JPH0543094Y2 - - Google Patents
Info
- Publication number
- JPH0543094Y2 JPH0543094Y2 JP4883987U JP4883987U JPH0543094Y2 JP H0543094 Y2 JPH0543094 Y2 JP H0543094Y2 JP 4883987 U JP4883987 U JP 4883987U JP 4883987 U JP4883987 U JP 4883987U JP H0543094 Y2 JPH0543094 Y2 JP H0543094Y2
- Authority
- JP
- Japan
- Prior art keywords
- gas
- gas blowing
- substrate
- plasma discharge
- discharge field
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000007664 blowing Methods 0.000 claims description 35
- 239000000758 substrate Substances 0.000 claims description 27
- 238000005268 plasma chemical vapour deposition Methods 0.000 claims description 9
- 230000035699 permeability Effects 0.000 claims description 4
- 239000010408 film Substances 0.000 description 15
- 230000015572 biosynthetic process Effects 0.000 description 4
- 238000005755 formation reaction Methods 0.000 description 4
- 239000010409 thin film Substances 0.000 description 3
- 238000009792 diffusion process Methods 0.000 description 2
- 238000005530 etching Methods 0.000 description 2
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 description 1
- 229910021417 amorphous silicon Inorganic materials 0.000 description 1
- 230000005284 excitation Effects 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000003780 insertion Methods 0.000 description 1
- 230000037431 insertion Effects 0.000 description 1
- 238000004519 manufacturing process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 229910052814 silicon oxide Inorganic materials 0.000 description 1
- 125000006850 spacer group Chemical group 0.000 description 1
Landscapes
- ing And Chemical Polishing (AREA)
- Chemical Vapour Deposition (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4883987U JPH0543094Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-03-31 | 1987-03-31 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP4883987U JPH0543094Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-03-31 | 1987-03-31 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS63175158U JPS63175158U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-11-14 |
| JPH0543094Y2 true JPH0543094Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1993-10-29 |
Family
ID=30870746
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP4883987U Expired - Lifetime JPH0543094Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1987-03-31 | 1987-03-31 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0543094Y2 (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) |
Families Citing this family (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4107596B2 (ja) * | 1996-10-02 | 2008-06-25 | 東京エレクトロン株式会社 | プラズマ処理装置 |
| JP5660862B2 (ja) * | 2010-11-22 | 2015-01-28 | 小島プレス工業株式会社 | 樹脂基材の表面被膜形成装置 |
-
1987
- 1987-03-31 JP JP4883987U patent/JPH0543094Y2/ja not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPS63175158U (GUID-C5D7CC26-194C-43D0-91A1-9AE8C70A9BFF.html) | 1988-11-14 |