 1986-10-13 | 1988-04-27 | Mitsubishi Electric Corp | スパツタリング装置 |
JPS644473A (en) * | 1987-06-26 | 1989-01-09 | Mitsubishi Electric Corp | Sputtering device |
-
1989
- 1989-03-29 JP JP3698589U patent/JPH02131547U/ja active Pending
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS6137964A (ja) * | 1984-07-30 | 1986-02-22 | Matsushita Electric Ind Co Ltd | スパツタリング装置 |
JPS6396270A (ja) * | 1986-10-13 | 1988-04-27 | Mitsubishi Electric Corp | スパツタリング装置 |
JPS644473A (en) * | 1987-06-26 | 1989-01-09 | Mitsubishi Electric Corp | Sputtering device |
Cited By (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH10212575A (ja) * | 1997-01-29 | 1998-08-11 | Sony Corp | スパッタリング装置 |
JP2001107228A (ja) * | 1999-10-07 | 2001-04-17 | Anelva Corp | 反応性スパッタリング装置 |
JP2007039712A (ja) * | 2005-08-01 | 2007-02-15 | Ulvac Japan Ltd | スパッタリング装置、成膜方法 |