JPH0213141Y2 - - Google Patents

Info

Publication number
JPH0213141Y2
JPH0213141Y2 JP14781784U JP14781784U JPH0213141Y2 JP H0213141 Y2 JPH0213141 Y2 JP H0213141Y2 JP 14781784 U JP14781784 U JP 14781784U JP 14781784 U JP14781784 U JP 14781784U JP H0213141 Y2 JPH0213141 Y2 JP H0213141Y2
Authority
JP
Japan
Prior art keywords
resin
runner
stopper
mold
permanent magnet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP14781784U
Other languages
English (en)
Japanese (ja)
Other versions
JPS6162009U (US20110009641A1-20110113-C00185.png
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Priority to JP14781784U priority Critical patent/JPH0213141Y2/ja
Publication of JPS6162009U publication Critical patent/JPS6162009U/ja
Application granted granted Critical
Publication of JPH0213141Y2 publication Critical patent/JPH0213141Y2/ja
Expired legal-status Critical Current

Links

Landscapes

  • Injection Moulding Of Plastics Or The Like (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Moulds For Moulding Plastics Or The Like (AREA)
JP14781784U 1984-09-29 1984-09-29 Expired JPH0213141Y2 (US20110009641A1-20110113-C00185.png)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP14781784U JPH0213141Y2 (US20110009641A1-20110113-C00185.png) 1984-09-29 1984-09-29

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP14781784U JPH0213141Y2 (US20110009641A1-20110113-C00185.png) 1984-09-29 1984-09-29

Publications (2)

Publication Number Publication Date
JPS6162009U JPS6162009U (US20110009641A1-20110113-C00185.png) 1986-04-26
JPH0213141Y2 true JPH0213141Y2 (US20110009641A1-20110113-C00185.png) 1990-04-12

Family

ID=30706042

Family Applications (1)

Application Number Title Priority Date Filing Date
JP14781784U Expired JPH0213141Y2 (US20110009641A1-20110113-C00185.png) 1984-09-29 1984-09-29

Country Status (1)

Country Link
JP (1) JPH0213141Y2 (US20110009641A1-20110113-C00185.png)

Also Published As

Publication number Publication date
JPS6162009U (US20110009641A1-20110113-C00185.png) 1986-04-26

Similar Documents

Publication Publication Date Title
US5204122A (en) Mold for use in resin encapsulation molding
JP3411448B2 (ja) 半導体素子の樹脂封止金型及び半導体装置の製造方法
JPH0213141Y2 (US20110009641A1-20110113-C00185.png)
JPH0317579B2 (US20110009641A1-20110113-C00185.png)
JPH11126787A (ja) 電子部品の樹脂封止成形方法及び金型
JP2581113B2 (ja) 半導体装置のモールド方法および装置
JPH056094Y2 (US20110009641A1-20110113-C00185.png)
JPH08288326A (ja) 電子部品の樹脂封止成形方法及び金型
JP2002355851A (ja) 複合成形品の射出成形方法および射出成形用金型
JPH0314332Y2 (US20110009641A1-20110113-C00185.png)
JP2666630B2 (ja) 半導体装置の製造方法
JPH043770Y2 (US20110009641A1-20110113-C00185.png)
JPS6154633A (ja) 半導体樹脂封止用金型
JPS63228631A (ja) 半導体素子を樹脂封止する金型装置
JPH06177192A (ja) 樹脂モールド装置
JPH058106Y2 (US20110009641A1-20110113-C00185.png)
JP2575718B2 (ja) 半導体素子の樹脂封止成形方法とその成形用金型装置及びその方法に用いられるリ−ドフレ−ム
JPH03243310A (ja) 金型面のクリーニング方法及び樹脂皮膜形成方法と、この方法に用いられる固化樹脂の剥離用部材、並びに、連続自動樹脂成形方法
JP2502387B2 (ja) 半導体素子の樹脂封止方法及び樹脂封止金型
JPH01216815A (ja) 被封止部品のトランスファ樹脂封止成形方法とこれに用いられる樹脂封止成形用金型装置及びフィルムキャリア
JPH082859Y2 (ja) カセットハーフ
JPH06181231A (ja) 電子部品の樹脂封止成形方法及び金型
JPH0644105Y2 (ja) 樹脂モ−ルド型半導体装置のリ−ドフレ−ム
JPH0462525B2 (US20110009641A1-20110113-C00185.png)
JPH07137082A (ja) 樹脂成形用金型