JPH02129729U - - Google Patents
Info
- Publication number
- JPH02129729U JPH02129729U JP3768789U JP3768789U JPH02129729U JP H02129729 U JPH02129729 U JP H02129729U JP 3768789 U JP3768789 U JP 3768789U JP 3768789 U JP3768789 U JP 3768789U JP H02129729 U JPH02129729 U JP H02129729U
- Authority
- JP
- Japan
- Prior art keywords
- frame body
- bonding
- wiring board
- fixed
- frame
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000000853 adhesive Substances 0.000 claims 1
- 230000001070 adhesive effect Effects 0.000 claims 1
- 239000002184 metal Substances 0.000 claims 1
- 238000004519 manufacturing process Methods 0.000 description 1
Description
第１図は本考案に係るボンデイング用固定装置
の一実施例を示す一部断面を含む側面図、第２図
は第１図のボンデイング用固定装置の平面図、第
３図乃至第５図はボンデイング用固定装置による
フレーム構体の押圧状態を示す一部断面を含む側
面図である。第６図乃至第８図はハイブツリツド
ＩＣの製造工程を説明するためのリードフレーム
を示す各斜視図である。第９図はボンデイング用
固定装置の従来例を示す斜視図、第１０図は第９
図の側面図、第１１図は第９図の平面図である。
１……リードフレーム、２……ランド部、３…
…配線基板、４……フレーム構体、８……ステー
ジ、１２……配線基板の周辺近傍部位（タイバー
）、１５……枠体、１７……押えピン、１８……
バネ材。
FIG. 1 is a side view including a partial cross section showing an embodiment of the bonding fixing device according to the present invention, FIG. 2 is a plan view of the bonding fixing device shown in FIG. 1, and FIGS. 3 to 5 are FIG. 3 is a side view including a partial cross section showing a state in which the frame structure is pressed by the bonding fixing device. FIGS. 6 to 8 are perspective views showing a lead frame for explaining the manufacturing process of a hybrid IC. FIG. 9 is a perspective view showing a conventional example of a bonding fixing device, and FIG.
FIG. 11 is a side view of FIG. 9, and FIG. 11 is a plan view of FIG. 1...Lead frame, 2...Land part, 3...
... Wiring board, 4... Frame structure, 8... Stage, 12... Portion near the periphery of wiring board (tie bar), 15... Frame, 17... Holding pin, 18...
Spring material.
Claims (1)
介してボンデイング面積の大きい絶縁性配線基板
が加熱・固着されたフレーム構体をステージ上で
押圧固定するものにおいて、 上記ステージ上方に上下動可能に配設された枠
体に、フレーム構体の配線基板の周辺近傍部位に
フレーム構体の変形に応じて所定の方向に向けて
順次当接して押圧する多数の押えピンをバネ材を
介して退入可能に突設したことを特徴とするボン
デイング用固定装置。[Scope of Claim for Utility Model Registration] A frame structure in which an insulating wiring board with a large bonding area is heated and fixed on the land portion of a metal lead frame via an adhesive is pressed and fixed on a stage, A large number of presser pins are attached to the frame body, which is arranged to be vertically movable upwards, and which sequentially abuts and presses parts near the wiring board of the frame body in a predetermined direction according to the deformation of the frame body. A fixing device for bonding, characterized in that it is protruded so as to be retractable through the bonding device.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3768789U JPH02129729U (en) | 1989-03-30 | 1989-03-30 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP3768789U JPH02129729U (en) | 1989-03-30 | 1989-03-30 |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02129729U true JPH02129729U (en) | 1990-10-25 |
Family
ID=31545027
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP3768789U Pending JPH02129729U (en) | 1989-03-30 | 1989-03-30 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02129729U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0520326U (en) * | 1991-05-14 | 1993-03-12 | 金星エレクトロン株式会社 | Inner lead clamp device for lead frame |
-
1989
- 1989-03-30 JP JP3768789U patent/JPH02129729U/ja active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0520326U (en) * | 1991-05-14 | 1993-03-12 | 金星エレクトロン株式会社 | Inner lead clamp device for lead frame |